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glue Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 積水フーラー Tokyo//Chemical
  4. 4 東亞合成 新製品開発事業部　機能性接着剤部 Tokyo//Chemical
  5. 5 味の素ファインテクノ Kanagawa//Chemical
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glue Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  2. Easy welding and bonding with adhesive! A versatile adhesive that works with any material.
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 A one-component heat-curing epoxy resin adhesive proposed by Ajinomoto Fine-Techno. 味の素ファインテクノ
  5. 5 Comprehensive Catalog "Industrial Adhesives" ノガワケミカル

glue Product List

571～585 item / All 1141 items

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Hot Melt Molding Case Study: "Sealing of IC Tags"

Hot Melt Molding Case Study: "Sealing of IC Tags"

Introducing a case where low melting viscosity hot melt was used for sealing IC tags.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent

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For waterproofing and dustproofing of electrical components. Hot melt molding.

For waterproofing and dustproofing of electrical components. Hot melt molding.

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

  • Processing Contract
  • Coating Agent
  • Other electronic parts

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Custom-made partition board

Custom-made partition board

We will design according to your requests, dimensions, and the shape for storage.

Used for transportation within the project, - Oil-resistant - Washable - Capable of supporting metal parts A sturdy partition... In response to these requirements, a partition as shown on the left was created using foam resin board.

  • Processing Contract

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Waterproof sealing of electrical components: Hot melt molding

Waterproof sealing of electrical components: Hot melt molding

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

  • Coating Agent
  • Circuit board design and manufacturing
  • Other electronic parts

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Suitable for sealing LED lighting, optical sensors, etc.! Colorless transparent hot melt.

Suitable for sealing LED lighting, optical sensors, etc.! Colorless transparent hot melt.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

A waterproof insert molding method that directly injects thermoplastic adhesives into electronic components! We have received many inquiries and requests in the past for applications such as LED lighting fixtures, decorative lighting, and optical sensors, but conventional materials had a strong yellow tint and issues with light transmittance. This time, we are introducing a material that not only supports low-pressure molding sealing of electronic components like traditional hot melts but also excels in light transmittance. <Expected products for use> - LED lighting equipment - Display devices using LEDs, etc. - Light-based sensors such as photo sensors and fiber sensors

  • Other polymer materials
  • Other electronic parts
  • Coating Agent

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Introduction video for waterproof sealing of electrical components using hot melt molding.

Introduction video for waterproof sealing of electrical components using hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

  • Other polymer materials
  • Coating Agent
  • Other electronic parts

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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Other electronic parts
  • Other semiconductors
  • Other optical parts

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"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Circular Connectors
  • Rectangular Connector
  • Automotive Connectors

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"Conductive Grade" Silver Epoxy

"Conductive Grade" Silver Epoxy

Ideal for semiconductor die attach and interconnection between modules and substrates.

The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.

  • Other electronic parts
  • Other semiconductors
  • IC tag

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Heat Resistance Grade

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Pack-4.JPG
  • Other electronic parts
  • Other Auto Parts
  • Other motors

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

While maintaining the high reliability characteristic of epoxy resin, it achieves rubber-like elasticity and stretch.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Rectangular Connector
  • Rectangular Connector
  • Automotive Connectors

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Free sample of ultra-flexible epoxy adhesive.

Free sample of ultra-flexible epoxy adhesive.

Growing rapidly!? Growth rate over 200%! We are giving away samples of our super flexible epoxy adhesive to 30 lucky winners! A collection of case studies you want to read before selection.

Growing rapidly!? Over 200% growth rate!? We are currently giving away samples of our super flexible epoxy adhesive to 30 lucky winners through a lottery! The NICBOND sample in this giveaway is our self-developed adhesive, a culmination of years of experience and accumulated knowledge in applied chemistry. In addition to our standard lineup products that cater to a wide range of applications, we also offer bespoke solutions tailored to meet the specific needs of our customers. We have samples available for various adhesives including conductive, insulating, halogen-free, heat-dissipating, heat-resistant, and super flexible types. These can be applied to devices requiring a wide range of functionalities such as conductive applications, heat dissipation, device assembly, motor assembly, and connector assembly. *If you would like a sample, please feel free to contact us through the inquiry form. Additionally, for those who want to read before selection! Download our free case study collection on adhesives! We highly recommend it. [Contents Included] - Optical adhesives/UV-curable adhesives - Insulating heat-dissipating adhesives - Conductive adhesives

  • E-Parts All 1.jpg
  • Other machine elements
  • Other motors
  • Other Connectors

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Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Meets ASTM standards! Ideal low outgassing adhesive for the manufacturing and assembly of aircraft and space equipment. *Other products are also in the process of evaluation applications!

The space adhesive provided by our company has been evaluated using the world-renowned standardization organization ASTM E 595 for gases emitted from space-grade organic materials, confirming compliance with the standards. It can be used in the manufacturing and assembly of aircraft and space equipment. Please refer to the catalog for specifications. 【Features】 ■ Evaluated for gases emitted from space-grade organic materials using the world-renowned standardization organization ASTM E 595 ■ Usable in the manufacturing and assembly of railway-related, aircraft, and space components and equipment ------------------------------------------------------------ Feel free to contact us for test results. * We are also applying for other product lines! ------------------------------------------------------------ * For more details, please download the catalog or feel free to contact us.

  • Other polymer materials

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USP Class VI compliant! Pharmacopoeia compliant adhesive

USP Class VI compliant! Pharmacopoeia compliant adhesive

Adhesive compliant with the pharmacopoeia for medical devices! A safe USP Class VI compliant product that can be widely used in medical devices such as gastroscopes and ultrasound examination equipment.

This is an adhesive that complies with the pharmacopoeia for medical devices. It meets the USP Class VI standards through third-party certification testing, including acute toxicity tests (intravenous or intraperitoneal administration tests in mice), intradermal reaction tests (administering specified extract solutions under rabbit skin), and implantation tests (implanting specified test pieces under rabbit skin). It can be useful for the assembly of medical devices such as endoscopes, ultrasound machines, and MRIs. 【Features】 ■ Complies with the pharmacopoeia for medical devices ■ Safe and widely usable for medical devices such as endoscopes and ultrasound machines, meeting USP Class VI standards *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials

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Alteco epoxy resin-based adhesive

Alteco epoxy resin-based adhesive

Alteco epoxy resin-based adhesive

● Strong adhesive power: Capable of bonding various materials. Particularly excellent for bonding metals, concrete, and porous materials. ● Excellent durability: Superior heat resistance, water resistance, weather resistance, and chemical resistance. ● Low curing shrinkage: Contains no volatile solvents, resulting in minimal shrinkage during curing. ● Electrical insulation: Does not conduct electricity. An excellent insulator. ● Environmentally friendly: Adhesive that does not contain formaldehyde. Registered with JAIA☆☆☆☆/4VOC.

  • glue

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