Analysis Support Service (Ultrasonic Deep Damage Testing)
Non-destructive testing is possible! Introducing an analysis method that detects delamination and other issues based on the propagation time and strength of ultrasound.
Our company offers analysis support services (ultrasonic testing) that are useful for confirming the state of semiconductor device packaging and analyzing defective products. Ultrasonic testing is one method of analysis that detects delamination and other issues based on the propagation time and strength of ultrasonic waves. It can not only determine the presence of delamination but also estimate its location and size. Additionally, in investigating the locations of defects in semiconductor module products, we can conduct non-destructive evaluations of joints and non-destructive internal analyses of modules, including tracking investigations of delamination at the interface between circuit boards and plating layers. 【Service Overview (Excerpt)】 ■ Non-destructive evaluation of joints - Investigation of delamination and voids at semiconductor chip joints - Investigation of voids occurring within encapsulating resin *For more details, please refer to the PDF document or feel free to contact us.
- Company:佐用精機製作所
- Price:Other