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Substrate(kit) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
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Substrate Product List

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Support for flex-rigid structures

Support for flex-rigid structures

Achieving miniaturization, high density, and high reliability through flex-rigid integration!

Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Composite board thick wiring board "T-SEC-Board"

Composite board thick wiring board "T-SEC-Board"

Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Support for high-density components

Support for high-density components

High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

High-precision FiTT method! Achieving further high multilayer and high board thickness areas for narrow pitch BGA compatible boards.

We would like to introduce our "High Board Thickness and Narrow Pitch Printed Circuit Board Manufacturing Technology." Based on the FiTT method, we promote high-precision technology to achieve narrow pitch printed circuit boards in the realm of high multilayer and high board thickness. Main applications include semiconductor tester boards, load boards, socket boards, and probe cards. 【Features】 ■ High-precision FiTT method enables narrow pitch BGA compatible boards in high multilayer and high board thickness areas. ■ Supports 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing. ■ Supports 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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5G base station antenna compatible printed circuit board (PCB)

5G base station antenna compatible printed circuit board (PCB)

We would like to propose a printed circuit board for 5G base station antennas!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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400Gbps switch-compatible printed circuit board (PCB)

400Gbps switch-compatible printed circuit board (PCB)

We would like to propose a printed circuit board compatible with 400Gbps switches!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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[Market Report] Global Market for Ceramic Balls

[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others

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