Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
61～90 item / All 123 items
High thermal conductivity solder materials for horizontal implementations with high heat dissipation effects.
This is a notice from Senju Metal Industry Co., Ltd. regarding "solder materials with spacers."
High thermal conductivity solder materials for horizontal implementations with high heat dissipation effects.
This is an announcement from Senju Metal Industry Co., Ltd. regarding the "HQS Ni Ball Applied Solder Preform."
Halogen-free products focusing on workability.
Reduce halogenated substances contained in conventional flux to the limit, resulting in environmentally friendly lead-free solder.
The scattered flux residue does not break or peel off.
Lead-free solder that significantly improves the issues of poor conductivity around the camera lens of mobile phones and within electronic components.
![[JIS A Grade Type] Leaded solder](https://image.mono.ipros.com/public/product/image/ff2/306759018/IPROS_10740593365151988000.jpg?w=280&h=280)
The heat resistance durability of the flux has improved, demonstrating excellent cleanliness.
Solder with excellent insulation properties and high reliability.
![[Example of analysis using EBSD] High melting point solder](https://image.mono.ipros.com/public/product/image/a89/2000533387/IPROS76289936861552503680.png?w=280&h=280)
Observing crystal structures with EBSD! Data can be obtained for each metal.
We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). With the EBSD method, it is possible to infer the grain distribution and residual stress. Additionally, there are analyses that can be performed simultaneously for metals with different crystal structures, allowing for data acquisition for each metal. 【Features】 ■ Ability to infer grain distribution and residual stress ■ Simultaneous analysis for metals with different crystal structures is possible, enabling data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.
Lead-free and environmentally friendly.
This is an announcement from Nihongenma Co., Ltd. regarding "wire and rod solder."
Significantly reduce the scattering of flex and solder balls!
"GST" is a solder with a high level of both "wetting properties" and "splash suppression effects," suitable for laser applications (JIS AA type Sn-3.0Ag-0.5Cu). Additionally, we offer the "IJIRAQ" solder with flux, specifically designed for the RZ method, which significantly reduces flux residue and drastically decreases the frequency of nozzle cleaning. Please feel free to contact us if you have any inquiries. 【Basic Characteristics】 ■ Solder Composition: Sn-3.0Ag-0.5Cu ■ Melting Point (°C): 217–219 ■ Halide Content (wt%): 0.07±0.03 *For more details, please download the PDF or contact us.
Used as a substitute for solder paste!!
Improving the shortcomings of solder paste! Features: 1. Can be used instead of solder paste. 2. No printing required (avoids printing defects). 3. Uniform thickness.
Products and services that gain trust and satisfaction! We will provide better quality and faster delivery!
Our company develops a manufacturing business that brings together advanced technology and equipment to meet all customer needs, from small-lot deliveries of various products to prototypes. In order to establish a supply system that comprehensively responds to increasingly diverse and sophisticated needs, we are further expanding our trading company functions. Our components communicate the know-how we have cultivated in the field of EMS (Electric Manufacturing Service) and the functions of a trading company, creating high added value. We propose and provide products and services through the best matching for our customers. 【Business Overview】 ■ Comprehensive sales of electronic components ■ Assembly of electronic circuit boards *For more details, please refer to our catalog or feel free to contact us.
This is a solder with flux residue removal measures that is effective for precise work!
The "GUMMIX series" is a solder with flux and solder ball scattering that is not allowed, making it effective for precision work. It is ideal for countermeasures against flux residue peeling due to flexible substrates and vibrations, and it is also useful for various other applications. Furthermore, due to popular demand, a non-halogen type has been newly introduced, so please give it a try as well. 【Features】 ■ Prevents peeling of flux residue and reduces scattering ■ Ideal for flexible substrates, motors, relays, etc. ■ Non-halogen type added *For more details, please refer to the catalog or feel free to contact us.
It's a solder that minimizes "Cu eating"!
This product is a solder that minimizes the phenomenon of copper erosion, known as wire thinning, which occurs during soldering of copper wires. We offer three types of alloys tailored for different applications: "LFM-41" for hand soldering of fine copper wires, "LFM-59" for dipping of coil wires, and "LFM-62" for dipping of ultra-fine wires. Additionally, our company has a variety of solder-related products available, so please feel free to consult us. 【Features】 ■ Measures against copper erosion ■ Three types of alloys ■ Minimizes wire thinning phenomenon *For more details, please refer to the catalog or feel free to contact us.
Uses fluorine-based special surfactants! Offers strong wettability while being compatible with no-wash applications.
Soldering possible with aluminum The "EVASOL EAN series" uses a special fluorine compound as an activator. Even aluminum parts, which are difficult to solder, can be soldered with strong reactivity. New Applications It enables soldering to aluminum wires, which was previously impossible. It allows for the introduction of aluminum wires in a wide range of applications. No-clean compatibility It suppresses corrosion and ensures reliability after joining. Like regular rosin-core solder, cleaning of flux residue is not necessary. 【Features】 ■ Soldering possible with aluminum ■ Enables the introduction of aluminum wires in a wide range of applications ■ No-clean compatibility due to suppressed corrosion *For more details, please refer to the PDF document or feel free to contact us.
Uses fluorine-based special surfactants! Compatible with no-wash while having strong wettability.
Powerful wettability The "EVASOL ESK series" uses a special fluorine compound as an active agent. With strong activity, it demonstrates good workability even on difficult base materials such as nickel and brass. Soldering of stainless steel is also possible Even for stainless steel parts that are difficult to solder, hand soldering with a soldering iron and robot soldering are possible. Supports no-clean It suppresses corrosion and ensures reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Soldering of stainless steel is also possible ■ Supports no-clean *For more details, please refer to the PDF materials or feel free to contact us.
Supports terminal processing of aluminum wire, achieving high joint reliability.
Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.
We will introduce knowledge and techniques related to soldering defects, such as material selection.
Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.
We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.
One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.
We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.
Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.
We will introduce examples of products suitable for special applications such as colorless residue flux.
The rosin used in flux varies in color depending on the variety, ranging from colorless and transparent to brown. Additionally, some active agents and additives can change color due to the heat during soldering. In LED lighting equipment, a white resist is applied over the entire substrate, and if the flux residue is brown, it can detract from the product's appearance. Furthermore, on substrates with silk-screened markings, brown flux residue can flow into the marked areas, reducing visibility and increasing the burden during visual inspection processes. We offer solder materials that minimize the color of flux residue by using light-colored rosin and low-color active agents. For samples, please contact us through our website below. 【Product Introduction】 ■ Rosin-containing solder, splash prevention type MYK series ■ Solder paste (bottle), colorless residue, LED compatible type 8860 series
Introducing halogen-free solder.
In the case of solder materials, halogens such as Cl and Br are used in the flux to enhance the wettability and workability of the solder. However, incinerating electronic substrates containing halogens like Cl and Br can produce harmful dioxins to living organisms. To address this issue, the regulation of halogens used in electronic substrates is what is meant by halogen-free. Our company offers a variety of rosin-containing solder and solder paste that meet various halogen-free standards, so please feel free to contact us. 【Product Introduction】 ■ Rosin-containing solder → High reliability, halogen-free standard compliant HRK series ■ Rosin-containing solder → Completely halogen-free type HFC series ■ Solder paste (bottle) → Splash prevention, halogen-free standard compliant type 8850 series ■ Solder paste (bottle) → Completely halogen-free standard compliant 7100 series *For more details, please feel free to contact us.
Introducing laser soldering.
Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.
Introducing aluminum soldering.
About the Price and Characteristics of Aluminum The price of aluminum is about one-third that of copper, which can reduce procurement costs. Additionally, its weight is also about one-third, allowing for a reduction in transportation costs and environmental impact related to delivery. The characteristics of aluminum are that it is both ecological and economical. Soldering Aluminum We have made it possible to solder aluminum, which has been difficult until now. The surface of aluminum has a strong oxide film, and common fluxes cannot remove this oxide film. No-Clean Compatibility In our tar-containing solder EAN series, we have successfully used a special fluorine compound activator to remove the strong oxide film on aluminum. Just like our previous tar-containing solders, it can be used without the need to clean flux residues. *For more details, please feel free to contact us.
Introducing fine powder paste.
The particle size of solder powder used in solder paste must be selected appropriately according to the mounted components. As miniaturization of components used in small mounted products progresses, it is necessary to narrow the inner diameter of the metal mask openings and dispensing nozzles to stably apply a small amount of solder to the mounting substrate, which requires the use of fine powders. Fine powders not only have a smaller diameter but also have an increased surface area per unit weight. As a result, issues arise such as: - Decreased wettability - Increased solder balls - Decreased stability during use (continuous application) These challenges necessitate the development of specialized fluxes to address them. We offer a syringe-type solder paste using Type 5 (10-25) powder, which resolves the above issues, and it has already been adopted by our users. *For more details, please feel free to contact us.
We will introduce examples of products suitable for special applications such as ultra-fine solder.
With the miniaturization of various implemented products and the fine-pitching of circuit boards, precise adjustments in solder supply amounts are required. Ultra-fine solder is used in small components such as camera modules, OIS modules, and fine cables. Our ultra-fine solder with flux can accommodate wire diameters down to 0.10mm and can also have a flux content of 6%. This allows for more precise adjustments in solder supply amounts and significantly expands the range of applications. It is possible to create ultra-fine wires with various types of flux-cored solder, including anti-splash flux-cored solder and stainless steel-compatible flux-cored solder. *For more details, please feel free to contact us.
Supports terminal processing of aluminum wire, achieving high joint reliability.
Support for aluminum wire It can be used for terminal processing of aluminum wire, which is rapidly spreading to air conditioner compressors and other applications, through a dip tank. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder materials is prevented by added elements, achieving high joint reliability. High work stability It suppresses the occurrence of dross, which is particularly problematic in terminal processing of aluminum wire. This reduces the number of times the solder tank needs to be replaced, ensuring work efficiency. 【Features】 ■ Reduction of dross caused by aluminum ■ Support for terminal processing of aluminum wire ■ High joint reliability *For more details, please refer to the PDF document or feel free to contact us.
![[Special Use Case] Measures Against Copper Erosion and Fine Wire Erosion](https://image.mono.ipros.com/public/product/image/046/2000660638/IPROS25197355021438279102.jpeg?w=280&h=280)
We will introduce measures against copper and fine wire corrosion.
Copper erosion and fine wire erosion This phenomenon occurs when soldering coil wires for relay components, earphones, microphones, etc., causing the wire to become thinner. Depending on the severity, it can lead to defects such as wire breakage. Causes of copper erosion Copper erosion occurs when the copper in the coil wire forms compounds with Sn in the solder and diffuses into the solder. Pb-free solder contains a higher amount of Sn, making it more susceptible to erosion. Countermeasures for copper erosion By adding a large amount of Cu to the solder alloy, it is possible to reduce the diffusion rate of Cu from the coil wire, thereby decreasing copper erosion. We offer solder with resin for copper erosion countermeasures and bar solder, so please contact us for more information.
We will introduce flux dispersion and solder balls (solder with resin).
The details below include information regarding "wet defects, bridges, and spikes" in solder with flux, so please check.
Halogen-free standard compliant! Significantly reduced scattering, enabling high-quality mounting! Demonstrates sufficient wettability even at low output, reducing damage to mounted components due to heat.
Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.
