Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 120 items
The scattered flux residue does not break or peel off.
Lead-free solder that significantly improves the issues of poor conductivity around the camera lens of mobile phones and within electronic components.
![[JIS A Grade Type] Leaded solder](https://image.mono.ipros.com/public/product/image/ff2/306759018/IPROS_10740593365151988000.jpg?w=280&h=280)
The heat resistance durability of the flux has improved, demonstrating excellent cleanliness.
Solder with excellent insulation properties and high reliability.
![[Example of analysis using EBSD] High melting point solder](https://image.mono.ipros.com/public/product/image/a89/2000533387/IPROS76289936861552503680.png?w=280&h=280)
Observing crystal structures with EBSD! Data can be obtained for each metal.
We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). With the EBSD method, it is possible to infer the grain distribution and residual stress. Additionally, there are analyses that can be performed simultaneously for metals with different crystal structures, allowing for data acquisition for each metal. 【Features】 ■ Ability to infer grain distribution and residual stress ■ Simultaneous analysis for metals with different crystal structures is possible, enabling data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.
Lead-free and environmentally friendly.
This is an announcement from Nihongenma Co., Ltd. regarding "wire and rod solder."
Significantly reduce the scattering of flex and solder balls!
"GST" is a solder with a high level of both "wetting properties" and "splash suppression effects," suitable for laser applications (JIS AA type Sn-3.0Ag-0.5Cu). Additionally, we offer the "IJIRAQ" solder with flux, specifically designed for the RZ method, which significantly reduces flux residue and drastically decreases the frequency of nozzle cleaning. Please feel free to contact us if you have any inquiries. 【Basic Characteristics】 ■ Solder Composition: Sn-3.0Ag-0.5Cu ■ Melting Point (°C): 217–219 ■ Halide Content (wt%): 0.07±0.03 *For more details, please download the PDF or contact us.
Used as a substitute for solder paste!!
Improving the shortcomings of solder paste! Features: 1. Can be used instead of solder paste. 2. No printing required (avoids printing defects). 3. Uniform thickness.
Products and services that gain trust and satisfaction! We will provide better quality and faster delivery!
Our company develops a manufacturing business that brings together advanced technology and equipment to meet all customer needs, from small-lot deliveries of various products to prototypes. In order to establish a supply system that comprehensively responds to increasingly diverse and sophisticated needs, we are further expanding our trading company functions. Our components communicate the know-how we have cultivated in the field of EMS (Electric Manufacturing Service) and the functions of a trading company, creating high added value. We propose and provide products and services through the best matching for our customers. 【Business Overview】 ■ Comprehensive sales of electronic components ■ Assembly of electronic circuit boards *For more details, please refer to our catalog or feel free to contact us.
This is a solder with flux residue removal measures that is effective for precise work!
The "GUMMIX series" is a solder with flux and solder ball scattering that is not allowed, making it effective for precision work. It is ideal for countermeasures against flux residue peeling due to flexible substrates and vibrations, and it is also useful for various other applications. Furthermore, due to popular demand, a non-halogen type has been newly introduced, so please give it a try as well. 【Features】 ■ Prevents peeling of flux residue and reduces scattering ■ Ideal for flexible substrates, motors, relays, etc. ■ Non-halogen type added *For more details, please refer to the catalog or feel free to contact us.
It's a solder that minimizes "Cu eating"!
This product is a solder that minimizes the phenomenon of copper erosion, known as wire thinning, which occurs during soldering of copper wires. We offer three types of alloys tailored for different applications: "LFM-41" for hand soldering of fine copper wires, "LFM-59" for dipping of coil wires, and "LFM-62" for dipping of ultra-fine wires. Additionally, our company has a variety of solder-related products available, so please feel free to consult us. 【Features】 ■ Measures against copper erosion ■ Three types of alloys ■ Minimizes wire thinning phenomenon *For more details, please refer to the catalog or feel free to contact us.
Uses fluorine-based special surfactants! Offers strong wettability while being compatible with no-wash applications.
Soldering possible with aluminum The "EVASOL EAN series" uses a special fluorine compound as an activator. Even aluminum parts, which are difficult to solder, can be soldered with strong reactivity. New Applications It enables soldering to aluminum wires, which was previously impossible. It allows for the introduction of aluminum wires in a wide range of applications. No-clean compatibility It suppresses corrosion and ensures reliability after joining. Like regular rosin-core solder, cleaning of flux residue is not necessary. 【Features】 ■ Soldering possible with aluminum ■ Enables the introduction of aluminum wires in a wide range of applications ■ No-clean compatibility due to suppressed corrosion *For more details, please refer to the PDF document or feel free to contact us.
Uses fluorine-based special surfactants! Compatible with no-wash while having strong wettability.
Powerful wettability The "EVASOL ESK series" uses a special fluorine compound as an active agent. With strong activity, it demonstrates good workability even on difficult base materials such as nickel and brass. Soldering of stainless steel is also possible Even for stainless steel parts that are difficult to solder, hand soldering with a soldering iron and robot soldering are possible. Supports no-clean It suppresses corrosion and ensures reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Soldering of stainless steel is also possible ■ Supports no-clean *For more details, please refer to the PDF materials or feel free to contact us.
Supports terminal processing of aluminum wire, achieving high joint reliability.
Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.
We will introduce knowledge and techniques related to soldering defects, such as material selection.
Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.
