Conductive bonding film + bonding with SUS
Conductive bonding film and SUS bonding processing.
Conductive bonding film + SUS material allows external extraction of FPC's GND.
Conductive bonding films have adhesive layers that possess conductivity, which provides features such as wide-band shielding characteristics, stable electrical connections, and adhesion to various substrates. Therefore, when bonding a reinforcing plate to an FPC that involves component mounting, such as in camera modules, it is possible to impart shielding performance. Additionally, using metal reinforcing plates like SUS allows for electrical connection between the FPC's GND circuit and the metal reinforcing plate, thereby providing shielding performance. Meisei Electric has extensive experience in processing thermosetting conductive bonding films and SUS. The bonding of the bonding film and SUS can be done neatly using our in-house vacuum press machine, where we can control the temperature, vacuum time, pressure force, and duration. Furthermore, after bonding, circuit formation is possible through punching processing with the press machine. For tape processing products, we can propose optimal processes and methods tailored to your requirements, such as work size and product arrangement, which can lead to reduced processing time for customers and provide cost benefits. If you have any interest or inquiries, please feel free to contact us.
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basic information
【Material Sales】 ○ Thermosetting resin laminated sheets and molded sheets ○ Thermosetting resin laminated round bars and pipes ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics ○ Super engineering plastics ○ Copper-clad laminated sheets ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing】 ○ Precision punching processing (various laminated sheets, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ Functional film lamination processing ○ Optical film curved surface vacuum lamination processing ○ Contract development of jigs and devices ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
Adhesion of reinforcement plates when implementing smartphone camera modules, etc., onto FPC.
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.
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