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Solder Product List and Ranking from 28 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.

Solder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.

  1. 石川金属 Osaka//Ferrous/Non-ferrous metals
  2. 中部アルミット工業 Aichi//Building materials, supplies and fixtures
  3. null/null
  4. 4 千住金属工業 Tokyo//Electronic Components and Semiconductors
  5. 5 日本アルミット 本社 Tokyo//Ferrous/Non-ferrous metals
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Solder Product ranking

Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.

  1. HANDA "GUMMIX Series" 中部アルミット工業
  2. Soldering defects: Flux scattering, solder balls (solder with resin) 石川金属
  3. Sn-Bi series low-temperature solder "LEO series" 千住金属工業
  4. Solder "SR-34 Super" 中部アルミット工業
  5. 4 Aluminum-compatible solder "EVASOL EAN Series" 石川金属

Solder Product List

76～90 item / All 122 items

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Solder with flux for aluminum wire "EVASOL C601 Series"

Solder with flux for aluminum wire "EVASOL C601 Series"

Supports terminal processing of aluminum wire, achieving high joint reliability.

Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.

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Soldering defects: wet defects, bridges, horns (solder with flux)

Soldering defects: wet defects, bridges, horns (solder with flux)

We will introduce knowledge and techniques related to soldering defects, such as material selection.

Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.

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Soldering defects: Flux scattering, solder balls (solder with resin)

Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.

One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.

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Soldering defect: residue cracking

Soldering defect: residue cracking

We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.

Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.

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【Special Use Case】Colorless Residue Flux, Compatible with LED Substrates

【Special Use Case】Colorless Residue Flux, Compatible with LED Substrates

We will introduce examples of products suitable for special applications such as colorless residue flux.

The rosin used in flux varies in color depending on the variety, ranging from colorless and transparent to brown. Additionally, some active agents and additives can change color due to the heat during soldering. In LED lighting equipment, a white resist is applied over the entire substrate, and if the flux residue is brown, it can detract from the product's appearance. Furthermore, on substrates with silk-screened markings, brown flux residue can flow into the marked areas, reducing visibility and increasing the burden during visual inspection processes. We offer solder materials that minimize the color of flux residue by using light-colored rosin and low-color active agents. For samples, please contact us through our website below. 【Product Introduction】 ■ Rosin-containing solder, splash prevention type MYK series ■ Solder paste (bottle), colorless residue, LED compatible type 8860 series

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【Special Use Case】Halogen-Free Solder

【Special Use Case】Halogen-Free Solder

Introducing halogen-free solder.

In the case of solder materials, halogens such as Cl and Br are used in the flux to enhance the wettability and workability of the solder. However, incinerating electronic substrates containing halogens like Cl and Br can produce harmful dioxins to living organisms. To address this issue, the regulation of halogens used in electronic substrates is what is meant by halogen-free. Our company offers a variety of rosin-containing solder and solder paste that meet various halogen-free standards, so please feel free to contact us. 【Product Introduction】 ■ Rosin-containing solder → High reliability, halogen-free standard compliant HRK series ■ Rosin-containing solder → Completely halogen-free type HFC series ■ Solder paste (bottle) → Splash prevention, halogen-free standard compliant type 8850 series ■ Solder paste (bottle) → Completely halogen-free standard compliant 7100 series *For more details, please feel free to contact us.

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【Special Application Example】Laser Soldering (Paste, Flux-Cored Solder)

【Special Application Example】Laser Soldering (Paste, Flux-Cored Solder)

Introducing laser soldering.

Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.

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【Special Use Case】Aluminum Soldering

【Special Use Case】Aluminum Soldering

Introducing aluminum soldering.

About the Price and Characteristics of Aluminum The price of aluminum is about one-third that of copper, which can reduce procurement costs. Additionally, its weight is also about one-third, allowing for a reduction in transportation costs and environmental impact related to delivery. The characteristics of aluminum are that it is both ecological and economical. Soldering Aluminum We have made it possible to solder aluminum, which has been difficult until now. The surface of aluminum has a strong oxide film, and common fluxes cannot remove this oxide film. No-Clean Compatibility In our tar-containing solder EAN series, we have successfully used a special fluorine compound activator to remove the strong oxide film on aluminum. Just like our previous tar-containing solders, it can be used without the need to clean flux residues. *For more details, please feel free to contact us.

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【Special Use Case】Ultra-fine Solder

【Special Use Case】Ultra-fine Solder

We will introduce examples of products suitable for special applications such as ultra-fine solder.

With the miniaturization of various implemented products and the fine-pitching of circuit boards, precise adjustments in solder supply amounts are required. Ultra-fine solder is used in small components such as camera modules, OIS modules, and fine cables. Our ultra-fine solder with flux can accommodate wire diameters down to 0.10mm and can also have a flux content of 6%. This allows for more precise adjustments in solder supply amounts and significantly expands the range of applications. It is possible to create ultra-fine wires with various types of flux-cored solder, including anti-splash flux-cored solder and stainless steel-compatible flux-cored solder. *For more details, please feel free to contact us.

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Aluminum wire solder "EVASOL K4S"

Aluminum wire solder "EVASOL K4S"

Supports terminal processing of aluminum wire, achieving high joint reliability.

Support for aluminum wire It can be used for terminal processing of aluminum wire, which is rapidly spreading to air conditioner compressors and other applications, through a dip tank. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder materials is prevented by added elements, achieving high joint reliability. High work stability It suppresses the occurrence of dross, which is particularly problematic in terminal processing of aluminum wire. This reduces the number of times the solder tank needs to be replaced, ensuring work efficiency. 【Features】 ■ Reduction of dross caused by aluminum ■ Support for terminal processing of aluminum wire ■ High joint reliability *For more details, please refer to the PDF document or feel free to contact us.

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【Special Purpose Example】Dip Soldering on Aluminum Coil

【Special Purpose Example】Dip Soldering on Aluminum Coil

Introducing dip soldering for aluminum coils.

Background Copper is widely used in automobiles and electronic components, but its price has significantly increased from July 2020 to the present. The rising demand for copper due to the proliferation of electric vehicles (EVs) is one factor driving up prices. Consequently, there is an accelerating movement to switch the materials of busbars and coils from copper to aluminum. Furthermore, the aspect of weight reduction is also drawing attention to the transition from copper to aluminum. → From copper to aluminum For details on dip soldering to aluminum coils, please see the information below.

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[Special Use Case] Measures Against Copper Erosion and Fine Wire Erosion

[Special Use Case] Measures Against Copper Erosion and Fine Wire Erosion

We will introduce measures against copper and fine wire corrosion.

Copper erosion and fine wire erosion This phenomenon occurs when soldering coil wires for relay components, earphones, microphones, etc., causing the wire to become thinner. Depending on the severity, it can lead to defects such as wire breakage. Causes of copper erosion Copper erosion occurs when the copper in the coil wire forms compounds with Sn in the solder and diffuses into the solder. Pb-free solder contains a higher amount of Sn, making it more susceptible to erosion. Countermeasures for copper erosion By adding a large amount of Cu to the solder alloy, it is possible to reduce the diffusion rate of Cu from the coil wire, thereby decreasing copper erosion. We offer solder with resin for copper erosion countermeasures and bar solder, so please contact us for more information.

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Soldering defects: Flux scattering, solder balls (solder with resin)

Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce flux dispersion and solder balls (solder with resin).

The details below include information regarding "wet defects, bridges, and spikes" in solder with flux, so please check.

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Soldering defect: Flux scattering (solder paste)

Soldering defect: Flux scattering (solder paste)

I will introduce you to flux dispersion (solder paste).

The following detailed information describes the flux dispersion in solder paste, so please check it.

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Focus on moisture resistance and compliant with halogen-free standards! EYP series solder with resin.

Focus on moisture resistance and compliant with halogen-free standards! EYP series solder with resin.

Halogen-free standard compliant! Significantly reduced scattering, enabling high-quality mounting! Demonstrates sufficient wettability even at low output, reducing damage to mounted components due to heat.

Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.

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