Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 33 items
Printed circuit board materials that combine whiteness and high thermal conductivity.
It was developed to incorporate LED components. It is a printed circuit board material that is white and has excellent thermal conductivity (1.3W/mk). It has obtained UL94/V-0 certification.
A rich lineup. Widely adopted for LED lighting and automotive applications.
This is a highly thermally conductive printed circuit board material designed to accommodate components that emit high heat during operation, such as high-brightness LEDs and power semiconductors. It has been on the market for 20 years, and the lineup has been enriched, receiving many adoptions.
Achieves 10 times the thermal conductivity compared to conventional printed circuit board materials!
The heat emitted by high-brightness LEDs and power devices destabilizes their operation and accelerates the degradation of surrounding materials such as substrates and encapsulating resins. Therefore, substrate materials are required to efficiently transfer heat to the casing and heat sinks. High thermal conductivity printed circuit board materials support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors, with a thermal conductivity that is ten times greater than that of standard printed circuit board materials (FR-4). ------------------------------【Features】--------------------------------- ■ Achieves a thermal conductivity of 3.0 W/mK with glass cloth ■ Can be made thin, thus supporting thermal management from the aspect of "reducing thermal resistance" ---------------------------------------------------------------------------
It suppresses warping during reflow.
- The bending elastic modulus at high temperatures is very high, reducing warping during reflow. - The handling properties are good when processing thin substrates. - It is a high heat-resistant material while also exhibiting excellent moisture-resistant solder heat resistance. - The composition of the insulating layer is uniform, resulting in good laser processing capabilities. - It is an environmentally friendly substrate material that is halogen-free, phosphorus-free, and free of metal oxides.
It is a printed circuit board material for high-capacity and high-speed communication devices such as base station antennas and high-speed servers and routers.
With the spread of smartphones and tablet devices, the equipment that makes up broadband systems is required to process large amounts of data at high speeds. Additionally, to enhance "connectivity" and expand coverage areas, the installation and upgrading of base stations are being advanced. In response to this, Rishou Industry has prepared printed circuit board materials that have a fast signal propagation speed (low dielectric constant) and a function to minimize transmission loss (low dielectric loss tangent).
It was developed for mobile phone base station antenna substrates.
The substrate glass fabric uses general-purpose E-glass, which offers excellent cost performance.
Offered at about half price for millimeter-wave radar substrates.
The printed circuit board materials for millimeter-wave radar substrates require the performance of "low transmission loss," which has led to the prevalence of expensive PTFE (polytetrafluoroethylene) and LPC (liquid crystal polymer) based materials. CS-3379M is based on the more affordable PPE (polyphenylene ether) and achieves low transmission loss. It is expected to offer low transmission loss performance comparable to PTFE substrates while being available at about half the price.
Effective measures against solder cracks.
When surface mount components are soldered onto an aluminum base printed circuit board, the aluminum plate repeatedly expands and contracts due to heat, causing stress to accumulate at the solder joints, leading to fatigue failure (solder cracks). The insulation layer of AC-7302 is very soft (low elasticity), which can help alleviate the stress on the solder joints.
A thermal conductivity that is 6 times or 10 times that of the general FR-4 type.
Glass fabric substrate epoxy resin printed circuit board materials are referred to as FR-4 in the industry. The thermal conductivity of standard FR-4 is about 0.3 W/mK. In contrast, Risholite high thermal conductivity FR-4 offers a lineup with thermal conductivities of 1.8 W/mK, which is six times that of standard products, and 3 W/mK, which is ten times higher. Since heat dissipation substrates can be manufactured using existing equipment, we have received many adoptions.
Proposal for the miniaturization of millimeter-wave antennas.
This is a printed circuit board material with high dielectric constant (Dk=11.3) and low dielectric loss tangent (Df=0.003). It is a type reinforced with glass cloth using PPE resin (polyphenylene ether), allowing the use of existing machinery and know-how for processing glass epoxy type printed circuit boards (FR-4). We also have prepreg for multilayering (ES-3346) and interlayer adhesive sheets (AD-3396).
We will provide the best proposals from a rich variety of products created by a spirit of inquiry and a wide range of handled items.
Mazda Engineering Co., Ltd. sells various plastic materials such as MC nylon, polyacetal, PEEK, PVC, acrylic, and Teflon. We also accept processing of various plastic materials, catering to a wide range of needs from small quantities to mass production. Please provide your desired drawings, materials, and quantities, and we will promptly provide you with a quote. We offer various materials for printed circuit boards used in devices such as computers, digital cameras, and mobile phones, including shield plates, multilayer boards, and double-sided boards. Additionally, we handle auxiliary materials, equipment, and devices related to the electronic industry involved in their manufacturing. For more details, please contact us or refer to our catalog.
Stable thermal conductivity of over 600 W/(m·K)! Capable of high-temperature (800℃) silver brazing.
"Ag-Diamond" is a composite material of silver and diamond. It has a higher thermal conductivity (600W/(m·K)) than "Cu-Diamond" and is applicable for large area applications of 50×50mm². In addition to being able to be plated with Ni or Ni/Au on the surface, it also supports high-temperature (800℃) silver brazing. 【Features】 ■ Stable high thermal conductivity of over 600W/(m·K) ■ Surface can be plated with Ni or Ni/Au ■ Supports high-temperature (800℃) silver brazing *For more details, please refer to the PDF document or feel free to contact us.
By reducing the thickness of the insulation layer, high heat dissipation can be achieved! Ultra-thin heat dissipation substrate material.
"Yupicel(R) H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. 【Features】 ■ Ultra-thin heat dissipation substrate material ■ Super lightweight heat dissipation substrate material ■ Roll processing through a unique continuous manufacturing method ■ Three-dimensional processing capability ■ Halogen-free, UL94V-0 certified (E319042) (Contains no ceramic fillers, has good machinability, suitable for bare chip mounting COB) *For more details, please download the PDF or feel free to contact us.
For AFM/SPM sample substrates! Atomically flat mica and HOPG.
This is a high-precision substrate material essential for the preparation of SPM and AFM samples. The first step to successfully conducting AFM and SPM measurements is to prepare a flat substrate. The mica and HOPG supplied by our company have sufficient precision to securely hold AFM and SPM samples. We also offer stainless steel surface-polished metal discs for fixing the substrate to the measurement device, as well as double-sided tape. High-precision mica substrates: Φ10, 12, 15, 20, 25mm V-1 grade High-precision HOPG substrates: 10x10mm thickness 1mm or 2mm MS values 0.4°, 0.8°, 3.5° Metal discs for substrate fixation: Φ10, 12, 15, 20mm stainless steel with gold coating option available Conductive double-sided tape for substrate fixation and non-conductive double-sided tape.
![Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]](https://image.mono.ipros.com/public/product/image/6fa/2000312615/IPROS849729614625668075.PNG?w=280&h=280)
Ultra-thin, lightweight heat dissipation substrate without adhesive type! Since three-dimensional processing is possible, substrates of various shapes can be produced!
Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be three-dimensionally processed, making it a suitable material for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ It allows for three-dimensional processing, enabling the production of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, providing excellent machinability. ■ It is suitable for bare chip mounting COBs. *For more details, please request materials or view the PDF data available for download.
We also accommodate the production of flex-rigid boards! With a rich lineup of materials, we fulfill our customers' wishes.
Our company handles "PCBs" in standard thicknesses of 1.6t, as well as thinner options starting from 0.1t and thicker options up to 3.0t. We also have processing experience with a special thickness of 4.2t. Additionally, for "FPCs," we offer base materials and coverlay thicknesses of 12.5μ, 25μ, and 50μ, as well as adhesive-free materials. Furthermore, since we have both "PCB" and "FPC" materials, we can also accommodate the production of flex-rigid boards and perform adhesive tape applications. Please feel free to reach out with any questions or inquiries! 【Features】 ■ We can accommodate flex-rigid production as we have both PCB and FPC materials. ■ The standard color for the resist is green, but we can also provide white, blue, etc. ■ We also perform adhesive tape applications. Leveraging our strengths as a small, elite team, we respond flexibly to production needs! Please do not hesitate to contact us★ *For more details, please refer to the PDF materials or feel free to inquire.
![[LED] Lens Diffusion Plate: Types of substrate materials for LSD](https://image.mono.ipros.com/public/product/image/ee8/2000810489/IPROS44743935735698824283.png?w=280&h=280)
We also supply lens diffusion plates made of UV acrylic substrates that allow 365nm light to pass through for UV light inspection devices!
The "Lens Diffuser Plate: LSD" is characterized by the ease of selecting substrate materials due to its surface processing technology. Substrate materials such as polycarbonate, polyester, acrylic, glass, and quartz can all be processed if they are in the form of films or sheets. In this column, we introduce various types of substrate materials, such as "polycarbonate" and "polyester," so please take a moment to read it. [Content] ■ Types of substrate materials for the Lens Diffuser Plate: LSD *For more details, please refer to the PDF document or feel free to contact us.
Achieving a reduction in the price of aluminum base materials.
The insulation layer contains glass cloth, which provides excellent insulation reliability. The breakdown voltage is... 5kV for an insulation layer thickness of 60μm 7kV for an insulation layer thickness of 120μm ...that is.
It offers excellent cost performance.
Reduces warping during reflow.
To prevent sensor malfunctions.
It is a black printed circuit board material that does not transmit or reflect light, even with a thickness of only 0.1mm. It absorbs not only visible light but also light from sensors, commonly used in the red to near-infrared range (wavelengths of 650 to 1310 nanometers). The glass transition temperature is 250°C, with a UL flammability rating equivalent to 94/V-0, and the coefficient of thermal expansion below the glass transition temperature is 34ppm/°C, making it a high-performance printed circuit board material.
Suitable for solder crack prevention.
Power devices, which are semiconductors for power conversion, and high-brightness LEDs generate significant heat, so they are mounted on printed circuit boards based on aluminum plates. In this case, when the aluminum plate expands or contracts due to heat, it puts stress on the solder joints of the components. If this stress accumulates, it can lead to "solder cracks." The newly developed 7303 series resin remains very flexible even after curing, allowing it to absorb dimensional changes caused by the expansion and contraction of the aluminum plate. As a result, the stress on the solder joints is alleviated, helping to prevent the occurrence of cracks.
Support for the electrification and electronic control of automobiles by equipment type.
This is a printed circuit board material (copper-clad laminate) developed for electronic devices related to the rapid advancement of automotive electrification and electronic control. It is a printed circuit board material equipped with the necessary performance for various in-vehicle devices, such as LED lamps, engine control units, power control units, and millimeter-wave radars.
Achieves low cost and low transmission loss / Suitable for hybrid substrates as well.
It is a substrate material that experiences minimal signal attenuation and speed reduction even when high-frequency signals flow through the circuit of a printed circuit board. 5G communication exchanges large amounts of data using high-frequency signals such as 28 gigahertz. Substrates used in devices like antennas, servers, and switches require this characteristic of "low transmission loss."
A quarter of a century since the release, thank you for your continued support.
This is an FR-4 type printed circuit board material with a white appearance designed to accommodate LED elements and LED components.
For laser diodes! A lineup of materials with various thermal expansion rates and thermal conductivities.
We handle the heat dissipation substrate material "Cu-Diamond/Cu-W Submount." Sharp edge processing and AuSn deposition are possible. We offer a lineup of materials with various thermal expansion coefficients and thermal conductivities. "W-10T" has achieved a high thermal conductivity Cu-W submount while maintaining low thermal expansion equivalent to conventional materials through our unique immersion technology. 【Features】 ■ High thermal conductivity ■ Cu-Diamond submount > 500 W/(m·K) ■ High thermal conductivity Cu-W submount realized (W-10T) ■ Lineup of materials with various thermal expansion coefficients and thermal conductivities ■ Sharp edge processing and AuSn deposition are possible *For more details, please refer to the PDF document or feel free to contact us.
No need for equipment, specialized technicians, or operators! Outsourcing support for process services.
At Nippon Functional Materials Co., Ltd., we serve as a suitable bridge between a global alliance of process companies and substrate material companies, primarily in Europe and the United States. We provide process services such as "epitaxial growth," "oxidation," "deposition & sputtering," "wafer polishing," "laser processing," and "other processes," as well as wafer substrates including "FZ wafers," "CZ wafers," "SOI wafers," "SOS wafers," and "other wafers." 【Features】 ○ No equipment required ○ No specialized technicians required ○ No operators required ⇒ Outsourcing of process services For more details, please contact us or download the catalog.
High-frequency compatible fluororesin substrate. Numerous patents obtained related to the technology.
The microwave substrate material "PILLAR PC-CLAD" is a copper-clad laminate suitable for microwave to millimeter-wave circuits. "PILLAR PC-CLAD" consists of high-quality prepreg manufactured using advanced coating technology, and features a unique molding technique that minimizes variations in thickness and dielectric properties, making it a high-frequency compatible fluoropolymer substrate. We provide substrates suitable for microwave to millimeter-wave devices as double-sided printed circuit boards and multilayer printed circuit boards. It offers excellent antenna and circuit characteristics in the high-frequency range, and due to its low susceptibility to moisture-induced property variations, it can be utilized in various fields such as automotive collision avoidance radar, antennas, 5G small cells, and other millimeter-wave and microwave applications. 【Features】 ■ Low-loss substrate for microwave and millimeter-wave bands ■ Low water absorption, with minimal penetration of chemicals ■ Excellent adhesion to copper foil, ensuring high reliability of fine patterns ■ High heat resistance, allowing for uniform dielectric properties across all insulating layers, making it suitable for multilayer high-frequency circuits *For more details, please download the PDF or feel free to contact us.
We provide high-value products that take into consideration the environment and safety.
Taiyo Ink Manufacturing is a chemical manufacturer with a high market share in SR, which is essential for printed wiring boards (PWB). This catalog features various materials for PWB, including those for rigid substrates and package (PKG) substrates. 【Items Listed】 ■Materials for PWB *For more details, please download the PDF or feel free to contact us.
![[Data Presentation] High Frequency Substrate Material Handling List](https://image.mono.ipros.com/public/product/image/060/2001120605/IPROS40789384978787395673.png?w=280&h=280)
Materials with low dielectric constant and low transmission loss, as well as materials with high dielectric constant and low transmission loss, are featured!
This document lists the materials used for handling high-frequency substrates. We also have materials in stock, so please feel free to inquire. Additionally, we can accommodate materials not listed, so do not hesitate to consult with us. Furthermore, please consider our company as your lab for prototyping and sample production of new materials. [Contents] ■ Low dielectric constant and low transmission loss materials ■ High dielectric constant and low transmission loss materials ■ Low transmission loss bonding films for multilayer fluoropolymer substrates *For more details, please refer to the PDF document or feel free to contact us.
We will make proposals tailored to your needs, such as the adoption of liquid crystal polymer flexible materials!
Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Resolving the following concerns】 ■ I would like to consider next-generation high-frequency application substrates ■ I want to reduce transmission loss and delay time ■ I want to match characteristic impedance accurately ■ I want to reduce the cost of high-speed high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
