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Solder Product List and Ranking from 27 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Solder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 石川金属 Osaka//Ferrous/Non-ferrous metals
  2. 中部アルミット工業 Aichi//Building materials, supplies and fixtures
  3. null/null
  4. 4 千住金属工業 Tokyo//Electronic Components and Semiconductors
  5. 5 null/null
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Solder Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum-compatible solder "EVASOL EAN Series" 石川金属
  2. Soldering defects: Flux scattering, solder balls (solder with resin) 石川金属
  3. Solder "SR-34 Super" 中部アルミット工業
  4. 4 HANDA "GUMMIX Series" 中部アルミット工業
  5. 5 Solder with flux for aluminum wire "EVASOL C601 Series" 石川金属

Solder Product List

106～120 item / All 120 items

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Laser soldering iron compatible, soldering "EVASOL EYP Series"

Laser soldering iron compatible, soldering "EVASOL EYP Series"

J-STD-709 halogen-free standard compliance Strong wettability for nickel base material

Laser Heating Compatibility Materials suitable for rapid heating by laser are selected. They exhibit sufficient wettability even at low power, reducing damage to mounted components due to heat. Significantly Reduced Spattering Base materials are chosen to match the rapid heating and the melting point rise of solder alloys. There is almost no spattering, enabling higher quality mounting. No-Clean Compatibility Corrosiveness is minimized, ensuring reliability after joining. Like standard flux-containing solders, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult substrates ■ Significantly reduced spattering ■ No-clean compatibility *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free solder "EVASOL HFC Series"

Halogen-free solder "EVASOL HFC Series"

All halogens are additive-free, good wettability.

Completely Halogen-Free The 'EVASOL HFC Series' does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. Ensured Wettability We use special surfactants that are not halogen-based. It demonstrates wettability equivalent to halogen-containing products. Compatible with Difficult Substrates It shows good wettability on nickel and brass. This allows for soldering of a wider variety of components. 【Features】 ■ Complies with halogen-free standards ■ Excellent wettability ■ Compatible with difficult substrates *For more details, please refer to the PDF document or feel free to contact us.

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McDermid: Achieving a decarbonized society while reducing costs! Low melting point solder.

McDermid: Achieving a decarbonized society while reducing costs! Low melting point solder.

Introducing examples of achieving energy savings and cost reduction with solder paste! Contributing to carbon neutrality through CO2 reduction! Impact resistance equivalent to SAC305!

HRL1 OM-550 is designed to improve yield and reduce component warpage with a low melting point solder paste. It significantly enhances drop impact resistance and thermal cycle resistance compared to the company's conventional products, and its melting point is considerably lower than that of SAC305. By lowering the peak temperature during reflow from 245°C to 185°C, it achieves energy savings through reduced electricity costs in the assembly process. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low melting point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints has been significantly improved compared to the company's conventional low melting point solder. ● The thermal cycle test performance at the SAC series BGA ball joints has been significantly improved compared to the company's conventional low melting point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low melting point solder.

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Solder "SR-37"

Solder "SR-37"

Effective in reducing solder balls associated with flux dispersion!

"SR-37" significantly reduces flux scattering during soldering due to improvements in flux. It inherits the wettability (workability) of "SR-34 Super," resulting in good initial soldering performance. Additionally, it reduces flux scattering by approximately 80% to 90% compared to our conventional products. Furthermore, it has various features, including suppressing the generation of smoke and odors during soldering. 【Features】 ■ Measures against flux scattering ■ Effective in reducing solder balls ■ Inherits the wettability of SR-34 ■ Suppresses the generation of smoke and odors *For more details, please refer to the catalog or feel free to contact us.

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High operability solder "EVASOL MFJ Series"

High operability solder "EVASOL MFJ Series"

3Ag, compatible with both low Ag! Excellent workability and low scattering.

- Good wettability even with low Ag The "EVASOL MFJ series" has improved wettability significantly, making it compatible with low Ag alloys. It allows for cost reduction while maintaining work efficiency comparable to 3Ag. - Reduced splatter The base material is selected according to the melting point increase of the solder alloy. This results in less splatter and enables higher quality mounting. - Excellent wettability retention By combining surfactants, the retention of wettability has improved. Stable mounting is possible regardless of the size or type of components. 【Features】 ■ Excellent wettability even with low Ag ■ Minimal splatter ■ Improved wettability characteristics *For more details, please refer to the PDF document or feel free to contact us.*

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Water-soluble flux solder "EVASOL WSG Series"

Water-soluble flux solder "EVASOL WSG Series"

Good water washability, excellent wettability, and low scattering.

Good water washability "EVASOL WSG Series" uses a water-soluble base material instead of rosin. Residues after soldering can be easily washed away with water. Excellent wettability By selecting surfactants tailored to the base material, wettability has been improved. Stable mounting is possible regardless of the type of components. Reduced splatter Thanks to the effects of special surfactants, solder and flux splatter has been reduced. This enables the assurance of higher mounting quality. 【Features】 ■ Good water washability ■ Excellent wettability ■ Significantly reduced splatter *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free solder "EVASOL HRK Series"

Halogen-free solder "EVASOL HRK Series"

Halogen-free standard compliant, excellent wettability and low scattering.

Halogen-free standard compliant No Cl or Br added, which are the causes of dioxin generation. Complies with most halogen-free standards. Ensured wettability Special surfactants other than Cl and Br are added. It demonstrates good wettability while complying with halogen-free standards. Reduced scattering The use of special surfactants has reduced scattering. It helps to minimize substrate contamination and ensures higher assembly quality. 【Features】 ■ Excellent wettability ■ Significantly reduced scattering ■ Halogen-free standard compliant *For more details, please refer to the PDF document or feel free to contact us.

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[Column] About solder

[Column] About solder

Solder has an inseparable connection with metal masks! An explanation of different types based on implementation purposes.

In this column, we will introduce "solder." Suddenly, do you all know how to make solder paste? Honestly, I didn't know. I asked in detail during a meeting with the solder manufacturer, but after returning home and doing some research, I found that it's really similar to making curry! Solder has an inseparable connection with metal masks, and since I had various realizations this time, I decided to write an article about it. [Contents] ■ What is "solder" in the first place? ■ Solder? Han-da? ■ Types of solder based on implementation applications ■ How to make curry and solder paste *You can view the detailed content of the column through the related links. For more information, please feel free to contact us.

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[Research Material] Global Market for Electronic Interconnection Solder Materials

[Research Material] Global Market for Electronic Interconnection Solder Materials

World Market for Electronic Interconnection Solder Materials: Solder Paste, Solder Bar, Solder Wire, Solder Ball, Others, SMT Assembly ...

This research report (Global Electronics Interconnect Solder Materials Market) investigates and analyzes the current status and outlook for the global market of solder materials for electronic interconnections over the next five years. It includes information on the overview of the global electronics interconnect solder materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the electronics interconnect solder materials market include solder paste, solder bar, solder wire, solder ball, and others, while the segments by application focus on SMT assembly and semiconductor packaging. The regional segments calculate the market size for electronics interconnect solder materials by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the electronics interconnect solder materials sector, product and business overviews, and sales performance.

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