Epoxy Resin - Epoxy Molding - Stator Sealing
This is an introduction to "epoxy resin."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Sealing - List of Manufacturers, Suppliers, Companies and Products
Sealing Product List
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Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!
There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal conditions of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is a growing need to improve productivity and quality through actual measurements of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the interior of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.
- Company：Kistler Japan G.K. Head office
- Price：Other
Thermosetting resin transfer molding - coil sealing
This is an introduction to "thermosetting resin (plastic) transfer molding."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Waterproof sealing of substrates: Differences between traditional methods and hot melt molding methods.
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
Numerous examples of achieving value analysis (VA) by replacing the two-component potting process with hot melt molding are published! This is a technical case study document summarizing these examples from a process perspective. ■ Currently, we are offering technical documents and various case studies for free! ■ 【Published Information】 ■ Differences between potting and hot melt molding ■ Process flow implementation - Potting process ■ Process flow implementation - Hot melt molding ■ Application 1: Waterproof sealing of LED fixtures ■ Application 2: Waterproof sealing of micro switches ■ Application 3: Waterproof sealing of temperature sensors
- Company：松本加工
- Price：Other
Epoxy Resin - Epoxy Molding Coil Encapsulation
This is an introduction to "epoxy resin."
Epoxy resin is excellent in heat resistance, water resistance, chemical resistance, and electrical insulation. It allows for free coloring, has low shrinkage during curing, and possesses high strength. It is used as a sealing material and can also be used as paint or adhesive in addition to electrical and mechanical components. Since it does not produce volatile substances during curing, the dimensional accuracy of the molded products is stable, and its electrical performance is also outstanding. Additionally, as a molding material with good fluidity, it can be molded at relatively low pressure. This makes it suitable for complex shapes and insert molding.
- Company：浪華合成
- Price：Other
