We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate Material.
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Substrate Material Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Substrate Material Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 利昌工業 Osaka//Resin/Plastic
  2. アライドマテリアル 営業企画部 Tokyo//Manufacturing and processing contract
  3. 太陽インキ製造 本社 Saitama//Chemical
  4. 4 NanoAndMoreジャパン 本社 Saitama//Trading company/Wholesale
  5. 4 ニッカン工業 Tokyo//Resin/Plastic
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Substrate Material Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Heat-dissipating substrate material "Ag-Diamond" (Silver Diamond) アライドマテリアル 営業企画部
  2. LED mounting white & high thermal conductivity printed circuit board material CS-3945 利昌工業
  3. Low dielectric constant & low dielectric loss tangent printed circuit board materials 利昌工業
  4. Printed circuit board material for semiconductor package substrates CS-3305A 利昌工業
  5. 5 Low transmission loss printed circuit board material CS-3379M 利昌工業

Substrate Material Product List

16～30 item / All 33 items

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"Rich lineup of materials" We will accommodate specifications that meet our customers' wishes.

"Rich lineup of materials" We will accommodate specifications that meet our customers' wishes.

We also accommodate the production of flex-rigid boards! With a rich lineup of materials, we fulfill our customers' wishes.

Our company handles "PCBs" in standard thicknesses of 1.6t, as well as thinner options starting from 0.1t and thicker options up to 3.0t. We also have processing experience with a special thickness of 4.2t. Additionally, for "FPCs," we offer base materials and coverlay thicknesses of 12.5μ, 25μ, and 50μ, as well as adhesive-free materials. Furthermore, since we have both "PCB" and "FPC" materials, we can also accommodate the production of flex-rigid boards and perform adhesive tape applications. Please feel free to reach out with any questions or inquiries! 【Features】 ■ We can accommodate flex-rigid production as we have both PCB and FPC materials. ■ The standard color for the resist is green, but we can also provide white, blue, etc. ■ We also perform adhesive tape applications. Leveraging our strengths as a small, elite team, we respond flexibly to production needs! Please do not hesitate to contact us★ *For more details, please refer to the PDF materials or feel free to inquire.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Processing Contract

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[LED] Lens Diffusion Plate: Types of substrate materials for LSD

[LED] Lens Diffusion Plate: Types of substrate materials for LSD

We also supply lens diffusion plates made of UV acrylic substrates that allow 365nm light to pass through for UV light inspection devices!

The "Lens Diffuser Plate: LSD" is characterized by the ease of selecting substrate materials due to its surface processing technology. Substrate materials such as polycarbonate, polyester, acrylic, glass, and quartz can all be processed if they are in the form of films or sheets. In this column, we introduce various types of substrate materials, such as "polycarbonate" and "polyester," so please take a moment to read it. [Content] ■ Types of substrate materials for the Lens Diffuser Plate: LSD *For more details, please refer to the PDF document or feel free to contact us.

  • lens

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White aluminum base substrate material

White aluminum base substrate material

Achieving a reduction in the price of aluminum base materials.

The insulation layer contains glass cloth, which provides excellent insulation reliability. The breakdown voltage is... 5kV for an insulation layer thickness of 60μm 7kV for an insulation layer thickness of 120μm ...that is.

  • aluminum

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Light-blocking black printed circuit board material CS-3667B

Light-blocking black printed circuit board material CS-3667B

To prevent sensor malfunctions.

It is a black printed circuit board material that does not transmit or reflect light, even with a thickness of only 0.1mm. It absorbs not only visible light but also light from sensors, commonly used in the red to near-infrared range (wavelengths of 650 to 1310 nanometers). The glass transition temperature is 250°C, with a UL flammability rating equivalent to 94/V-0, and the coefficient of thermal expansion below the glass transition temperature is 34ppm/°C, making it a high-performance printed circuit board material.

  • plastic

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Printed circuit board material with a flexible insulating layer.

Printed circuit board material with a flexible insulating layer.

Suitable for solder crack prevention.

Power devices, which are semiconductors for power conversion, and high-brightness LEDs generate significant heat, so they are mounted on printed circuit boards based on aluminum plates. In this case, when the aluminum plate expands or contracts due to heat, it puts stress on the solder joints of the components. If this stress accumulates, it can lead to "solder cracks." The newly developed 7303 series resin remains very flexible even after curing, allowing it to absorb dimensional changes caused by the expansion and contraction of the aluminum plate. As a result, the stress on the solder joints is alleviated, helping to prevent the occurrence of cracks.

  • plastic

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Rishorite printed circuit board materials for automotive equipment

Rishorite printed circuit board materials for automotive equipment

Support for the electrification and electronic control of automobiles by equipment type.

This is a printed circuit board material (copper-clad laminate) developed for electronic devices related to the rapid advancement of automotive electrification and electronic control. It is a printed circuit board material equipped with the necessary performance for various in-vehicle devices, such as LED lamps, engine control units, power control units, and millimeter-wave radars.

  • Other polymer materials

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Rishorite PPE resin for 5G communication printed circuit board materials

Rishorite PPE resin for 5G communication printed circuit board materials

Achieves low cost and low transmission loss / Suitable for hybrid substrates as well.

It is a substrate material that experiences minimal signal attenuation and speed reduction even when high-frequency signals flow through the circuit of a printed circuit board. 5G communication exchanges large amounts of data using high-frequency signals such as 28 gigahertz. Substrates used in devices like antennas, servers, and switches require this characteristic of "low transmission loss."

  • Composite Materials

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White printed circuit board material for LED mounting

White printed circuit board material for LED mounting

A quarter of a century since the release, thank you for your continued support.

This is an FR-4 type printed circuit board material with a white appearance designed to accommodate LED elements and LED components.

  • Composite Materials

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Heat-dissipating substrate material "Cu-Diamond/Cu-W submount"

Heat-dissipating substrate material "Cu-Diamond/Cu-W submount"

For laser diodes! A lineup of materials with various thermal expansion rates and thermal conductivities.

We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Semiconductor MEMS process services / substrate materials

Semiconductor MEMS process services / substrate materials

No need for equipment, specialized technicians, or operators! Outsourcing support for process services.

At Nippon Functional Materials Co., Ltd., we serve as a suitable bridge between a global alliance of process companies and substrate material companies, primarily in Europe and the United States. We provide process services such as "epitaxial growth," "oxidation," "deposition & sputtering," "wafer polishing," "laser processing," and "other processes," as well as wafer substrates including "FZ wafers," "CZ wafers," "SOI wafers," "SOS wafers," and "other wafers." 【Features】 ○ No equipment required ○ No specialized technicians required ○ No operators required ⇒ Outsourcing of process services For more details, please contact us or download the catalog.

  • Other metal materials
  • Wafer
  • Other semiconductors

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High-frequency compatible fluoropolymer substrate for microwave and millimeter-wave substrate materials.

High-frequency compatible fluoropolymer substrate for microwave and millimeter-wave substrate materials.

High-frequency compatible fluororesin substrate. Numerous patents obtained related to the technology.

The microwave substrate material "PILLAR PC-CLAD" is a copper-clad laminate suitable for microwave to millimeter-wave circuits. "PILLAR PC-CLAD" consists of high-quality prepreg manufactured using advanced coating technology, and features a unique molding technique that minimizes variations in thickness and dielectric properties, making it a high-frequency compatible fluoropolymer substrate. We provide substrates suitable for microwave to millimeter-wave devices as double-sided printed circuit boards and multilayer printed circuit boards. It offers excellent antenna and circuit characteristics in the high-frequency range, and due to its low susceptibility to moisture-induced property variations, it can be utilized in various fields such as automotive collision avoidance radar, antennas, 5G small cells, and other millimeter-wave and microwave applications. 【Features】 ■ Low-loss substrate for microwave and millimeter-wave bands ■ Low water absorption, with minimal penetration of chemicals ■ Excellent adhesion to copper foil, ensuring high reliability of fine patterns ■ High heat resistance, allowing for uniform dielectric properties across all insulating layers, making it suitable for multilayer high-frequency circuits *For more details, please download the PDF or feel free to contact us.

  • shaft

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Comprehensive Catalog "Components for Printed Wiring Boards (PWB)"

Comprehensive Catalog "Components for Printed Wiring Boards (PWB)"

We provide high-value products that take into consideration the environment and safety.

Taiyo Ink Manufacturing is a chemical manufacturer with a high market share in SR, which is essential for printed wiring boards (PWB). This catalog features various materials for PWB, including those for rigid substrates and package (PKG) substrates. 【Items Listed】 ■Materials for PWB *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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[Data Presentation] High Frequency Substrate Material Handling List

[Data Presentation] High Frequency Substrate Material Handling List

Materials with low dielectric constant and low transmission loss, as well as materials with high dielectric constant and low transmission loss, are featured!

This document lists the materials used for handling high-frequency substrates. We also have materials in stock, so please feel free to inquire. Additionally, we can accommodate materials not listed, so do not hesitate to consult with us. Furthermore, please consider our company as your lab for prototyping and sample production of new materials. [Contents] ■ Low dielectric constant and low transmission loss materials ■ High dielectric constant and low transmission loss materials ■ Low transmission loss bonding films for multilayer fluoropolymer substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Support for high-speed and large-capacity transmission.

Support for high-speed and large-capacity transmission.

We will make proposals tailored to your needs, such as the adoption of liquid crystal polymer flexible materials!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Resolving the following concerns】 ■ I would like to consider next-generation high-frequency application substrates ■ I want to reduce transmission loss and delay time ■ I want to match characteristic impedance accurately ■ I want to reduce the cost of high-speed high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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