Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!
There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal conditions of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is a growing need to improve productivity and quality through actual measurements of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the interior of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.
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One of Kissler's core technologies is the adoption of a piezoelectric crystal in-mold pressure sensor, optimized for semiconductor resin encapsulation, with the following features: - Low viscosity resin compatibility ⇒ Structure that prevents measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility for semiconductor resins ⇒ Mold temperature up to 200°C - Durability ⇒ Semi-permanent - Linearity (measurement error) ⇒ Guarantees less than 1% for the measurement range - Resolution ⇒ 1/1000 MPa The "visualization of the inside of the mold" in semiconductor resin encapsulation is a proposed solution to challenges arising from recent demands for miniaturization and thinness in semiconductor packaging. In particular, the rapid expansion of electric vehicles (EVs) has increased the demand for power semiconductors for automobiles, making the improvement of quality in resin-encapsulated packages, as well as enhancements in production efficiency and inspection costs, significant challenges. In addition to traditional software-based flow analysis, measuring and quantifying the in-mold pressure and temperature within the mold cavity using sensors has been recognized as an effective solution, and its adoption has already begun in actual manufacturing lines.
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◇Homogenization during Mass Production By continuously monitoring the temperature of the mold and cavity in addition to the internal pressure, correlation analysis with defects becomes possible. Example) Temperature rise: As the viscosity of the resin increases, flowability decreases, leading to increased shear stress on the bonding wire, which can cause deformation. This is also directly linked to the cause of short shots (insufficient filling). In this case, the maximum internal pressure decreases, and the curing speed increases. Example) Temperature drop: As the viscosity of the resin decreases, flowability increases, which can lead to burr formation. In this case, the maximum internal pressure increases, and the curing speed decreases. ◇Prevention of Chip Cracks (Monitoring Release Force) By installing a force sensor under the ejector pin, it becomes possible to evaluate release properties, providing a basis for determining maintenance timing. Example) Repeated continuous molding can cause the release agent to oxidize and degrade, increasing the release force, which in turn increases the load on the molded product and can lead to chip cracks. A quartz piezoelectric type can detect instantaneous protruding forces. ◇Visualization of Filling Balance for Multiple Cavities Monitoring the uniformity when there are multiple cavities in the mold. ◇Improvement of R&D By comparing the results of flow analysis with actual measured values, it is possible to reassess the accuracy of flow analysis.
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Kistler Japan is the Japanese subsidiary of Kistler Instrumente AG (Switzerland), which leads the world in piezoelectric crystal technology. For many years, Kistler has made significant investments in product research and development, achieving numerous revolutionary technological advancements and solving various measurement problems ahead of the world. Since its establishment in 1985, Kistler Japan has continued to provide a wide range of products, including piezoelectric sensors, strain sensors, charge amplifiers, and data processing/analysis software, as well as related equipment, technical support, and quality management services to customers in Japan and the Asia-Pacific region, based on its high technical capabilities backed by experience. *For a list of our products and the latest news, please visit our "Special Site." https://premium.ipros.jp/kistler/ *If you have any questions, please feel free to contact us through the "Contact Us" form below.