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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 チップトン Aichi//Manufacturing and processing contract
  5. 5 null/null

Polishing machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  3. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  4. 4 Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing machine Product List

736~750 item / All 812 items

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Vibratory polishing machine

Widely usable for deburring, edge removal, chamfering, polishing finish, scale removal, etc., with various materials.

【Features】 1. Achieves a beautiful finish in a short time. 2. Economical. 3. Easy to handle. 4. Good work control.

  • Wafer processing/polishing equipment

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[English Market Research Report] Global Market for Semiconductor Wafer Polishing and Grinding Equipment

"Free samples" are currently being offered! Please check the application method from the [PDF download] button, or apply directly from the related links.

The semiconductor wafer polishing and grinding equipment market is expected to grow to $442.01 million from 2023 to 2028, with a CAGR of 4.06% during the forecast period. This report provides a comprehensive analysis of the semiconductor wafer polishing and grinding equipment market, including market size and forecasts, trends, growth drivers, challenges, and vendor analysis covering approximately 25 vendors. It offers the latest analysis of the current market scenario, recent trends and drivers, and the overall market environment. The market is driven by the miniaturization of semiconductor components, increased investment in new manufacturing plants, and incentives or discounts for long-term customers from end-users.

  • Other services

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Belt-type flat grinding machine

Accelerating flat super finishing processing! Also for cutting.

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We are a manufacturer that designs and manufactures according to customer requests, based on our technology, experience, and many years of achievements. Our belt polishing machine was developed with the aim of reducing polishing time, which has been a challenge with conventional film-type flat polishing machines. 【Applications】 ◆ Flat polishing of various metal plates ◆ Flat polishing of various resin plates ◆ Flat polishing and trimming of substrates ◆ Flattening of epoxy laminated substrates, etc.

  • Grinding Machine

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BS-type small rail grinding machine

Removal of crimped leaves and rust from the rail head surface! Lightweight and compact electric small grinder.

We offer the "BS-type small rail grinding machine," which can be operated by one person to remove stuck fallen leaves. It features a large-capacity battery [36V 4.0Ah] and is a quiet model with no noise during non-working times. The continuous grinding distance is approximately 200m. Additionally, the use of a special resin brush ensures that the rails are not damaged. 【Features】 ■ Compact and lightweight, allowing one person to load, transport, and operate it ■ Capable of removing fallen leaves and coverings, as well as rust from the rail head ■ Utilizes a special resin brush ■ Reduces dust, vibration, and noise, easing the burden on the operator ■ Considers short-circuit prevention and protection of rail joints *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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White fused alumina particles WA

A wide lineup ranging from an average particle diameter of about 0.3µm (#30000) to 60μm is also suitable for fillers that provide insulation and wear resistance!

"WA" is a white alumina powder composed of α-type corundum crystals with an Al2O3 purity of 96.0% or higher. White fused alumina is chemically inert, heat-resistant, and possesses extremely high insulation properties, as well as hardness second only to silicon carbide. For this reason, it is also used as a filler material for enhancing insulation and wear resistance. Our white fused alumina offers a wide range of products with average particle sizes from approximately 0.3µm (#30000) to 60µm (#240). It is characterized by a sharp particle size distribution and stable particle shape, allowing us to meet our customers' specific needs. [Expected Effects] - Electrical insulation filler (improving insulation for low to high voltage components, etc.) - Wear-resistant filler (enhancing durability of resin components, etc.) - Raw material for friction materials (improving friction properties of brake pads, etc.)

  • WAカタログ.jpg
  • Fine Ceramics

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Introduction to Daiei Barrel's Centrifugal Barrel Polishing

Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.

"Centrifugal barrel polishing" is a polishing method where multiple (four) barrel tanks rotate and revolve at high speeds, applying centrifugal force to the contents. The number of items processed at one time is smaller compared to rotating barrels. There may be significant damage to the products, necessitating countermeasures. Our company owns several machines, including custom-made models. 【Workpieces and Features】 ■ Processing can be done in a short time ■ Generally has 10 to 15 times the polishing power of rotating barrels ■ Compared to rotating barrels, there may be significant damage to the products, requiring countermeasures ■ The number of items processed at one time is smaller compared to rotating barrels ■ Our company owns several machines, including custom-made models *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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[Examples of Precision Polishing] Mirror Finish Treatment for Stirring Machine (Blade) *Case study collection available

Mirror finish equivalent to 1000 grit. It is resistant to corrosion and less likely to attract impurities, resulting in a long-lasting and high-performance mixer.

This is a case study of precision grinding. Buff polishing equivalent to #1000 on a "stirring machine (blade)." Due to its ultra-precision, there are almost no surface irregularities. There is no corrosion or adhesion of impurities, allowing for long-term use. *The image on the left shows a buff polished screw (equivalent to #1000) made of SUS430. This SUS430 screw has been in use for about 10 years, and there is almost no corrosion. *Please refer to the PDF available for download for the case studies.

  • Processing Contract
  • Hand polishing and filing
  • Wafer processing/polishing equipment

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Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

  • Wafer processing/polishing equipment

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Fluid polishing device "elite580"

Complex-shaped flow paths for gas and liquids can be polished, even for flow paths and holes smaller than 1mm!

The "elite580" is a fluid polishing device that enables polishing of fine hole channels in metal 3D printed products to "Ra0.1". It features a fast polishing speed due to the particles of the polishing material hitting the uneven surfaces inside the channels while being carried by a high-speed water flow, making it faster than other physical polishing methods. Additionally, it can accommodate a wide range of materials and complex channels down to ultra-fine holes, and the running costs are low due to the use of inexpensive polishing materials. 【Features】 ■ Uses only "water" and "polishing material" ■ One-way flow and circulation type ■ Faster polishing speed than other physical polishing methods *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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Commitment to quality

Learn about fluid polishing technology through data! Our mirror finish has an ultra-mirror surface with an Ra value of 0.01μm.

At our company, we utilize measurement data for setting target values and quality evaluation as part of our commitment to quality. The generally required mirror finish has a Ra value of 0.1μm, but the mirror finish we achieve has an ultra-mirror surface with a Ra value of 0.01μm. Additionally, to demonstrate the high level of our polishing technology, we conduct data measurements at a trusted third-party public institution. 【Features】 ■ Utilization of measurement data for setting target values and quality evaluation ■ The mirror finish we achieve has an ultra-mirror surface with a Ra value of 0.01μm ■ Data measurements conducted at a trusted third-party public institution *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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Stainless Steel Buffing Machine - Reducing Machine Corrosion for Long-term Stable Operation

By using stainless steel stands and bases, we reduce mechanical corrosion and achieve long-term stable operation.

Our buffing and grinding machines are primarily used in the copper rolling industry. They are useful for removing oxidation scale after annealing and in the finishing process before shipment. ◆ Concerned about rust and corrosion around the machine after long-term use! We have implemented measures to prevent water splashing outside the booth with a cleaning booth structure, including hinged doors and splash prevention covers. Additionally, by using stainless steel for the high-rigidity stand and base, we prevent corrosion due to the surrounding environment, allowing for safe long-term use. First, we conduct polishing tests with samples and design the equipment after confirming the desired conditions. We also have a track record of polishing machines for sheet materials and target plates that utilize this technology, so please feel free to consult us with any concerns you may have. *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

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Drill Bit Sharpening Machine "OSK 97NS"

Equipped with a powerful DC motor controlled by electricity! Strong horsepower and long lifespan.

The "OSK 97NS" is a drill bit sharpening machine that is particularly suitable for grinding the end face top angle and clearance angle of twist drill bits, offering excellent grinding performance. It is easy to operate, allowing for scale adjustment according to the outer diameter of the drill bit and determining the position while rotating. Equipped with a function to adjust the size of the center point, it can effectively respond to materials and rotation speeds. 【Features】 ■ Compact and easy to carry, usable in narrow spaces ■ Uses diamond grinding wheels, achieving precise angles and long lifespan ■ Equipped with a powerful DC motor controlled by electricity, providing strong horsepower and durability ■ Includes a function to adjust the size of the center point, effectively responding to materials and rotation speeds *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Small Manual Sample Grinder "OSK 97UO A108"

A sturdy and beautifully finished ABS resin casing! Capable of grinding and polishing various samples.

The "OSK 97UO A108" is a small manual sample polishing device with a grinding wheel diameter of Φ203mm and a rotation speed of 10 to 1000 rpm. To enhance usability, it features a touch panel for control, allowing for grinding and polishing of various samples. The work area is completely sealed, ensuring that water inside the tray does not leak structurally. 【Features】 ■ By adopting a servo motor, it can maintain high torque even at low speeds. ■ The glass surface touch panel promises high visibility and durability. ■ The water outlet is pull-out type, making it convenient for cleaning after work. ■ The body is made of durable and aesthetically pleasing ABS resin with a beautiful surface finish. ■ Equipped with an emergency stop button. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Tabletop Sample Grinder "OSK 97US ST6"

The removable tray makes cleaning easy and allows for the easy collection of debris that didn't get washed down the drain!

The "OSK 97US ST6" is a large single-disc automatic sample polishing machine with a disk size diameter of Ф250mm (Ф300mm option available). It supports two pressure methods: central pressure and individual pressure. Additionally, it features a self-cleaning function that quickly removes polishing debris adhered to the grinding and polishing chassis. It keeps the surface of the disk clean and dry, effectively preventing contamination in the next grinding and polishing process. 【Features】 ■ Controlled by a 10-inch LCD touch panel for high operability ■ The sample holder of the automatic polishing device accommodates both central and individual pressure ■ To avoid damage to small and delicate samples, individual pressure can be set to a minimum of 5N, while central pressure can be set to a minimum of 20N for grinding and polishing ■ Five types of quantitative supply devices are available as options ■ 36 commonly used programs are pre-set, and customization of programs is also possible *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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