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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 チップトン Aichi//Manufacturing and processing contract
  5. 5 null/null
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Polishing machine Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  3. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  4. 4 Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing machine Product List

646～660 item / All 812 items

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Self-Dresser

Self-Dresser

With stable operation, we eliminated the risks of pressure fluctuations in the robotic welding gun and poor robot teaching.

The "Self-Dresser" is a product that can move to the cap tip of a robotic welding gun and perform polishing using a self-propelled drive system. It allows for the selection of pressing force and polishing rotation speed, enabling stable operation. The basic operation involves the dresser's cutter moving to perform chip polishing when the electrode of the robotic gun stops at the polishing position. 【Features】 ■ Achieves high performance ■ Adopts a new drive system ■ Provides electrode polishing utilizing a compact design and high thrust ■ Moves to the cap tip of the robotic welding gun and polishes using a self-propelled drive system ■ Stable operation *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Musashino Electronics Co., Ltd. General Catalog

Musashino Electronics Co., Ltd. General Catalog

High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.

This catalog features products handled by Musashino Electronics Co., Ltd., such as "ultra-precision grinding machines" and "experimental precision scribers." Our grinding machines possess high flatness accuracy on the rotating reference plate due to their structural characteristics, guaranteeing flatness of 5μm or less. In addition to a diverse range of grinding machines, we also introduce various "automatic grinding (sample holding) units" and "flatness correction tools" that respond to the diversifying applications. [Featured Products] ■ Ultra-precision grinding machines ■ Automatic grinding (sample holding) units ■ Flatness correction tools and various auxiliary devices ■ Various sample holders ■ Grinding discs *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-200"

Precision Grinding Device "MA-200"

There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-150"

Precision Grinding Device "MA-150"

Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • CMP Equipment
  • Other processing machines

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Large Sample Polishing Device 'MA-600e RECT'

Large Sample Polishing Device 'MA-600e RECT'

From Φ600mm circular samples to polishing large panels.

The "MA-600e RECT" is ideal for surface polishing of large panel-type samples (such as glass or sapphire). The flexible pad of the upper oscillation unit allows for uniform polishing of the sample surface. 【Features】 ● Optimal for polishing large diameter samples By securing the sample on a Φ600mm stage, it is possible to polish the entire surface of large diameter samples. The sample is fixed by adhering it to a Φ600mm SUS plate with thermal wax and vacuum chucking the plate. ● Complex polishing possible with program settings The rotation speed and pressure of the spindle and pressure axis, as well as the oscillation width, can be set. ● Realization of safe polishing operations Emergency stop switches, leakage breakers, and interlock covers ensure safe and secure polishing operations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Grinding process

Grinding process

We have various grinding processing machines! The spline plug gauge can accommodate OPD accuracy of ±0.002.

The Brooch Grinding Industry has various grinding machines, including six NC molding grinding machines, as well as profile, flat, and cylindrical grinders. In particular, spline processing using NC molding grinding machines achieves an OPD accuracy of ±0.002mm. Processed products, including spline plug gauges, have received high praise from many users for their balance of quality, delivery time, and price. 【Features】 ■ Ultra-high precision spline processing with six NC molding grinding machines ■ ODP accuracy can be supported up to ±0.002mm ■ Capable of various processing including mold components *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines

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[Case Study of Exterior Graphic Film Introduction] Kita-Osaka Kyuko Railway Co., Ltd.

[Case Study of Exterior Graphic Film Introduction] Kita-Osaka Kyuko Railway Co., Ltd.

Case study of achieving non-use of "coating" *Case study presentation available

Our company handles a variety of wrapping products, including vehicle wrapping, vending machines, signs and billboards, interior decorations, and road surface displays. We would like to introduce a case study of 'Kita-Osaka Kyuko Railway Co., Ltd.' which has implemented our exterior graphic film. Kita-Osaka Kyuko Railway Co., Ltd. was exploring alternative methods due to the issues of increased weight from traditional painting, environmental considerations, and maintenance costs. By adopting our product, they have achieved the non-use of "painting." *In the materials, we introduce the background leading to the adoption, the solutions, and the effects. Please feel free to download it from "PDF Download."

  • Other safety and hygiene products

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Certified as "Toyota Manufacturing Brand" for the 2016 fiscal year! 'Small Diameter Hole Grinding Machine'

Certified as "Toyota Manufacturing Brand" for the 2016 fiscal year! 'Small Diameter Hole Grinding Machine'

Easy setup and operation! A compact and low-cost small diameter hole polishing machine!

The "HDGM-A2-D" is a small diameter hole grinding machine that achieves high performance and compactness with a German-made high-frequency spindle capable of up to 60,000 RPM. It enables the processing of fine holes in high-hardness materials, which was previously done by wire cutting, and focuses on internal diameter grinding of ultra-hard and other high-hardness materials, making setup work easy. This product has been certified as part of the "Toyota Monozukuri Brand" for the fiscal year 2016. 【Features】 ■ Easy setup work ■ Compact and low-cost ■ Equipped with a German-made high-frequency spindle capable of up to 60,000 RPM ■ High performance ■ Capable of processing fine holes in high-hardness materials that were previously done by wire cutting *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other machine elements

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Universal Belt Grinder "Belken"

Universal Belt Grinder "Belken"

Capable of handling various grinding tasks! It produces minimal dust dispersion and provides a quiet working environment.

The "Belken" is a versatile belt grinding machine that provides a soft touch during grinding operations, generates minimal heat, ensuring stable quality and reducing grinding effort. It allows for heavy grinding by directly driving a large-diameter grinding wheel, and it also creates a quiet working environment with minimal dust dispersion. Additionally, it can accommodate various grinding tasks by using not only abrasive cloth belts but also flap wheels and brush wheels. 【Features】 ■ Soft touch during grinding operations ■ Stable quality due to minimal heat generation ■ Reduction of grinding effort ■ Capable of heavy grinding by directly driving a large-diameter grinding wheel *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Universal Surface Finishing Centerless Grinding Machine 'OD-2'

Universal Surface Finishing Centerless Grinding Machine 'OD-2'

Suitable for a wide range of applications, including deburring and cleaning! Available in belt and wheel types.

The "OD-2" is a machine capable of grinding and polishing cylindrical workpieces. By using abrasive cloth belts, non-woven abrasive wheels, and elastic grinding stones, it can perform polishing on cylindrical workpieces with a diameter of up to 50mm. In particular, the adjustment mechanism of this product employs a unique floating mechanism using springs, allowing for easy finishing of tapered workpieces. 【Features】 ■ Capable of polishing cylindrical workpieces with a diameter of up to 50mm ■ Employs a unique floating mechanism using springs ■ Easily finishes tapered workpieces *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Fully Automatic 4-Axis Oscillating Polishing Machine 'MDS-604SSC'

Fully Automatic 4-Axis Oscillating Polishing Machine 'MDS-604SSC'

Fully automatic 4-axis oscillating grinding machine suitable for multi-purpose grinding of printed circuit boards with a thickness of 0.084 to 3.2 mm.

The "MDS-604SSC" is a fully automatic 4-axis oscillating polishing machine for printed circuit boards that achieves high performance at a low price with a control panel. The base frame has been miniaturized, and thorough reinforcement through CAD design has efficiently improved overall strength. 【Features】 ■ Space-saving concentrated design ■ Re-evaluation of mechanical component parts to achieve low cost ■ Mechanical strength (vibration resistance) is improved by 150% compared to our conventional models ■ The spindle follows the proven conventional type, ensuring outstanding reliability ■ The spindle bearing uses large-diameter grease shield bearings, achieving maintenance-free operation and long lifespan *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Multi-layer press stainless steel plate repair polishing machine 'MNW-710-SUS'

Multi-layer press stainless steel plate repair polishing machine 'MNW-710-SUS'

Achieve space-saving! Automatic reciprocating polishing machine specialized for the repair of multi-layer pressed stainless steel plates.

The "MNW-710-SUS" is a multi-layer press stainless steel plate repair polishing machine capable of automatic reciprocating polishing. By simply setting the reciprocating function initially, all subsequent operations can be controlled automatically. This significantly improves the efficiency of repair work. Additionally, due to the wet polishing method, there is minimal wear on the polishing material, and there is no adhesion of polishing debris to the product or external scattering. 【Features】 ■ Capable of automatic reciprocating polishing ■ Significantly reduces working time ■ Equipped with a touch panel on the main unit, achieving space-saving ■ Allows for repair polishing according to the unevenness and height variations of the substrate ■ Minimal wear on polishing material, with no adhesion of polishing debris to the product or external scattering *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Precision Surface Grinding Machine 'MNW-610･C2/MNW-710･C2'

Precision Surface Grinding Machine 'MNW-610･C2/MNW-710･C2'

Emphasizing operability, even more compact. Integration tailored to factory line equipment is possible!

The "MNW-610･C2/MNW-710･C2" is a precision surface grinding machine capable of a consistent line configuration from heavy grinding to finishing. Due to its machine layout, it can be integrated to match the line equipment of your factory. It allows for repair grinding according to the unevenness and waviness of the substrate, making it suitable for leveling thickness variations after plating and for polishing build-up resin coatings. 【Features】 ■ Can be integrated to match the line equipment of the factory ■ Allows for repair grinding according to the unevenness and waviness of the substrate ■ Suitable for leveling thickness variations after plating and for polishing build-up resin coatings ■ Minimal wear of grinding materials, preventing adhesion of grinding debris to products and external scattering ■ Replacement of consumable parts can be done quickly by your engineers *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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TM type rotary barrel polishing machine

TM type rotary barrel polishing machine

A simple structure that anyone can handle! A rotary barrel polishing machine that can polish various materials and shapes.

The TM-type rotary barrel polishing machine has a simple structure, is inexpensive, and offers high versatility. It can polish any shape made of metal, plastic, wood, etc., from deburring, edge removal, scale removal, rough polishing to precision gloss finishing. 【Features】 ■ Easy for anyone to operate, suitable for cost reduction and labor saving ■ The quality of the polishing process is uniform, with no defective products ■ Can polish any shape made of metal, plastic, wood, etc., from deburring, edge removal, scale removal, rough polishing to precision gloss finishing *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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TM System Rotating Barrel Polishing Machine Series

TM System Rotating Barrel Polishing Machine Series

Ideal for various parts with a wide variety and small quantities of polishing! The combination of the drum and the main unit can be adjusted according to the application.

The "TM System Rotary Barrel Polishing Machine Series" allows for various combinations of drums and the main unit according to the application. For polishing processes that require avoiding scratches due to collisions between large parts, it is possible to polish one part per barrel. The dual and triple barrel systems can polish multiple varieties simultaneously. It is ideal for deburring and mirror finishing of pressed parts, automatic lathe parts, plastic parts, watch and camera components, as well as decorative items made of precious stones, gold, and silver. 【Features】 ■ Combinations of drums and the main unit can be tailored to the application ■ Drums can be easily transported ■ The main unit is equipped with easy-to-move casters ■ Operates on standard household 100V power ■ Suitable for polishing a variety of parts in small quantities *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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