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package Product List and Ranking from 362 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

package Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. パナソニック アドバンストテクノロジー Osaka//IT/Telecommunications
  2. null/null
  3. フィルネクスト 本社 Kyoto//Resin/Plastic
  4. 4 株式会社ハイブリッチ／ビス Tokyo//IT/Telecommunications
  5. 5 新東工業 Aichi//Industrial Machinery
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package Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Autonomous Mobile Robot Software Package '@mobi' パナソニック アドバンストテクノロジー
  2. Efforts for environmental measures! Sustainable packaging that considers nature.
  3. Microwave-compatible retort package "Retort Microwave Bag" フィルネクスト 本社
  4. 4 Autonomous Mobile Package Software @mobi 2.6 パナソニック アドバンストテクノロジー
  5. 5 Embedded AI package "Device Brain" for Mitsubishi Electric sequencers. たけびし

package Product List

406～420 item / All 654 items

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Markerless Golf Analysis Package

Markerless Golf Analysis Package

A high-end performance system provided by a long-established motion capture system.

The Qualisys motion capture system has high measurement accuracy and is highly regarded in national research facilities and university research institutions. Based on the data cultivated there, we propose an automated analysis system specialized for sports performance. Unlike conventional motion analysis systems that require marker attachment, this system allows for immediate measurement while wearing everyday clothing. Additionally, even those without specialized knowledge can start automatic three-dimensional motion analysis with a single click, and it will also generate a report. As an option, it can connect to floor reaction/force plates, allowing for the analysis of center of gravity movement during swings in conjunction with body movements. This system is a high-end solution that enables anyone to easily access the same level of precision as three-dimensional motion analysis devices used in research facilities.

  • High Speed Camera

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Remote monitoring solution "Wi-VIS"

Remote monitoring solution "Wi-VIS"

Monitoring data is stored on a cloud server! It can be viewed from PCs, smartphones, etc.

"Wi-VIS (Wireless Visual Solution)" is a remote monitoring solution that visualizes on-site information wirelessly. Monitoring data is stored on a cloud server and can be accessed from PCs, smartphones, and other devices. Additionally, by analyzing the monitoring data stored in the cloud, failure predictions can be made. [Features] ■ Cloud ■ Failure Prediction ■ Fault Location Determination ■ Operation Delegation ■ Remote Repair (Optional) *For more details, please refer to the PDF document or feel free to contact us.

  • Other security and surveillance systems

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Special Package "Package"

Special Package "Package"

Making everyday scenes more beautiful and more functional.

A package that adds color to gifts. A special package that preserves deliciousness even after heating in the microwave. Various packages that are useful in daily life. 【Features】 ○ Making everyday scenes more beautiful and functional. For more details, please contact us or download the catalog.

  • Paper and pulp products

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Intelligent Terminal "XP35C6"

Intelligent Terminal "XP35C6"

Touch panel LCD reader/writer/controller

The intelligent terminal CENTiO XP35C6 series can be installed embedded in or exposed on walls and is a programmable controller equipped with a non-contact IC card reader/writer. It can be utilized in various scenes due to its flexible development environment and high versatility. 【Features】 ○ Equipped with Windows CE 6.0 → Application development is easily possible using the highly versatile application development environment Visual Studio. ○ Compatible with various RFID cards → The standard model XP35C6-T2 supports FeliCa (including DES encrypted areas), ISO14443 type A (MIFARE, SLE55R), ISO14443 type B, and ISO15693. → The XP35C6-H1 model is also available, which supports 125kHz cards MIRO (compatible with EM Micro read-only cards), hitag1, and hitag2. → It is possible to ship with different built-in reader/writer modules by replacing them. For more details, please contact us or download the catalog.

  • controller

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Mesh generation tool package "AutoMesh"

Mesh generation tool package "AutoMesh"

Next-generation complete hexahedral and hexahedral-dominant mesh creation toolset! A dedicated package for creating high-quality lattices, applicable to a wide range of CAE fields.

AutoMesh is a next-generation toolset for creating complete hexahedral and hexahedral-dominant meshes developed by the Japan Cadence NUMECA sales team. It is a dedicated package for creating high-quality grids that can be applied across a wide range of CAE fields. 【Package Contents】 ■AutoGrid5 An automatic tool for creating complete hexahedral multi-block structured grids for multi-stage turbomachinery. ■HEXPRESS An automatic tool for creating complete hexahedral unstructured grids. ■HEXPRESS/Hybrid An automatic tool for creating hexahedral-dominant unstructured grids for large and complex shapes. ■IGG An interactive shape modeler and multi-block structured grid creation tool. *For more details, please download the PDF or contact us.

  • HONDA_FullCar_Exterior7_mesh5.png
  • gui_mesh.png
  • holesearcher.png
  • bl.png
  • fillet.jpg
  • turbin_nozzle.jpg
  • volute_hp.png
  • ship.png
  • blood_flow.png
  • Thermo-fluid analysis

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One-two cut

One-two cut

An easy-to-open package that prevents the contents from spilling out! It can also keep the bag clean after opening!

"One-Two Cut" is an easy-to-open, simple opening package that prevents the contents from spilling out. After opening, it can keep the bag clean. 【Lineup】 ■ Pillow Type ■ Standing Type ■ Pocket Type *For details, please request materials or view the PDF data from the download.

  • Packaging Bags

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Low Water Level Drainage Pump Package "Rescue Team"

Low Water Level Drainage Pump Package "Rescue Team"

A system that helps with the early recovery from water damage! It demonstrates outstanding mobility in response to disasters.

The "Rescue Pump Team" is a low-water-level drainage pump package designed to solve problems such as the lack of funds or space to install a full-fledged drainage facility in flood-prone areas. With the increase in typhoons and localized heavy rainfall, flooding has become a close threat due to recent abnormal weather patterns. This system demonstrates exceptional mobility in response to such disasters and aids in the rapid recovery from flooding damage. 【Features】 ○ Capable of discharging to ultra-low water levels ○ Excellent portability for manual transport ○ Two units can operate in series, increasing standard lift from 10m to 20m ○ Compact packaging of equipment necessary for drainage activities For more details, please contact us or download the catalog.

  • Other pumps
  • Other water treatment equipment

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Package "Pack the Pack"

Package "Pack the Pack"

The functionality of cushioning and the design of the decorative box! A package that carefully wraps important items.

"Pack the Pack" is a convenient package that allows you to carry strawberries vertically, offering a different concept from traditional strawberry packaging. Starting with strawberry packaging, it can also be used for various fruits such as blueberries, cherries, and cherry tomatoes, as well as for ceramics and gift packaging. Additionally, we offer "wedding paper items," stationery from the "Hitotose Series," and "Palette," among others. 【Features】 ■ Allows you to carry strawberries vertically ■ Cushioning performance that keeps strawberries securely wrapped ■ Beautifully designed box that showcases the fresh shine of strawberries ■ Versatile for various uses *For more details, please refer to the PDF document or feel free to contact us.

  • others

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Next-generation power module universal package [FLAP]

Next-generation power module universal package [FLAP]

Next-generation power module universal package for high-performance devices such as SiC, GaN, and Ga2O3.

In conventional power module general-purpose packages, they were unsuitable for use with high-performance devices such as SiC, GaN, and Ga2O3. The next-generation power module general-purpose package FLAP developed by our company solves these issues and significantly improves indicators such as volume, thermal resistance, and package inductance compared to conventional products.

  • Other semiconductors
  • EMS

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CAMパッケージ『SolidCAM』

CAMパッケージ『SolidCAM』

SOLIDWORKSゴールドパートナー認定！統合型CAMシステム

『SolidCAM』は、SOLIDWORKSに統合された、優れたCAMソリューションです。 シームレスな1画面上でSOLIDWORKSに統合された『SolidCAM』では、すべての加工手順は、SOLIDWORKSアセンブリ環境から離れることなく設定、計算、確認することができます。 加工のための全ての2Dと3Dの図形は、SOLODWORKSデザインモデルと完全に関連性を保持しています。 【特徴】 ○2軸加工から同時5軸加工まで対応するマシニング加工モジュール可 ○2軸旋盤から複合旋盤まで対応する旋盤加工モジュール可 ○テンプレートを利用した自動フィーチャー認識機能 ○パラメトリック機能、コンフィギュレーション機能、アセンブリ機能に対応 ○豊富なモジュールとオプション構成 ※YouTubeにて用途例動画多数掲載しています。 https://www.youtube.com/c/タクテックスFS 詳しくはお問い合わせ、またはカタログをダウンロードしてください。

  • Other CAM related software
  • Other CAD related software

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2SC2655 bipolar transistor TO-92L package

2SC2655 bipolar transistor TO-92L package

Second source products of Toshiba transistors.

Our company, Aquas, handles various electronic components as a major domestic distributor for JSCJ. We have many alternatives for discrete items such as transistors and MOSFETs. Please feel free to contact us. Model number: 2SC2655 (TO-92L package) 【About JSCJ】 Jiangsu Changjing Technology Co., Ltd. (JSCJ) was established as a semiconductor manufacturing subcontractor (OSAT) for the back-end process (packaging and testing) and was spun off from Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), which is the third largest in the world (2017) in discrete semiconductor manufacturing. *We can request the latest datasheet from the manufacturer, so please feel free to make a request.

  • 2SC2655 TO-92L V2_02.jpg
  • 2SC2655 TO-92L V2_03.jpg
  • 2SC2655 TO-92L V2_04.jpg
  • 2SC2655 TO-92L V2_05.jpg
  • JSCJ.jpg
  • Transistor

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TIP41C bipolar transistor TO-220 package

TIP41C bipolar transistor TO-220 package

Second source products for standard power transistors.

Our company, Aquas, handles various electronic components as a major domestic distributor for JSCJ. We have many alternatives for discrete items such as transistors and MOSFETs. Please feel free to contact us. Model number: TIP41C (TO-220 package) 【About JSCJ】 Jiangsu Changjing Technology Co., Ltd. (JSCJ) was established as a semiconductor manufacturing subcontractor (OSAT) for the back-end process (packaging and testing), spun off from Jiangsu Changdian Technology Co., Ltd. (JCET), which is the third largest in the world (2017) in discrete semiconductor manufacturing. *We can request the latest datasheet from the manufacturer, so please feel free to make a request.

  • JSCJ.jpg
  • Transistor

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2SD999 Bipolar Transistor SOT-89 Package

2SD999 Bipolar Transistor SOT-89 Package

Substitute for Renesas transistor 2SD999

Our company, Aquas, handles various electronic components as a major domestic distributor for JSCJ. We have many alternatives for discrete items such as transistors and MOSFETs. Please feel free to contact us. Model number: 2SD999 (SOT-89 package) 【About JSCJ】 Jiangsu Changjing Technology Co., Ltd. (JSCJ) was established as a semiconductor manufacturing subcontractor (OSAT) for the back-end processes (packaging and testing) and was spun off from Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), which is the third largest in the world (2017) for discrete semiconductor manufacturing. *We will obtain the latest datasheets from the manufacturer, so please feel free to request them.

  • JSCJ.jpg
  • Transistor

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Heat sink soldering TO-220 package Al99.5

Heat sink soldering TO-220 package Al99.5

Aluminum heat sink for TO-220 package that can be soldered to PCB substrate.

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which possesses high processing and surface treatment technologies. The "FI 308/SN" is a TO-220 package heat sink for semiconductors made of Al99.5 material with a tin plating surface treatment. It can be soldered to a PCB board at the pin section. The semiconductor is attached to this product with screws.

  • 45748_Detail1.png
  • alutronic.png
  • Other electronic parts

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Low Pressure Solution Package

Low Pressure Solution Package

Cloud remote monitoring is possible with PCs, tablet PCs, smartphones, etc.!

We would like to introduce our "Low-Pressure Solution Package." Significantly reduced costs and enhanced functionality. Equipped with the CSC3000 monitoring device in the collection box. Delivery with domestic manufacturers' breakers is also possible upon customer request. We have adopted the high-performance, low-cost, revolutionary "PV CLOUD SCOPE." Please feel free to contact us if you have any inquiries. 【Features】 ■ The device has a simple design structure ■ Cloud remote monitoring via PC, tablet, smartphone, etc. ■ Remote operation and maintenance functions with network reboot capability ■ Data storage is secure with Sakura's cloud server ■ Diagnostic functions for the degradation of PCS inverters and panels *For more details, please refer to the PDF document or feel free to contact us.

  • Business Intelligence and Data Analysis
  • Document and Data Management

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