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core Product List and Ranking from 30 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

core Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. 昭和丸筒 Osaka//Paper and pulp
  2. 日本継手 Tokyo//Manufacturing and processing contract 東京営業部
  3. デザイン・ゲートウェイ Tokyo//Electronic Components and Semiconductors
  4. 4 DIAMET CORPORATION Niigata//Machine elements and parts
  5. 4 山本精機 Nagano//Manufacturing and processing contract 本社、THAI工場

core Product ranking

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Dual-structure core for reducing roll tendency and shaft diameter conversion (Lotus Core) 昭和丸筒
  2. Core joint C core / CD core 日本継手 東京営業部
  3. Motor core by vacuum impregnation and lamination. 山本精機 本社、THAI工場
  4. 4 Nessum (formerly HD-PLC) IP core Panasonic Holdings Corporation / Nessum Department
  5. 5 Soft magnetic material laminated motor core

core Product List

61~75 item / All 245 items

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LDPC IP core

We provide a total solution for LDPC codes, from system design and computer simulation evaluation to IP macros.

LDPC (Low Density Parity Check) symbols LDPC symbols have error correction capabilities that are extremely close to the Shannon limit, and they are error correction codes that enable high-speed processing of codes through parallel processing. Features of Mobile Tech's LDPC Symbol Total Solution We provide Encoder/Decoder IPs with optimal configurations based on the required performance (circuit scale/througput) that support standard LDPC codes as well as customer-specific LDPC codes, and we also design and support peripheral modules to maximize performance.

  • Other network tools

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Toroidal Core T-50-0 / Micrometals

"Iron powder (ferrous powder) core" 【T-50-0】

This is the iron powder core "T50-0" manufactured by Micrometals, which has a protective coating.

  • High frequency/microwave parts

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Northwest Logic's IP cores for FPGA and ASIC.

Achieving high performance and high quality of standalone controller IP cores, in collaboration with PHY IP vendors and verification IP vendors!

Northwest Logic has been providing controller IP cores focused on memory interfaces, MIPI, and PCI Express since its establishment in 1995. For memory interfaces, we offer a wide range of controllers including HBM2, DDR4/3, and LPDDR4, as well as CSI-2 and DSI-2/DSI for MIPI, and Gen4/3 for PCI Express. Our customizable IP cores are equipped with the full functionality of each protocol and are compatible with both ASIC and FPGA platforms. In addition to achieving high performance and quality for standalone controller IP cores through extensive simulation and hardware verification, we also focus on collaboration with PHY IP vendors and verification IP vendors, enabling us to provide total solutions for customers looking to integrate memory interfaces, MIPI, and PCI Express functionalities into their systems. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other network tools
  • Other embedded systems (software and hardware)

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Diamond End Mill for Processing Honeycomb Core Laminated Composites

Diamond tools suitable for all laminated composite materials.

The "Diamond End Mill" is suitable for all laminated types of composite materials. It is compatible with carbon-based, glass fiber-based, S-glass-based, Kevlar, phenolic, and of course, titanium and aluminum-based materials. When using this diamond tool, it is recommended to operate at high speeds, with high feed rates, and to keep the depth of cut small, which will extend tool life. When processed under recommended conditions, it can achieve up to 50 times the tool life compared to carbide tools. 【Features】 ■ Suitable for all laminated types of composite materials ■ Compatible with glass fiber-based, S-glass-based, Kevlar, phenolic, titanium, and aluminum-based materials ■ Tool life is extended by operating at high speeds, high feed rates, and keeping the depth of cut small ■ Up to 50 times the tool life compared to carbide tools *For more details, please refer to the PDF document or feel free to contact us.

  • Other cutting tools
  • Other work tools

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Laminated motor core

The thinner the laminated board material, the better the motor characteristics! Mass production is possible down to a thickness of 0.2mm.

We would like to introduce our "laminated motor cores." At our company, we manufacture motor cores using a riveting method, which improves motor characteristics as the laminated plates become thinner. The core (iron core) is the pathway for magnetic flux, and laminated cores are used in rotor iron cores that make up the armature circuit, utilizing the characteristic of changing magnetic flux with rotation. Please feel free to contact us when you need assistance. 【Riveting Method】 ■ A method of joining two or more parts by riveting and pressing ■ The processes after pressing can be automated ■ Can be supplied at a lower cost compared to other methods ■ Applications: for robots, automobiles, and medical devices *For more details, please refer to the related links or feel free to contact us.

  • Other motors

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エポキシフォーム 発泡コア

より軽く、より自由に、複合材料に新たな可能性を! 樹脂開発とプロセス開発により、ユニークな特徴を持ったエポキシフォームを実現

【特長】 ■偏肉成形 ■3D成形 ■極薄成形(0.1mm~) ■熱変形加工 ■柔軟性 ■高耐熱 ■発泡倍率制御 ■機能性付与 ■CFRPと一体成形 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Composite Materials
  • others

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FPGA-compatible MECHATROLINK communication IP 'SYM3A'

Mechatrolink communication macros can be implemented on intel-FPGA.

This is a soft IP that enables the implementation of the MECHATOROLINK-III communication protocol on FPGA. It flexibly accommodates the addition of various interfaces and peripheral circuits, which are features of FPGAs, and allows for easy design integration using the GUI of the Qsys system integration tool. The basic functionality of this IP is equivalent to Yaskawa Electric's JL-100/JL-102. It is easy to build an evaluation environment by combining the Macnica Sodia board with our SY-M3-03 board. High functionality and high-speed processing are achieved through cooperative operation between the ARM Cortex-A9 and user circuits (ARM is used when employing Intel FPGA SoC). * Operation has been confirmed on the Macnica Sodia-Cyclone V ST SoC evaluation board. ■ Supports C1 master/slave/multi-slave configurations ■ Netlist provided as a Soft-IP core ■ MECHATROLINK-III certification obtained

  • Other semiconductors

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