We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate Material.
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Substrate Material Product List and Ranking from 15 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

Substrate Material Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. 利昌工業 Osaka//Resin/Plastic
  2. アライドマテリアル 営業企画部 Tokyo//Manufacturing and processing contract
  3. 太陽インキ製造 本社 Saitama//Chemical
  4. 4 NanoAndMoreジャパン 本社 Saitama//Trading company/Wholesale
  5. 5 日本エクセル Tokyo//Machine elements and parts
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Substrate Material Product ranking

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. Low dielectric constant & low dielectric loss tangent printed circuit board materials 利昌工業
  2. High dielectric constant & low dielectric loss tangent printed circuit board materials 利昌工業
  3. Rishorite PPE resin for 5G communication printed circuit board materials 利昌工業
  4. 4 Aluminum base printed circuit board material 利昌工業
  5. 4 Heat-dissipating substrate material "Ag-Diamond" (Silver Diamond) アライドマテリアル 営業企画部

Substrate Material Product List

31～33 item / All 33 items

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Polyimide No-Adhesive FCCL Market Size 2026

Polyimide No-Adhesive FCCL Market Size 2026

Rapid growth trend! What are the secrets behind the polyimide no-adhesive FCCL market size exceeding 842 million USD by 2026?

Global Market Size of Adhesive-Free Polyimide FCCL According to the latest research report published by Global Reports titled "Global Market Size, Share, Company Rankings, Sales, and Demand Trend Forecast for Adhesive-Free Polyimide FCCL (2026-2032)," the global market size for adhesive-free polyimide FCCL is expected to expand from approximately 809 million USD in 2025 to around 842 million USD in 2026. It is projected to continue growing at a compound annual growth rate (CAGR) of 4.7%, reaching approximately 1,109 million USD by 2032.

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Rishorite printed circuit board materials for automotive equipment

Rishorite printed circuit board materials for automotive equipment

Achieving long-term heat resistance, resistance to thermal expansion and contraction, and cost reduction! Supporting the electrification and electronic control of automobiles by device type. *Materials are currently available.

This is a printed wiring board material (copper-clad laminate) developed for electronic devices related to the rapid advancement of automotive electrification and electronic control. It is a printed wiring board material equipped with the necessary performance for various in-vehicle devices such as LED lamps, engine control units, power control units, and millimeter-wave radars. [Contents] - High thermal conductivity copper-based printed wiring board material for inverter/converter substrates [CC-7210] - Long-term high heat resistance CCL for engine control unit substrates [CS-3305A] - Low transmission loss CCL for millimeter-wave radar substrates [CS-3379M] - Solder crack resistant aluminum-based substrate material for LED headlight substrates [AC-7303] - High heat-resistant black CCL that does not transmit light for optical sensor substrates [CS-3667B] - High thermal conductivity white CCL for LED substrates [CS-3945] - High thermal conductivity adhesive sheet/copper foil with resin For more details, please download the PDF or contact us.

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Materials for multilayer printed circuit boards

Materials for multilayer printed circuit boards

"Nickaplex" - Material for multilayer printed circuit boards of the short-time molding type.

■ Due to its short-time molding type, productivity can be improved. ■ It can adapt to a wide range of molding conditions. ■ It can be supplied in roll shape.

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