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analysis(si) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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analysis Product List

61～75 item / All 180 items

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Fluid analysis for hydraulic circuits of heavy machinery, "Simerics MP+"

Fluid analysis for hydraulic circuits of heavy machinery, "Simerics MP+"

Fluid analysis software for gear pumps, vane pumps, and other positive displacement pumps! CFD software specialized for pumps that other CFD software struggles with!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsations and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vectors, pressure), flow rate, fluid forces, and torque The biggest strength is the ability to automatically create meshes even for clearances in the µm range, which is difficult for other general-purpose fluid analysis software!! Recently, there has been an increase in achievements for oil pumps used in automobiles and construction machinery, with examples such as vane pumps for power steering and CVTs, and trochoidal pumps for engine lubrication becoming more common. *There is a lot of information that cannot be posted online. Especially, the actual mesh creation and movement should definitely be demonstrated in a live demo!!

  • Thermo-fluid analysis

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Thermal Fluid Analysis CAE Contract Analysis Service

Thermal Fluid Analysis CAE Contract Analysis Service

From electronic devices to architectural environment design! We provide analysis services tailored to your company's needs!

We offer paid airflow, thermal, and environmental analysis services using our software "FlowDesigner." We analyze invisible air flows, temperature distributions, and contamination distributions in spaces through computer simulations. ◆ Recommended for the following customers! ◆ - I want to eliminate temperature unevenness indoors and achieve energy savings! - I want to know the current ventilation situation! - I want to create proposal materials for new technical sales! - I was asked by a customer to submit analysis results, but... - I want to explain design proposals and improvement plans clearly to customers! - I don't have the resources to conduct thorough simulations in-house. ◆ Software Used ◆ FlowDesigner Our specialized staff will quickly resolve your concerns! Leave everything from model creation to output to us!

  • Other contract services

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Analysis of electronic circuits and components

Analysis of electronic circuits and components

Solving customer problems with advanced analysis and "analytical skills"! Introducing case studies of electronic circuit board analysis.

"Analysis of electronic substrates and components" offers surface analysis methods tailored to the customer's desired level of understanding. By utilizing various techniques, including FT-IR (reflective method and ATR method), XPS surface analysis, and AES depth analysis, we have resolved issues related to the copper surface of electronic substrate wiring patterns. 【Case Studies of Electronic Substrate Analysis (Wiring Patterns)】 ■ FT-IR (Reflective Method and ATR Method) ■ XPS Surface Analysis ■ AES Depth Analysis ■ TOF-SIMS Analysis ■ Thermal Decomposition GC/MS *For more details, please download the PDF or feel free to contact us.

  • Analytical Equipment and Devices
  • Contract Analysis

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Technical Service Proposal for Power Products: Case Studies in Electrical Analysis

Technical Service Proposal for Power Products: Case Studies in Electrical Analysis

Quality UP! Efficiency UP! Trust UP! Proposals centered around technology and reduction of total costs.

By utilizing the electromagnetic field analysis simulator Q3D Extractor (Q3D), the quality of power line layout design can be enhanced. Design verification combined with waveform measurements for validation is also possible. Improve quality with substrate design that considers low inductance for high current paths! Increase efficiency with feedback from switching waveform evaluation to substrate design! Trust is enhanced through improved consistency via actual measurements and simulation model fitting! For more details, please download the catalog or contact us.

  • Other analyses

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Report: Detailed Structural Analysis of the MDM9235 Modem Logic

Report: Detailed Structural Analysis of the MDM9235 Modem Logic

Detailed structural analysis of the 20 nm HKMG Qualcomm Gobi.

This report is a detailed structural analysis (LDSA) of the 20 nm node Qualcomm MDM9235 modem. The MDM9235 is the fourth generation Qualcomm Gobi 9x35 series modem and is the first modem from Qualcomm manufactured using a 20 nm CMOS process. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. The MDM9235 is manufactured by TSMC using 10 layers of metallization (9-Cu, 1-Al), with 20 nm node high-k metal gate (HKMG) transistors fabricated on a bulk silicon substrate using a gate length process. It features a minimum contacted gate pitch of 90 nm. 【Features】 ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

  • Analysis Services

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Analysis using the sequencer "PacBio RSII/Sequel"

Analysis using the sequencer "PacBio RSII/Sequel"

We support samples with a wide range of GC content! For species where whole genome analysis is challenging, please feel free to consult us.

The "PacBio RSII/Sequel" is a sequencer that can obtain long reads. The long-read sequence data obtained not only facilitates the assembly of De novo whole genome sequencing but also contributes to structural analysis of genomes and identification of isoforms of transcripts. By utilizing our diverse range of short-read/long-read sequencers, we provide suitable solutions for whole genome analysis of various organisms. Please feel free to consult us regarding species for which whole genome analysis is challenging. 【Features】 ■ Adopts single-molecule real-time technology to achieve long reads ■ Capable of sequencing at the single-molecule level ■ Compatible with genomes of a wide range of GC content ■ Provides suitable solutions for whole genome analysis of diverse organisms *For more details, please refer to the related links or feel free to contact us.

  • Other contract services

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Wafer surface analysis

Wafer surface analysis

Data collection can be done in a short time! No pre-treatment is required, and samples can be reused.

Our company offers wafer surface analysis using the KLA-Tencor "Candela CS-10V." The Candela can detect microscopic defects as image data. Both the defect occurrence map and the status of individual defects can be observed. The target materials are sapphire, SiC, GaN, and other compound semiconductors, with applicable sizes ranging from φ2 inches to φ6 inches wafers (thickness less than 1mm). 【Features】 ■ Measurement data can be collected in a short time ■ No pre-treatment is required, and samples can be reused ■ Detection of microscopic defects that cannot be confirmed with an electron microscope ■ Applicable sizes: φ2 inches to φ6 inches wafers (thickness less than 1mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis
  • Other analyses

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CFD (Computational Fluid Dynamics) thermal fluid analysis

CFD (Computational Fluid Dynamics) thermal fluid analysis

Visualize fluid flow and temperature distribution! We will conduct analysis using Ansys Icepak to assist in your design.

In modeling for cooling targets, when designers repeat the process of design → prototyping → measurement through experiments → redesign → prototyping based on their experience, it leads to wasted time and costs. In short, CFD analysis is necessary to eliminate that waste. In CFD, as long as the input parameters are provided, calculations are performed automatically, allowing for the visualization of fluid flow and temperature distribution. Our company conducts analysis using Ansys Icepak to assist in the design process. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Thermo-fluid analysis

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[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis

[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis

XRD measurements in micro areas are possible.

We will introduce a case where XRD measurements were conducted by narrowing the X-ray beam to Φ400μm, allowing us to obtain crystal information targeting a specific area rather than the entire surface. In the XRD measurement results of the printed circuit board sample, Cu and BaSO4 were detected at all measurement points (1) to (3), and a peak from Au was detected at the measurement point (1), which is the electrode. This aligns well with the results from XRF measurements. Thus, it is possible to identify crystal structures by targeting regions of several hundred micrometers with different compositions and crystallinities. Measurement methods: XRD, XRF Product fields: LSI, memory, electronic components Analysis purposes: Composition evaluation, identification, structural evaluation For more details, please download the materials or contact us.

  • Contract Analysis

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Panasonic ReRAM 8-bit microcontroller structural analysis

Panasonic ReRAM 8-bit microcontroller structural analysis

Panasonic ReRAM-equipped MN101LR05D 8-bit microcontroller

The MN101LR05D is a low-power 8-bit single-chip microcontroller developed for portable healthcare, security devices, and sensor processing. The MN101LR05D features a CPU core with a 10MHz 8-bit AM13L, 64KB of ReRAM capacity, and 4KB of SRAM capacity. The MR101LR05D is the world's first mass-produced practical example of ReRAM (Resistive RAM), and it is expected to be widely utilized as a successor technology to existing non-volatile memory. The MN101LR05D is manufactured using a 180nm CMOS process with four layers of AI metallization. The ReRAM cell of this metal oxide is formed between stack W vias connecting metal 3 to metal 4. The results of the report are based on data from scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy-dispersive X-ray analysis (TEM-EDS), electron energy loss spectroscopy (TEM-EEKS), and spreading resistance measurement (SRP).

  • Other electronic parts

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SOLIDWORKS Flow Simulation Heat Conduction Analysis

SOLIDWORKS Flow Simulation Heat Conduction Analysis

White paper available!! "Heat conduction analysis that cannot be learned in engineering school"

The use of fluid dynamics (CFD) is no longer limited to experts. A new class of CFD analysis software called "concurrent CFD" has proven to be highly effective for thermal conduction analysis, enabling mechanical engineers to make key decisions quickly on their workstations without the need for CFD specialists. This intuitive process, integrated into a 3D CAD environment, allows designers to optimize products during the design phase, reducing manufacturing costs across a wide range of mechanical design and systems. *For more details, please refer to the materials. Feel free to contact us as well. ▼ The white paper can be downloaded from the link below ▼

  • 3D CAD
  • Other CAD
  • Other CAD related software

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FEM (Finite Element Method) Contract Analysis Service

FEM (Finite Element Method) Contract Analysis Service

At Benkan Kiko, we offer services such as strength analysis using FEM (Finite Element Method).

The various special fittings for processes handled by Benkan Kiko require more diverse specifications than commonly used and sold pipe fittings. In particular, pressure resistance performance is a crucial characteristic for ensuring the behavior and safety of pipe fittings under high pressure. Pressure resistance is secured by optimizing the shape and dimensions of the pipe fittings, and one of the design methods used is FEM analysis. This service includes the following main contents: - Design support for piping materials such as pipe fittings using FEM analysis ▻ Design of special-shaped pipe fittings (replacement from cast piping materials in high-pressure environments, etc.) ▻ Evaluation of pressure resistance performance of existing pipe fittings ▻ Manufacturing of special fittings (support from material procurement to manufacturing, testing, inspection, and shipping) - Various responses are possible by combining with our proprietary technology. For inquiries, please first contact our sales representative or use the web inquiry form on our website. From the initial meeting, a dedicated representative from our technical headquarters will respond, allowing you to directly reflect your requests in the analysis results. We can accommodate various meeting formats, including on-site visits, visits to our company, and web conferences (Zoom, MS Teams, etc.). Please feel free to consult with us.

  • Pipe Fittings
  • Beverage Production Equipment
  • Wastewater/wastewater treatment equipment

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Migration to .NET using tools

Migration to .NET using tools

30 domestic achievements! Support for Windows 7/Internet Explorer has ended, and action is required.

Is the Visual Basic 6 / Classic ASP system still not operational? We recommend migrating to .NET using our tools. Our migration service can convert everything into source code. Additionally, it supports many third-party libraries, allows for verification of each screen display, and enables switching from IE to Chrome. 【Benefits of Migration】 ■ Migration is possible even without design documents, as long as the source code is available. ■ Costs are less than half of what it would be to rewrite manually. ■ The migration period is short. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other information systems

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Deformation analysis under various stress conditions using X-ray CT.

Deformation analysis under various stress conditions using X-ray CT.

Tracking 'changes'! Providing valuable data for understanding degradation mechanisms through internal structure change analysis.

We conduct deformation analysis under various stress conditions using X-ray CT. By combining three-dimensional data from X-ray CT with simulations, we provide valuable data for elucidating degradation mechanisms through the reproduction of deformation processes under external stress and analysis of internal structural changes during product use via in situ measurements. Please feel free to contact us when needed. 【Case Studies (Partial)】 <Visualization of Internal Stress Using Simulation (Deformation of PE Containers)> ■ Combined with simulations modeling the amount and direction of load ■ Investigated the causes of crack and deformation occurrences by comparing the internal shapes before and after testing with simulation results using the same sample. *For more details, please refer to the PDF materials or feel free to contact us.

  • Company：KRI
  • Price：Other
  • Structural Analysis

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