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Slicing - List of Manufacturers, Suppliers, Companies and Products

Slicing Product List

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Did you know that foam can be sliced to 0.1mm and made thin?

For any processing requests regarding foam and sponge of arbitrary thickness, please leave the slicing processing to our slicing service and material development.

**What is slicing processing?** Slicing processing refers to the process of slicing a material, such as a 2mm thick material, into a thickness of 0.1mm (or any desired thickness) using a cutting tool. **Can foam be processed to 0.1mm?** As long as the cells of the material do not break, slicing processing is possible! We tried to slice it to 0.1mm, but the cells of the material broke, and we were unable to transport it. **Slicing machine** The "NP-120RS" soft material slicer (cutting machine) for rubber, sponge, and foam has a maximum slicing width of 450mm, and its slicing accuracy provides a precise and smooth slicing surface. It is the best machine that anyone can easily use for slicing processing. **Flow of sample production** I want to develop a new material! If you have customer needs but it seems to take time for material proposals, we definitely recommend our product development course. In the case of the product development course: Contact Nippon Machinery  ↓ Free sample production  ↓ Paid sample production  ↓ Contract processing We can accommodate detailed customization as we have domestic in-house production based on customer requests. We always maintain a spirit of challenge and strive to process new soft materials!

  • Other processing machines

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Slice processing using isomet.

We will introduce a slicing process that allows you to keep the created cross-section as it is!

Aites Co., Ltd. performs slicing processing using isomet. When you want to observe the cross-section of all connector pins in multiple rows, the usual procedure is to grind down to the next row... However, by performing slicing processing, it is possible to keep the created cross-section as it is. Additionally, we have examples of slicing processing for connector pins with multiple rows. *For more details, please refer to the PDF materials or feel free to contact us.*

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  • Processing Contract
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Cutting Techniques: Material Cutting and Slicing Processing

【Aluminum Nitride AlN / Alumina Al2O3 compatible】 A new technology that is becoming a global trend, fixed abrasive method!

At Shinko Seisakusho, mass production processing using the fixed abrasive method, which is becoming a global trend, is possible! We manufacture solar silicon wafers using the fixed abrasive method (diamond wire) with two types of materials: single crystal and polycrystalline. Currently, the yield rate for the fixed abrasive method has achieved over 95% on a mass production basis, with more than 4 million silicon wafers produced per month. 【Main Supported Materials】 Aluminum Nitride (AlN) / Alumina (Al2O3) / Sapphire / Silicon Carbide (SiC) / Copper (Cu) / Molybdenum (Mo) / Tungsten (W) / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate (LiNbO3) / Lithium Tantalate (LiTaO3) / Barium Titanate (BaTiO3) / Zirconia (ZrO2) / Silicon Nitride (Si3N4) / Cemented Carbide (SK Material) / Ceramic Matrix Composites (CMC) *For more details, please download the PDF catalog or feel free to contact us.

  • Processing Contract

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What is slice processing?

If you have any issues with cutting techniques for various materials, please feel free to contact us!

At Shinco Manufacturing Co., Ltd., we perform "slicing processing." The cutting technology that started with a wire diameter of 120μm and diamond sizes of 15-25μm (total cutting allowance of 150μm) has now been reduced to a wire diameter of φ60μm and diamond sizes of 6-12μm (total cutting allowance of 75μm), which is half of what it was at that time. Currently, we are receiving positive feedback from customers both domestically and internationally, and we are expanding our fixed abrasive cutting technology, developed through silicon wafer processing for solar cells, into new markets. If you have any issues with cutting technology for various materials, we offer both free abrasive and fixed abrasive methods, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

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  • Processing Contract
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