We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 273 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 理経 Tokyo//IT/Telecommunications
  4. 4 東亞合成 新製品開発事業部　機能性接着剤部 Tokyo//Chemical
  5. 5 積水フーラー Tokyo//Chemical
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glue Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. One-component ultra-low temperature curing epoxy adhesive 'f·Stick 4410 series'
  2. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 Comprehensive Catalog "Industrial Adhesives" ノガワケミカル
  5. 5 Epoxy adhesive Araldite AV138M-1/HV998-1 寺田

glue Product List

121～135 item / All 1136 items

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Hot Melt Molding Case Study: "Internal Wiring of Enclosures"

Hot Melt Molding Case Study: "Internal Wiring of Enclosures"

We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent

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Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"

Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"

Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

  • Processing Contract
  • Other electronic parts
  • Coating Agent

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Hot Melt Melter 'MK-MELTER'

Hot Melt Melter 'MK-MELTER'

Choose tank capacity according to usage conditions! Introducing a low-cost hot melt melter.

The "MK-MELTER" is a hot melt melter that employs a dual gear pump, enabling stable discharge volume control while achieving an astonishingly low price. It uses pneumatic control for hydraulic pressure, allowing the hydraulic pressure to be controlled by the pressure of the air supplied externally. You can choose from five tank capacities: 3L, 5L, 10L, 15L, and 20L, according to the amount of hot melt used. Additionally, it can be used as a standalone unit, and it is designed to allow for pump rotation speed control and heater ON/OFF via external input. 【Features】 ■ Low cost ■ High versatility ■ Optimized design for hot melt molding applications ■ Tank capacity can be selected according to usage conditions *For more details, please refer to the PDF document or feel free to contact us.

  • Molding Equipment
  • Other electronic parts
  • Coating Agent

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Characteristics: Low outgassing, low-temperature curing, oil-resistant, halogen-free. NIC BOND (part number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

  • NB1001(1).jpg
  • Other motors
  • Optical Connector
  • Other electronic parts

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag

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"Insulating" grade NIC BOND NB4000 Series

"Insulating" grade NIC BOND NB4000 Series

It is suitable for adhesion to areas requiring insulation. Non Conductive Type

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • H62シリンジ２.jpg
  • Other semiconductors
  • Other electronic parts
  • Other machine elements

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NIC BOND "Free Sample" Service

NIC BOND "Free Sample" Service

We will provide free samples of NIC BOND products.

We will provide free samples of various adhesives with conductivity, insulation, halogen-free, heat dissipation, heat resistance, and ultra-flexibility.

  • E-Parts All 1.jpg
  • Other electronic parts
  • Other Connectors
  • Other motors

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NICBOND NB Sires Case Studies for Adhesive Selection

NICBOND NB Sires Case Studies for Adhesive Selection

A must-read before selecting adhesives! A collection of adhesive case studies that can be read in just 10 minutes! [Free Download] Optical, insulating, heat-dissipating, and conductive adhesives.

A must-read before selecting adhesives! This is a collection of adhesive case studies that can be read in just 10 minutes. It clearly explains various aspects of optical, thermally conductive, and conductive adhesives. NICBOND is our self-developed adhesive, a culmination of applied chemistry knowledge accumulated over many years of experience. We offer not only a standard lineup of products that can meet a wide range of applications but also bespoke solutions tailored to each customer's needs. [Contents] ○ Optical adhesives / UV-curable adhesives ○ Thermally conductive adhesives ○ Conductive adhesives For more details, please contact us or download the catalog.

  • Other semiconductors

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Instructions for Super Flexible Epoxy Adhesive

Instructions for Super Flexible Epoxy Adhesive

Grows rapidly! Super flexible epoxy adhesive with a growth rate of over 200%!

In "The Manual for Super Flexible Epoxy Adhesive," we introduce products like the Super Flexible Epoxy Adhesive NIC BOND. It includes a Q&A section to solve your adhesive-related problems. Additionally, we feature a diverse lineup suitable for various applications. [Contents] ■ What is the Super Flexible Epoxy Adhesive NIC BOND? ■ Examples of its impressive stretchability ■ What adhesive-related issues do you have? ■ A lineup of 50 types for different applications ■ Product overview and applications, among others *For more details, please refer to the catalog or feel free to contact us.

  • glue
  • Other consumables

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Warm water peelable epoxy adhesive "NIC BOND NB10000"

Warm water peelable epoxy adhesive "NIC BOND NB10000"

Easy to peel off in 30 minutes in warm water (60-80℃)! Reduces damage to parts, materials, and equipment.

The warm water peelable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily peeled off with warm water at temperatures between 60°C and 80°C. It is an epoxy-based adhesive that cures at room temperature to low temperatures, and after curing, it has adhesive strength equivalent to that of standard epoxy resin adhesives. It is expected to be useful for temporary bonding applications during the processing of materials that are difficult to peel off after bonding, such as "silicone ingots, sapphire, glass, neodymium-based magnetic materials, and semiconductors." 【Features】 ■ Cures at room temperature ■ High strength epoxy adhesive ■ Peels off in warm water (60-80°C) in 30 minutes ■ Does not use lactic acid, alkaline acids, or other chemicals *For more details, please refer to the catalog or feel free to contact us.

  • glue
  • Other consumables

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Adhesives "Stretchable Epoxy" and "Peeling Epoxy" Catalog

Adhesives "Stretchable Epoxy" and "Peeling Epoxy" Catalog

Super flexible "stretchable epoxy adhesive" and "removable epoxy adhesive" with warm water.

In the "User Manual for Super Flexible Epoxy Adhesive," we introduce products such as the super flexible epoxy adhesive NIC BOND. The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at temperatures between 60°C and 80°C. The catalog features the characteristics of super flexible epoxy, case studies, and a lineup of adhesives for various applications, as well as the features and basic properties of warm water removable epoxy adhesives, along with test photos. [Contents] ■ Stretchable Epoxy What is super flexible epoxy adhesive? Includes a Q&A section to solve your past adhesive problems. Additionally, a diverse lineup for various applications is also featured! ■ Removable Epoxy The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at temperatures between 60°C and 80°C. *For more details, please refer to the PDF or feel free to contact us.

  • glue

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Alteco instant adhesive

Alteco instant adhesive

Alteco Instant Adhesive

●Instant Adhesion: It can bond and fix in seconds, reducing work time and making it easy to streamline the process. ●High Adhesion: It can strongly bond most materials used in the industry. ●One-Part Room Temperature Curing: Simply apply the adhesive and bond the materials together. ●Solvent-Free: Contains no organic solvents and has low toxicity, making it an environmentally friendly adhesive for the workplace. ●Electrical Insulation: It does not conduct electricity and is an excellent insulator. ●Beautiful Finish: It is colorless and transparent, available in low viscosity to gel-like forms, allowing for a clean finish tailored to the application and materials.

  • glue

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Epoxy resin-based adhesive for civil engineering and construction (for anchor installation)

Epoxy resin-based adhesive for civil engineering and construction (for anchor installation)

It exhibits excellent mechanical strength and adhesion, demonstrating high anchor performance!

Introducing epoxy resin-based adhesives for civil engineering and construction (for anchor installation). [Applications] ● Filling material for anchoring concrete structures ● Adhesion and fixation of sashes, handrails, and fixed chairs ● Adhesion and fixation of various anchors

  • glue

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Instant Adhesive "Alteco 7 Series"

Instant Adhesive "Alteco 7 Series"

Instant adhesive for professionals who pursue quality and efficiency in their work! Supports craftsmanship with quick and strong bonding.

The "Alteco 7 Series" is a cyanoacrylate adhesive designed for professionals who are dedicated to pursuing the quality and efficiency of their work, utilizing technology developed for industrial use. Starting with "Alteco 711," which is suitable for bonding hard plastics, rubber, and metals, the lineup also includes "Alteco 712," a woodworking instant adhesive, and "Alteco 713," which excels in various scenarios. Alteco instant adhesives are supported at the forefront of manufacturing sites and are delivered to craftsmen and workshops with a commitment to quality. 【Product Lineup】 ■ Alteco 711 ■ Alteco 712 ■ Alteco 713 ■ Alteco 731 ■ Alteco 721 ■ Alteco 714 ■ Alteco 515 *For more details, please refer to the PDF document or feel free to contact us.

  • glue

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200-degree heat-resistant adhesive! Room temperature curing two-component epoxy adhesive.

200-degree heat-resistant adhesive! Room temperature curing two-component epoxy adhesive.

Two-component epoxy adhesive 'Alteco 3900' that maintains strength for a long time at 200℃.

Alteco 2-component (base agent and hardener) epoxy resin-based adhesive not only boasts strong adhesion but also demonstrates excellent durability under harsh conditions such as heat and chemicals. The 2-component epoxy adhesive "Alteco 3900" is a room temperature curing type that exhibits high heat resistance. Since it does not contain volatile solvents, there is almost no shrinkage during curing. Being a room temperature curing type, it does not require large equipment. 【Specifications】 Model number: 3900 (provisional) Viscosity: Base agent 31,000 mPa·s, Hardener 3,100 mPa·s *For more details, please download the PDF or contact us.

  • Other electronic parts

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