【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!
At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials!
Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices.
In this document, we present technical materials regarding BGA rework technology.
Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials.
[Features of Underfill]
- Uses a one-component heat-curing epoxy resin
- Can reduce external stress
- Prevents stress concentration on the connection surface of solder balls
- Widely used in mobile devices, including mobile phones
*For more details, please contact us or download the catalog!