Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 123 items
Lead-free solder that can be selected according to the application.
It has gained attention in recent years as an environmentally friendly solder that does not contain harmful lead. SF-B Series Common Items Composition: Sn-Ag-Cu 99.0-0.3-0.7% Melting Point: 216-227℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0, Φ1.2mm Price: Open price
Lead-free solder Eco Solder Series
This is an introduction to the Pb (lead) free solder "Eco Solder Series" handled by Meishou Co., Ltd. We have a wide range of products available according to your needs. 【Product Lineup】 ○ Rod Solder M705 ○ Flux ES/ESR Series ○ Solder Paste GRN360 Series ○ Rosin Core Solder ESC Series ○ Rosin Core Solder RMA02 Series ○ Preform Solder (washers, pellets, etc.) ○ Solder Balls (for BGA/CSP/flip chip) ● For other functions and details, please contact us.
We pursue the reduction of setup time and promise unprecedented high productivity through the easy setting function.
Easy Setup Tape, 2mm edge, and four-sided adhesive switching with one touch. A "user-friendly control panel" that allows for flexible settings on the touch panel. □ High-Speed Feed Achieves a high-speed feed of max 20m/min, contributing to increased productivity. □ 3mm Edge Standard equipped with tape cutting and table compatible with 3mm edges. □ High-Frequency Motor The adoption of a high-frequency motor drive enables even higher precision processing.
Safety, operability, and cost-effectiveness... A modern edge bander that conceals the latest needs in a novel form.
□Space-saving Compact design with a total length of 3750mm that takes up minimal installation space □3mm Edge Standard equipped with tape cutting and table compatible with 3mm edges □Affordable Price Incredible low price with buff & scraper included and 3mm edge compatibility □High-Frequency Motor Adoption of high-frequency motor drive enables even higher precision processing □Gentle Design Pursuit of gentleness with a fully covered body and innovative operating system
A multi-machine that responds to a wide range of processing with a single unit (next-generation model of JN03SD-CH).
- By providing a discharge tray for double-end crimping, production is possible at speeds equivalent to dedicated double-end crimping machines: Double-end crimping: 0.80 seconds per unit (4,500 units/hour) Single-end crimping and single-end soldering: 1.20 seconds per unit (3,000 units/hour) - Adopts a popular structure that inserts solder along the wire axis (proven structure with CPR-ZERO-H) - Equipped with a 10-inch panel, improving visibility of the operation screen - The smallest installation space ever for CH machines - It is also possible to switch from touch panel operation to PC operation (optional) - Waterproof unit can be mounted with one touch (optional) - Crimp shape appearance inspection using a crimp camera (optional)
High-speed latest machine for one-end crimping and soldering based on CPR-F-ZERO.
● One-end crimping and one-end soldering capability: 1.1 seconds per unit (3,270 units per hour) ● Equipped with a new soldering unit, enabling smooth setup changes and reducing the burden on operators ● Standard equipped with a 2.5-ton equivalent integrated crimping machine ● Crimping shape appearance inspection using a crimp camera (optional: one side)
Low melting point solder wire with excellent workability.
No flux is needed as it contains activated resin.
High-performance flux-cored solder for stainless steel and nickel, no cleaning required.
There is no corrosion from flux residue at all, and there are no defects due to aging deterioration. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. Uses special active rosin based on organic amines (non-chlorinated). Complies with JIS-A grade and MIL-RA standards.
Equivalent peel strength to conventional eutectic solder. No-clean high-performance flux-containing solder.
There is no corrosion from the flux residue, and cleaning of the substrate is not necessary. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. It uses a special active rosin based on organic amines (non-chlorinated). Complies with JIS-AA grade and MIL-RMA standards.
We provide electronic materials products for semiconductors and micro soldering solutions.
Copper core solder materials are solder materials equipped with a spacer function for applications that require package clearance, such as maintaining a constant height like in POP.
Soldering at 200℃ is possible! Successfully commercialized low melting point alloys, achieving low-temperature mounting.
The "LEO Series" is a Sn-Bi based low-temperature solder suitable for mounting heat-sensitive components and substrates. It uses a low melting point alloy that allows soldering at 200°C, contributing to energy savings, reducing tip wear, and enabling the use of inexpensive materials, which is expected to lower material and manufacturing costs. The emergence of this repairable material accelerates low-temperature mounting using Sn-Bi in reflow ovens. 【Features】 ■ Suppresses the occurrence of splatter ■ Contributes to energy savings and reduces tip wear, leading to cost reduction ■ Allows for good soldering even at a tip temperature of 210°C ■ Development of low-temperature dedicated flux LEO shows good corrosion resistance and insulation properties *For more details, please refer to the PDF document or feel free to contact us.
Reduce crack occurrence! Stable printability without variation, solder that connects to a secure future.
"D-SOL" is a high-reliability solder for automotive use that meets the stringent durability requirements demanded by automotive manufacturers. The powder adopts Type 5, ensuring readiness for fine pitch applications. Additionally, it is halogen-free (ROL0), reduces whisker formation, and prevents ion migration. It reduces malfunctions caused by leakage current with high electrical reliability. 【Features】 ■ High durability: Maintains the necessary electronic control ■ High density: Expert design anticipating future mounting needs ■ High productivity: Ensures required quality and workability ■ Reduces false reports through quality improvement ■ Enhances inspection quality of mounting, improving perpendicularity *For more details, please refer to the PDF document or feel free to contact us.
Work-oriented type!
Lead-free solder with good fluidity during high-temperature soldering.
A high-performance type that is comparable to conventional leaded solder!
Especially in the case of flowing solder (pull solder), it demonstrates outstanding cutting performance, free-flowing and entry solder.
It is possible to significantly reduce the material cost of solder.
Low-cost solder containing next-generation recommended lead-free solder alloy.
Suppression of copper corrosion.
In the soldering process of fine copper wires, lead-free and resin-based solders can significantly suppress copper corrosion caused by solder alloys.
Ideal for soldering high-density printed circuit boards of electronic devices that require high reliability.
High-performance solder with excellent non-cleaning type wetting, spreading, and solder joint reliability.
Ultimate RMA!
Lead-free solder with good initial wettability and fluidity.
Significantly reduces flux scattering! No cracking or peeling of residues.
"STG (RMA type)" is a lead-free solder with flux ultra-low dispersion and residue cracking resistance. It is effective for bends and movable parts. The flux grade is equivalent to RMA, making it a highly reliable product. 【Features of STG】 ○ Significantly reduces flux dispersion. ○ Flux residues are less likely to crack and peel off. ○ The flux grade is equivalent to RMA, ensuring high reliability. ● For more details, please download the catalog or contact us.
Introducing examples of achieving energy savings and cost reduction with low melting point solder! Contributing to carbon neutrality by reducing CO2 emissions! Impact resistance equivalent to SAC305!
HRL1 OM-550 is a low-melting-point solder paste designed to improve yield and reduce component warpage. It significantly enhances drop impact resistance and thermal cycling resistance compared to the company's conventional products. Its melting point is considerably lower than that of SAC305, achieving energy savings in the assembly process by lowering the peak reflow temperature from 245°C to 185°C. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low-melting-point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The thermal cycling test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low-melting-point solder.
We provide high-quality products through 100% inspection.
This is a method of integrating wires and terminals with solder to achieve an electrical connection.
By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.
【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.
Proposals tailored to the necessary strength! We fulfill your needs for "wanting conductivity" and "wanting to solder."
At Kizuki Spring, we propose optimal solutions tailored to the required strength, such as post-plating. Leveraging our knowledge and expertise in special steel, we are committed to meeting the unique needs of various industries beyond our own. If you require conductivity or need soldering, please consult with us. 【% Conductivity】 ■ Copper: 100 ■ Pure Aluminum: 63 ■ SWIC-F: 8.5 ■ Steel Wire: 7.8 ■ Stainless Steel: 2.5 * The conductivity ratio of other materials is based on the inverse of the low efficiency of standard soft steel, set at 100. * For more details, please refer to the PDF document or feel free to contact us.
Halogen-free solder that is most considerate of the environment and people.
The "SR-38RMA" is a halogen-free solder that, despite being chlorine and bromine-free, has wettability equal to or greater than that of equivalent products from other companies. It complies with RMA specifications and is suitable for a wide range of products. Furthermore, it allows for an immediate switch from conventional lead-free halogen-containing products, even though it is chlorine and bromine-free. In addition, considering the development of halogen-free requirements, we also offer non-halogen solders in the "NH series." Please choose the product that best suits your application. 【Features】 ■ Environmentally friendly and safe for people ■ Compatible with halogen-free specifications without compromising the workability of conventional lead-free solders ■ Completely halogen-free *For more details, please refer to the catalog or feel free to contact us.
Achieving outstanding workability! A solder with a focus on workability that balances fluidity and cutting!
The "SR-55 LFM-48" ensures JIS Class A reliability, has excellent initial wetting properties at low temperatures, and significantly improves work speed. It spreads well on poorly wetting components such as nickel and oxidized copper, while also maintaining good cutting performance. It improves solder tip release and enhances workability. Additionally, our company offers a variety of solder-related products, so please feel free to consult us. 【Features】 ■ Balances wetting and cutting ■ Achieves outstanding workability ■ Stable soldering *For more details, please refer to the catalog or feel free to contact us.
![*Comprehensive Catalog Giveaway [Solder with a Rich Lineup of Flux]*](https://image.mono.ipros.com/public/product/image/12b/2000302495/IPROS6413314804793904497.PNG?w=280&h=280)
Introducing some of our solder with resin! All halogens are additive-free! *The downloadable catalog will be the comprehensive catalog!
The "EVSOL HFC Series" is a completely halogen-free solder with resin. It complies with all current halogen-free standards. It uses special activators other than halogens to ensure wettability equivalent to halogen-containing products. It also demonstrates good wettability for nickel and brass, enabling soldering of a wider variety of components. 【Features】 ■ Completely halogen-free ■ Ensures wettability ■ Compatible with difficult substrates *For more details, please refer to the catalog or feel free to contact us.
The workability and reliability required for vehicle-mounted equipment! A beautiful appearance that also accommodates lighting devices.
Laser Heating Compatible The "EVASOL MYK Series" selects materials suitable for rapid heating by light. It achieves high workability and demonstrates sufficient wettability even with low Ag alloys, allowing for cost reduction. Significantly Reduced Spatter Base materials are selected in accordance with rapid heating and the melting point rise of solder alloys. There is almost no spatter, enabling higher quality mounting. Colorless Residue The residue color is very light, making it suitable for mounted products where appearance is important, such as LED lighting equipment. It also reduces the burden of visual inspection. 【Features】 ■ Laser heating compatible ■ Significantly reduced spatter ■ Colorless residue for a beautiful appearance *For more details, please refer to the PDF document or feel free to contact us.
We introduce solder and solder paste containing flux that is compatible with low Ag and no Ag.
Currently, the introduction of low-silver solder with reduced Ag content and silver-free solder is progressing. The Ag in solder plays roles such as lowering the melting point of the alloy, improving wettability, and increasing mechanical strength, fatigue strength, and creep strength. We offer solder pastes and flux-cored solders compatible with low-Ag and no-Ag options, so please feel free to contact us. 【Product Introduction】 ■ Solder Paste (Bottle) Wettability-focused 1001 Series ■ Flux-Cored Solder Wettability-focused MFJ Series ■ Flux-Cored Solder Splash Prevention MYK Series *For more details, please feel free to contact us.
Uses fluorine-based special surfactants. It has strong wetting properties while being compatible with no-rinse applications!
【Overview】 Stainless steel is a base material that can be soldered. The Sn in the solder bonds with the Fe and Ni in the stainless steel to complete the joint. The difficulty of soldering is due to the behavior of the oxide film on stainless steel. While the oxide film on stainless steel serves to prevent rust, it also hinders soldering. During soldering, the oxide film on the stainless surface is removed by the flux, but a new oxide film grows due to heat and oxygen in the air. Therefore, it is necessary to complete the soldering in a short time before the oxide film grows too thick. 【Three Features】 - Strong wettability - Stainless steel can also be soldered - Compatible with no-clean *Test reports are also included in the catalog! *We offer solder with flux for stainless steel, so please contact us!
We will introduce the applications of low melting point solder.
Applications of Low Melting Point Solder Low melting point solder is used for the assembly of heat-sensitive components such as camera modules. Until now, these components have been retrofitted using resin-based solder, but further efforts are being made to lower temperatures and automate processes through the use of low-temperature solder and laser heating. Challenges of Low Melting Point Soldering Low melting point solder requires dedicated flux that matches its melting point, so it cannot be directly applied to what is currently in use. Additionally, since the alloy contains bismuth, caution is needed when using it in areas that require high reliability, such as automotive parts, medical devices, and industrial equipment. Ishikawa Metal's Low Melting Point Solder We already offer a variety of syringe-type solder pastes with proven market performance, including halogen-free syringe-type solder paste, so please contact us for more information. *For more details, feel free to contact us.*
