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721～735 件を表示 ／ 全 1075 件
Fanless open frame panel PC equipped with Intel Atom processor
ADLINK's smart panel is an embedded open-frame panel computer that can be integrated into a wide range of form factors and configurations. The smart panel offers various display sizes, touch types, DC inputs, and types of I/O, allowing it to meet diverse vertical conditions. General-purpose modules can expand I/O regardless of type or quantity.
3U CompactPCI Quad-Core Intel Atom Processor X Series Blade
The ADLINK cPCI-3630 series is a 3U CompactPCI 2.0 processor blade equipped with a 64-bit Intel Atom processor X series SoC (formerly code-named: Apollo Lake I) and up to 8GB of soldered DDR3L-1600 MHz ECC memory. Available in a single-slot (4HP) or dual-slot (8HP) width form factor, the cPCI-3630 series offers a wide range of I/O capabilities using various daughter boards. The faceplate I/O of the single-slot (4HP) version includes 1 x USB 3.0, 2 x RJ-45 GbE, and 1 x VGA port (common to all versions).
![Fanless Embedded Computer [MVP-6100]](https://image.mono.ipros.com/public/product/image/11f/2000506569/IPROS64944563764260325710.jpeg?w=280&h=280)
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 and 8th Generation Celeron Equipped Expandable Computer
The ADLINK MVP-6100 series, featuring a 9th generation Intel Core processor, is a fanless embedded computing platform optimized for edge computing applications. The MVP-6100 series integrates high-performance computing, scalable features and enhanced I/O, and industrial-grade reliability into a compact fanless platform, providing reliable long-term operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 Processor Equipped Expandable Edge GPU Computer
GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, accelerating computations, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming more mainstream to achieve optimal efficiency in performance per watt and per dollar.
Extended fanless embedded computer
This is an embedded fanless computer equipped with 9th generation Intel Xeon, Core i7/i3, and 8th generation Intel Core i5 processors. It is ideal for applications such as factory and machine automation, surveillance, railways, marine automation, and vehicle traffic systems.
![Integrated Fanless Embedded Computer [MXE-310]](https://image.mono.ipros.com/public/product/image/68d/2001535375/IPROS12879384534290280990.jpg?w=280&h=280)
Compact edge computing platform equipped with 13th generation Intel Core processors.
The MXE-310 is a cost-effective, fanless, and expandable edge computing platform equipped with 13th generation Intel Core i7/i5/i3 processors. Designed to deliver high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers a rich array of connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, catering to various industrial applications. Additionally, it features multiple I/O expansion options, including M.2 slots (B-Key, E-Key, M-Key) and adaptive function modules, along with a wealth of I/O interfaces such as 16-bit DIO, four COM ports, and optional CAN bus. Furthermore, the MXE-310 integrates TPM 2.0 for enhanced security and supports EdgeGO remote management and control software for easy operation and maintenance.
![Integrated Fanless Embedded Computer [MXE-1500 Series]](https://image.mono.ipros.com/public/product/image/cbe/2001535430/IPROS14288723075578432421.png?w=280&h=280)
Fanless embedded computer equipped with Intel Celeron N3160/N3060 processor.
The MXE-1500, the successor to ADLINK's best-selling MXE-1300 series, offers a more compact I/O interface and more flexible I/O configuration in the same compact chassis. The Intel Celeron (Braswell) processor, which is Intel's latest generation CPU supporting Windows 7, improves the image processing capabilities of the MXE-1500 by 90% over the previous generation and supports three independent displays, making the MXE-1500 ideal for industrial automation applications and mass transit operators.
![Integrated Fanless Embedded Computer [MXE-5600 Series]](https://image.mono.ipros.com/public/product/image/b06/2001535432/IPROS17359893736638759739.jpeg?w=280&h=280)
Fanless embedded computer equipped with 9th generation Intel Xeon, Core i7/i3, and 8th generation Intel Core i5 processors.
The MXE-5600 series is compact in size but equipped with rich I/O features. It features two DP++, HDMI, two GbE, six COM, 8-channel DI, 8-channel DO, and TPM 2.0. Additionally, it includes USB 3.1 Gen2 x2, USB 3.1 Gen1 x2, and USB 2.0 x4, as well as two 2.5" SATA 6 Gb/s, CFast, and M.2 2280 storage options to support a wide range of applications.
12th/13th/14th generation Intel Core i3/i5/i7/i9 equipped integrated embedded computer
The industrial fanless embedded PC MVP-3100 is a robust and high-performance fanless embedded computer equipped with Intel's 12th, 13th, and 14th generation Core i3/i5/i7/i9 CPUs (LGA 1700 socket). It is designed for 24/7 operation in harsh environments and achieves the following: - Robust heat resistance: Operates smoothly from -20°C to 60°C, maintaining performance even under extreme temperature conditions. - Scalable modular I/O: Equipped with ADLINK's AFM (Adaptive Function Module) slot, allowing for system customization with custom I/O and application-specific connectivity. - MVP barebone solution: The chassis and motherboard are separated, enabling rapid system construction based on end-user requirements, reducing lead time. - Clear and intuitive graphical SOP documentation allows for easy and efficient assembly/disassembly. Assembly, installation of the CPU and other components, and upgrades of memory and storage are straightforward.
Expandable embedded computer equipped with 12th/13th/14th generation Intel Core i3/i5/i7/i9.
The industrial fanless embedded PC MVP-3100 is a robust and high-performance fanless embedded computer designed for 24/7 operation in harsh environments, equipped with Intel's 12th/13th/14th generation Core i3/i5/i7/i9 CPUs (LGA1700 socket). - Robust heat resistance: Operates smoothly from -20°C to 60°C, maintaining performance even under severe temperature conditions. - Scalable modular I/O: Equipped with ADLINK's AFM (Adaptive Function Module) slot, allowing customization of the system with custom I/O and application-specific connectivity. - MVP barebone solution: The chassis and motherboard are separated, enabling rapid system construction based on end-user requirements, reducing lead time. - Flexible expandability: Supports various module configurations with ADLINK's AFM (Adaptive Function Module) slot. - Clear and intuitive graphical SOP documentation allows for easy and efficient assembly/disassembly. Assembly, installation of the CPU and other parts, and upgrades of memory and storage are straightforward.
3.5-inch single-board computer equipped with Intel Core Ultra processor
The ADLINK SBC35-MTL is a compact 3.5-inch single board computer equipped with an Intel Core Ultra processor. It features an integrated NPU that enhances AI processing capabilities and a reserved MIPI-CSI signal path that facilitates camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor. Additionally, ADLINK's SBC35 series enhances system functionality through SBC-FM Adaptive Function Modules, which offer flexible I/O expansion and customer-driven customization. These modules are specifically designed for the SBC35 series and include reserved connectors such as PCIe, USB, and LPC/eSPI. They seamlessly integrate with the mainboard through FPC cables, either vertically or in parallel. This not only ensures a rational design but also provides high thermal resistance even under harsh conditions.
![[Case Study] NXP's Smart Factory AI Vision and Predictive Maintenance](https://image.mono.ipros.com/public/product/image/9d0/2001537873/IPROS61978210017689128.jpg?w=280&h=280)
NXP Smart Factory x ADLINK: Maximizing Yield with AI Vision Inspection
**Case Study Introduction** NXP's factory is working on transforming smart manufacturing with the ultimate goal of achieving predictive maintenance through AI-enabled edge computing and advanced cloud-based data analytics. Initially, the factory faced issues with unstable system performance, leading to unexpected downtime and requiring manual recovery on-site. This directly interrupted the production process and resulted in material losses. To address these challenges, the factory replaced the HMI with an Automated Optical Inspection (AOI) system, enabling real-time remote monitoring to improve overall efficiency and yield. Through strategic partnerships, appropriate edge computing and industrial display solutions were quickly identified. This collaboration was supported by high expertise in the industrial sector, significantly reducing the burden of research and development, lowering implementation costs, and shortening time to market. For more details, please download the case study.
![[Case Study] Comprehensive Integration of cPCI & VPX](https://image.mono.ipros.com/public/product/image/323835/IPROS12345627624481834883.jpg?w=280&h=280)
Mission-ready system for Airborne Early Warning and Control (AEW&C) to operate in harsh environments.
This case study reveals the requirements for an Airborne Early Warning and Control (AEW&C) mission in real-world environments—high-performance processing capabilities, ultra-low latency, and robust communication performance across all domains. It also introduces the key challenges faced when deploying these systems and how ADLINK's robust VPX computing solutions address them. Please download the case study for more details.
Supports LPDDR4-4266! Maximum memory of 32GB.
The "HFMB-600T" is a small-sized CPU board from the 11th generation Intel(R) Core(TM) processor family. It features built-in Intel(R) Iris(R) Xe graphics with remarkable image processing performance. Using the Intel(R) Ethernet Controller i225, it is equipped with 3 LAN channels to support a wide range of applications. 【Features】 ■ 11th generation Intel(R) Core(TM) processor family (Tiger Lake UP3) ■ Supports LPDDR4-4266 with a maximum memory capacity of 32GB (In-Band ECC supported) ■ Built-in Intel(R) Iris(R) Xe graphics with remarkable image processing performance ■ Capable of fanless systems with a wide temperature range ■ Uses Intel(R) Ethernet Controller i225 ■ Equipped with 3 LAN channels to support a wide range of applications *For more details, please refer to the PDF document or feel free to contact us.
High-performance Android-equipped HDMI dongle computer!
● Simply connect to HDMI to realize an Android device. Compact and lightweight, easy to carry. ● When connected to a large screen TV, you can view photos and videos on a big screen. ● Equipped with a high-performance Dual-Core CPU, ideal for digital signage. ● Automatic startup and playback of videos and images (optional). ● Content can be swapped using an SD card or USB memory. ● Internet access anywhere via Wi-Fi connection. ● Comes with AC adapter and HDMI extension cable.
