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gasket Product List

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Spiral spring gasket

Spiral spring gasket

Excellent unidirectionality and flexibility! Corrosion resistance is available when needed, with the option of side plating on the board.

The "Spiral Spring Gasket" is a spiralized material made from high-tensile tin/nickel-plated beryllium copper or SUS plates, and it is an excellent electromagnetic wave shielding material. You can choose from various options such as the type of plate material, core material, side plating type, and O-Ring type. It is mainly used in semiconductor etching equipment, precision medical equipment, and communication equipment, where high electromagnetic wave shielding performance is required. 【Features】 ■ Excellent electromagnetic wave shielding effect of over 100 dB ■ Superior workability for Groove Mounting ■ Option for side plating of the plate when corrosion resistance is necessary ■ O-Ring type production is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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O-Ring Spiral Gasket

O-Ring Spiral Gasket

Selectable board materials, core material types, and side plating types! Excellent electromagnetic wave shielding effect.

The "O-Ring Spiral Gasket" is an electromagnetic wave shielding material made from high-modulus tin/nickel-plated beryllium copper or SUS plates that have been spiraled. It has excellent modulus and flexibility, and provides outstanding shielding effectiveness. It is suitable for electromagnetic wave shielding in circular connectors (Jam nut connectors). 【Features】 ■ Excellent electromagnetic wave shielding effectiveness of over 100dB ■ Precision and durability are excellent due to spot welding at joints ■ Easy groove mounting ■ Plating options available for the sides (cut edges) of the plates when corrosion resistance is required ■ Various sizes and materials can be selected *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other semiconductors

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SMT EMI gasket (PCB grounding pad)

SMT EMI gasket (PCB grounding pad)

Manufacturing is possible from a minimum of 0.5mm to a maximum of 25mm! A complete range of products by gasket size and material is available.

The "SMT EMI Gasket (PCB Ground Pad)" is a product designed to reduce electromagnetic noise generated from within electronic devices and protect circuits from electrical surges. The SMF01 series is manufactured using a method that wraps PU sponge with a conductive metal film. It is very soft, so it exerts almost no stress on the PCB. The SMF02 series is a small SMT EMI gasket composed of a silicone rubber core and a conductive metal surface layer, suitable for small IT devices such as mobile phones. 【Features】 ■ The SMF01 series is suitable for medium to small sizes, while the SMF0 series is suitable for ultra-small sizes. ■ A variety of materials can be selected to match the characteristics of the device. ■ Excellent electrical conductivity (resistance below 0.1Ω) and compression recovery rate (over 90%). ■ A combination of product materials and shapes ensures adhesion and minimizes stress on the PCB. *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Thermal Form Gas Gasket (TFG)

Thermal Form Gas Gasket (TFG)

Heat-resistant polyurethane foam is applied as the core material! The recovery rate and adhesion strength have also improved, resulting in excellent heat transfer effects.

The "Thermal Form Gasket (TFG)" is a thermal conduction component that transmits heat from a heat source (circuit element) to a heat sink or metal plate in a short time, allowing for wide diffusion of heat and reducing the temperature of the heat source. It uses graphite, which has excellent horizontal thermal conductivity (400W/mk). There are no thickness constraints, which are a disadvantage of silicone pads, allowing for a wide range of applications. 【Features】 - No need for a heat sink for heat dissipation (direct contact with the case or frame for heat dissipation) - Both the surface and sides of the graphite are wrapped in PET film to prevent particles from the graphite from being generated - Excellent elasticity means that excessive pressure does not need to be applied to the PCB, preventing bending - Various sizes and shapes can be manufactured according to application, making it easy to adjust thermal performance and hardness *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other process controls

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