[Press Processing Case] Automatic Embedding Technology for Brazing Filler Metal (Cu) in the Process
Since the filler material is embedded during the pressing process, there is no need for soldering paste application! The amount of copper solder and its quality are stable, and the positioning inside the furnace is flexible, leading to increased efficiency.
This is a technology developed based on consultations with customers who previously applied copper paste for brazing by hand, one by one. By applying this technology, there are the following benefits: 【Benefits】 1) The paste application as a pre-treatment before entering the brazing furnace becomes unnecessary. (Labor cost reduction) 2) Since a precise amount of copper is automatically embedded, the variation in usage between expensive copper products and lots is eliminated. (Reduction in material costs by eliminating inconsistencies and waste) 3) Brazing defects due to excess or insufficient filler material are eliminated. In fact, the customer’s brazing defects caused by this issue, which were nearly 30% before applying this technology, have been almost eradicated with its application. (Stabilization of quality and improvement in yield) 4) Unlike paste, there is no concern about dripping, significantly increasing the freedom of positioning inside the furnace and enhancing brazing efficiency. *For more details, please feel free to contact us.
- Company:光工業
- Price:Other