Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 120 items
Lead-free solder that can be selected according to the application.
It has gained attention in recent years as an environmentally friendly solder that does not contain harmful lead. SF-B Series Common Items Composition: Sn-Ag-Cu 99.0-0.3-0.7% Melting Point: 216-227℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0, Φ1.2mm Price: Open price
Lead-free solder Eco Solder Series
This is an introduction to the Pb (lead) free solder "Eco Solder Series" handled by Meishou Co., Ltd. We have a wide range of products available according to your needs. 【Product Lineup】 ○ Rod Solder M705 ○ Flux ES/ESR Series ○ Solder Paste GRN360 Series ○ Rosin Core Solder ESC Series ○ Rosin Core Solder RMA02 Series ○ Preform Solder (washers, pellets, etc.) ○ Solder Balls (for BGA/CSP/flip chip) ● For other functions and details, please contact us.
We pursue the reduction of setup time and promise unprecedented high productivity through the easy setting function.
Easy Setup Tape, 2mm edge, and four-sided adhesive switching with one touch. A "user-friendly control panel" that allows for flexible settings on the touch panel. □ High-Speed Feed Achieves a high-speed feed of max 20m/min, contributing to increased productivity. □ 3mm Edge Standard equipped with tape cutting and table compatible with 3mm edges. □ High-Frequency Motor The adoption of a high-frequency motor drive enables even higher precision processing.
Safety, operability, and cost-effectiveness... A modern edge bander that conceals the latest needs in a novel form.
□Space-saving Compact design with a total length of 3750mm that takes up minimal installation space □3mm Edge Standard equipped with tape cutting and table compatible with 3mm edges □Affordable Price Incredible low price with buff & scraper included and 3mm edge compatibility □High-Frequency Motor Adoption of high-frequency motor drive enables even higher precision processing □Gentle Design Pursuit of gentleness with a fully covered body and innovative operating system
Low melting point solder wire with excellent workability.
No flux is needed as it contains activated resin.
High-performance flux-cored solder for stainless steel and nickel, no cleaning required.
There is no corrosion from flux residue at all, and there are no defects due to aging deterioration. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. Uses special active rosin based on organic amines (non-chlorinated). Complies with JIS-A grade and MIL-RA standards.
Equivalent peel strength to conventional eutectic solder. No-clean high-performance flux-containing solder.
There is no corrosion from the flux residue, and cleaning of the substrate is not necessary. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. It uses a special active rosin based on organic amines (non-chlorinated). Complies with JIS-AA grade and MIL-RMA standards.
We provide electronic materials products for semiconductors and micro soldering solutions.
Copper core solder materials are solder materials equipped with a spacer function for applications that require package clearance, such as maintaining a constant height like in POP.
Soldering at 200℃ is possible! Successfully commercialized low melting point alloys, achieving low-temperature mounting.
The "LEO Series" is a Sn-Bi based low-temperature solder suitable for mounting heat-sensitive components and substrates. It uses a low melting point alloy that allows soldering at 200°C, contributing to energy savings, reducing tip wear, and enabling the use of inexpensive materials, which is expected to lower material and manufacturing costs. The emergence of this repairable material accelerates low-temperature mounting using Sn-Bi in reflow ovens. 【Features】 ■ Suppresses the occurrence of splatter ■ Contributes to energy savings and reduces tip wear, leading to cost reduction ■ Allows for good soldering even at a tip temperature of 210°C ■ Development of low-temperature dedicated flux LEO shows good corrosion resistance and insulation properties *For more details, please refer to the PDF document or feel free to contact us.
Reduce crack occurrence! Stable printability without variation, solder that connects to a secure future.
"D-SOL" is a high-reliability solder for automotive use that meets the stringent durability requirements demanded by automotive manufacturers. The powder adopts Type 5, ensuring readiness for fine pitch applications. Additionally, it is halogen-free (ROL0), reduces whisker formation, and prevents ion migration. It reduces malfunctions caused by leakage current with high electrical reliability. 【Features】 ■ High durability: Maintains the necessary electronic control ■ High density: Expert design anticipating future mounting needs ■ High productivity: Ensures required quality and workability ■ Reduces false reports through quality improvement ■ Enhances inspection quality of mounting, improving perpendicularity *For more details, please refer to the PDF document or feel free to contact us.
Work-oriented type!
Lead-free solder with good fluidity during high-temperature soldering.
A high-performance type that is comparable to conventional leaded solder!
Especially in the case of flowing solder (pull solder), it demonstrates outstanding cutting performance, free-flowing and entry solder.
It is possible to significantly reduce the material cost of solder.
Low-cost solder containing next-generation recommended lead-free solder alloy.
Suppression of copper corrosion.
In the soldering process of fine copper wires, lead-free and resin-based solders can significantly suppress copper corrosion caused by solder alloys.
Ideal for soldering high-density printed circuit boards of electronic devices that require high reliability.
High-performance solder with excellent non-cleaning type wetting, spreading, and solder joint reliability.
