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film(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
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film Product List

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Insulating adhesive film for high-frequency, high-speed transmission FPC and rigid circuit boards

Insulating adhesive film for high-frequency, high-speed transmission FPC and rigid circuit boards

Thin films and high-insulation adhesive films that respond to the high-frequency, thin, and compact trends in semiconductors and passive components.

The "High Frequency and High-Speed Transmission FPC and Rigid Circuit Board Insulating Adhesive Film" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Adfrema." This film has excellent low dielectric constant and low dielectric loss tangent, making it ideal for high-frequency characteristics in the GHz range. It features good filling properties for uneven surfaces at low temperature and low pressure, and it can exhibit high adhesion and high heat resistance in its unreacted state as a thermosetting resin film. In addition to being used as an interlayer insulating material and build-up material for FPCs, it is also suitable as a MEMS structural material and process material, and it is compatible with laser and plating processing. 【Features】 - Low dielectric constant and low dielectric loss tangent - Thin layer insulation: 5 to 30 µm thickness - Excellent filling properties for uneven surfaces at low temperature and low pressure - Thermosetting resin film - Suitable for laser and plating processing *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • glue

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FPC release PBT film

FPC release PBT film

It has excellent heat resistance, release properties, and conformability, making it suitable for FPC release applications.

It excels in both cold forming and hot forming properties, making it suitable not only for lithium-ion battery (LiB) packs, deep drawing substrates, and molding tray substrates, but also for industrial and commercial applications such as embossing, in-mold processing, process paper, and protective films. 【Features】 ■ Excellent release properties ■ Low outgassing ■ Practical level of heat resistance and conformability *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Low dielectric bonding film AlonMighty AF-700 series

Low dielectric bonding film AlonMighty AF-700 series

Excellent low dielectric properties and adhesion. For bonding high-speed transmission substrate materials such as mobile FPCs, including smartphones.

The "Aromite AF-700 Series" is a thermosetting bonding film that boasts industry-leading low dielectric constant and low dielectric loss tangent. It effectively suppresses transmission loss in high-frequency ranges, making it suitable for electronic material applications. It is used in bonding high-speed transmission substrate materials, such as flexible printed circuit boards (FPC) for mobile devices, including smartphones. It demonstrates excellent adhesion to difficult-to-bond substrates like polyimide and LCP, and offers good processability in FPC manufacturing. Customization is available upon request. 【Features】 ■ Low water absorption rate, maintaining high adhesive strength even in humid heat environments ■ Suitable as a bonding film for multilayer FPCs and adhesive layers for FCCL and coverlay ■ Also adopted for automotive millimeter-wave radar and antenna materials for base stations *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Conductive bonding film + bonding with SUS

Conductive bonding film + bonding with SUS

Conductive bonding film + SUS material allows external extraction of FPC's GND.

Conductive bonding films have adhesive layers that possess conductivity, which provides features such as wide-band shielding characteristics, stable electrical connections, and adhesion to various substrates. Therefore, when bonding a reinforcing plate to an FPC that involves component mounting, such as in camera modules, it is possible to impart shielding performance. Additionally, using metal reinforcing plates like SUS allows for electrical connection between the FPC's GND circuit and the metal reinforcing plate, thereby providing shielding performance. Meisei Electric has extensive experience in processing thermosetting conductive bonding films and SUS. The bonding of the bonding film and SUS can be done neatly using our in-house vacuum press machine, where we can control the temperature, vacuum time, pressure force, and duration. Furthermore, after bonding, circuit formation is possible through punching processing with the press machine. For tape processing products, we can propose optimal processes and methods tailored to your requirements, such as work size and product arrangement, which can lead to reduced processing time for customers and provide cost benefits. If you have any interest or inquiries, please feel free to contact us.

  • Other electronic parts
  • Processing Contract
  • Other polymer materials

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Super heat-resistant and super cold-resistant polyimide film "Kapton(R)"

Super heat-resistant and super cold-resistant polyimide film "Kapton(R)"

Ultra heat-resistant and ultra cold-resistant polyimide film capable of withstanding temperatures from -269 to 400°C.

**Capton® Lineup** ■ H Type ... Standard type of polyimide film Capton® ■ V Type ... Low thermal shrinkage type Capton® V type utilizes the characteristics of H type and improves dimensional stability, resulting in a film with low thermal shrinkage. ■ EN Type ... High dimensional stability type Capton® EN maintains the basic characteristics of conventional Capton® while dramatically improving dimensional stability. ■ F Type ... Teflon® coated type A film coated with Teflon® FEP on H type, providing heat sealability. It also has excellent resistance to acids and alkalis. ■ Special Type ... Special polyimide film produced by DuPont in the United States. *Capton® and Teflon® are registered trademarks of DuPont.*

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Electromagnetic wave shielding film for flexible substrates

Electromagnetic wave shielding film for flexible substrates

It is an electromagnetic wave shielding film for small mobile devices. It has excellent shielding properties, flexibility, and heat resistance.

■Shielding characteristics: 60 dB or more (1 GHz) ■Conductivity: 200 MΩ/□ or less ■Adhesion (to polyimide): 3.0 N/cm or more ■Heat resistance: Good heat resistance for solder reflow (260°C) ■Chemical resistance: IPA/Acetone/MEK/HCl/NaOH ■Product thickness: 22 μm, 18 μm, 12 μm

  • Adhesive tape
  • Other metal materials
  • Composite Materials

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5G LCP FCCL "SAR25C12"

5G LCP FCCL "SAR25C12"

Next-generation high-speed communication 5G, automotive millimeter-wave radar, FPC for LiDAR, FCCL applications.

**Product** 5G LCP FCCL "SAR25C12" **What is SAR25C12** As the frequency increases, the amount of information that can be transmitted per unit time can be accelerated and made larger. For next-generation high-speed communication, it is effective that the dielectric loss decreases as the dielectric constant and dielectric loss tangent of the FPC material decrease. In addition to these excellent electrical characteristics of low dielectric constant and low dielectric loss tangent, LCP, which also has low moisture absorption, heat resistance, and a coefficient of thermal expansion comparable to metals, as well as moldability, is an essential resin material for next-generation high-speed communication. The liquid crystal polymer film flexible copper-clad laminate "SAR25C12" is a groundbreaking product that leverages its excellent compatibility with copper foil for insulation film applications in flexible printed circuits (FPC). **Features of LCP** - Excellent electrical properties at high frequencies - Excellent heat resistance - Insulating substrate with thermal conductivity - Low moisture absorption (low dielectric) - Thermoformability at 250°C - Gas barrier properties - Anisotropic *For more details, please refer to the PDF document or feel free to contact us.*

  • others
  • Other polymer materials

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[Electromagnetic Wave Noise Countermeasure Product] Electromagnetic Wave Suppression Film 'PCF-005'

[Electromagnetic Wave Noise Countermeasure Product] Electromagnetic Wave Suppression Film 'PCF-005'

RoHS compliant! Suitable for products that require space-saving, such as digital cameras.

We would like to introduce our electromagnetic wave suppression film, 'PCF-005'. The thin polymer layer suppresses electromagnetic wave noise in the MHz frequency range. It is very flexible, making it suitable for application on FPC cables and similar products. It is ideal for products that require space-saving solutions, such as smartphones, tablets, mobile phones, and digital cameras. 【Features】 ■ The thin polymer layer suppresses electromagnetic wave noise in the MHz frequency range ■ Very flexible, making it suitable for application on FPC cables and similar products ■ Ideal for products that require space-saving solutions, such as smartphones, tablets, mobile phones, and digital cameras ■ Compliant with RoHS directives *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Ultra-thin polyimide film "Kapton 20EN"

Ultra-thin polyimide film "Kapton 20EN"

A 5μm thick film that contributes to the lightweighting of electronic devices! Ideal for heat dissipation tape as well.

"Capton 20EN" is a polyimide film that has successfully been developed with a thickness of 5μm. It enables the reduction of rebound in FPCs, as well as the lightweight, compact, and thin-film design of electronic devices. Due to its low thermal resistance, it is also ideal for heat dissipation tape. 【Features】 ■ Successful development of 5μm thickness ■ Enables reduction of rebound in FPCs, lightweight, compact, and thin-film design of electronic devices ■ Low thermal resistance ■ Ideal for heat dissipation tape *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other polymer materials

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[Research Material] Global Market for FEP Coated Polyimide Films

[Research Material] Global Market for FEP Coated Polyimide Films

Global Market for FEP Coated Polyimide Films: Flexible Printed Circuits (FPC), Special Processed Products, Pressure-Sensitive Tapes, Wires & Cables...

This survey report (Global FEP-coated Polyimide Film Market) investigates and analyzes the current status and outlook for the global market of FEP-coated polyimide films over the next five years. It includes information on the overview of the global FEP-coated polyimide film market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the FEP-coated polyimide film market include flexible printed circuits (FPC), specialty products, pressure-sensitive tapes, wires & cables, and motors/generators, while the segments by application cover electronics, automotive, aerospace, labeling, and others (medical, drilling). The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FEP-coated polyimide films. It also includes the market share of major companies in the FEP-coated polyimide film sector, product and business overviews, and sales performance, among other details.

  • Other services

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Biaxially stretched PBT film for industrial/industrial use

Biaxially stretched PBT film for industrial/industrial use

Excellent resistance to pinholes, moldability, processability, heat and cold resistance, acid resistance, and release properties! A high-performance film that can be widely used in industrial and pharmaceutical food sectors.

The "Two-Axis Stretched PBT Film for Industrial Use" is a high-performance film that excels in heat resistance, release properties, and conformability, making it suitable for various industrial applications. 【Features】 ▼ A stretched polyester film made from PBT (polybutylene terephthalate) resin, which has pinhole resistance comparable to nylon (bending, abrasion, puncture, impact). ▼ Contributes to environmental efforts such as reducing plastic volume, CO2 emissions, and recycling costs due to its various functionalities. ▼ Excellent cold and heat formability, suitable for lithium-ion battery (LiB) packs, deep-drawing substrates, as well as decorative applications like embossing and in-mold processing. ▼ Low outgassing and excellent release properties, usable as release films for FPC, various process papers, and protective films. ▼ Currently being considered for building materials that require processability, heat resistance, and durability, as well as laminated steel sheets. ▼ Possesses heat sealability, with expectations for heat-resistant sealants, non-adhesive sealants, and monomaterial applications! *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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2020 KGK Exhibition Product List

2020 KGK Exhibition Product List

We would like to introduce the exhibited products of KGK Joint Research Chemical Co., Ltd.!

Exhibition Name: 12th International Car Electronics Technology Exhibition https://www.car-ele.jp/ja-jp.html 【Exhibited Products List】 - Insulating film for 5GFPC FCCL LCP liquid crystal polymer film "SARAS"

  • Engineering Plastics
  • Other semiconductors
  • Printed Circuit Board

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Panaprotect <Light Release Grade (Acrylic Type)>

Panaprotect <Light Release Grade (Acrylic Type)>

Adopted for various applications such as displays, semiconductors, printing, and nameplates! Introducing the light peel grade.

"Panaprotect Light Release Grade (Acrylic-based)" is a re-release adhesive film characterized by its heat resistance, adhesion, and re-release properties, featuring a special adhesive processing applied to plastic films such as polyester. It is used in various applications including processing carriers, printing, nameplates, displays, circuit boards, semiconductors, touch sensors, and building materials. We offer a range from low to medium adhesive products. Please feel free to contact us if you have any requests. 【Lineup (partial)】 <Super Light Release> ■TS ■HP ■CT *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
  • Other consumables

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No double-sided tape needed! Electrode integration with NISSHA IME.

No double-sided tape needed! Electrode integration with NISSHA IME.

Insert molding of electrode films and FPC! Integrating electrodes even in concave shapes and shapes with ribs and bosses.

With "NISSHA IME," functional electrodes can be integrated into the housing without using adhesives like double-sided tape. This achieves a seamless shape without joints. It is possible to securely fix electrodes and sensors in micro spaces through insert molding. This leads to benefits such as simplification of product structure, reduction in the number of parts, reduction in assembly processes, and improved reliability. 【Features】 ■ Fixes the substrate without using double-sided tape ■ Achieves thin and lightweight products ■ Integrates electrodes even in shapes with concave features, ribs, or bosses ■ Improves reliability ■ Accommodates difficult-to-bond micro spaces *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing
  • Other contract services
  • Circuit board design and manufacturing

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Industrial-grade biaxially stretched PBT film "ProBlet" *Samples available upon request

Industrial-grade biaxially stretched PBT film "ProBlet" *Samples available upon request

It is a high-performance film that can be widely used in various industrial fields. [Physical properties comparison chart available]

"ProBlet" is an industrial/industrial-use PBT film that applies "tubular simultaneous biaxial stretching technology." It has pinhole resistance comparable to nylon and excellent moldability, making it applicable in various industrial fields. It can also be used as a substitute for resins such as PTFE, contributing to cost reduction. 【Expected Applications】 ■ Release film for FPC * A film used in the thermal bonding process to protect circuits ■ Decorative transfer * Decorative transfer for automotive interior parts ■ Laminated type LiB * Especially for EVs <For more details, please refer to the PDF document or feel free to contact us.>

  • Printed Circuit Board

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