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package Product List

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PCB type "Package with Via Holes"

PCB type "Package with Via Holes"

Formation of solder fillets through special processing! A package using patented technology.

The "Package with Via Holes" utilizes a patented technology that allows for the reliable formation of solder fillets through special processing of the terminal parts, achieving high soldering quality and improved visual inspection after mounting. In standard non-lead packages, there are no terminals on the edge of the PCB, so fillets cannot be formed. Additionally, due to the formation of via holes, solder spreads from the plated area of the via holes, resulting in a package that offers reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ High soldering quality and improved visual inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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High Implementation Reliability Package [Patented Technology]

High Implementation Reliability Package [Patented Technology]

High implementation reliability! Effective for miniaturization and low-profile packaging for automotive applications!

Our company offers a non-lead package with high mounting reliability that utilizes patented technology to improve durability against mechanical stress such as substrate warping and twisting, thanks to a stress-relief material between the leads and the sealing resin. The high mounting strength allows for an alternative to the gull-wing type package, making it effective for miniaturization and low-profile design in automotive applications. 【Features】 ■ Patented technology: Patent No. 2015-139062 (Application date: July 10, 2015) ■ Push strength improved by 57% compared to gull-wing type packages ■ Substrate bending resistance improved by 66% due to the stress-relief material between the leads and sealing resin ■ High mounting reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts

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Semiconductor and Sensor Packaging

Semiconductor and Sensor Packaging

Providing packaging tailored to the applications and characteristics of semiconductors and sensors!

"Electronic Component Bulk Storage Services" provides packaging suitable for various semiconductors and sensors based on their applications and characteristics. We offer a wide range of products tailored to specific needs, including "Partial Exposure Packages" that allow parts of devices or components to be exposed, as well as "Hollow Packages" and "Connection Type Packages." [Product Lineup] ■ Partial Exposure Package ■ Hollow Package ■ Connection Type Package ■ Transparent Resin Sealing Package ■ Noise Reduction Package *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other contract services
  • Contract manufacturing

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Ultra Low Profile Package

Ultra Low Profile Package

New structure ultra-low profile package! Development and provision planned using proprietary technology.

The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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Cu frame type "Package with Beer Hall"

Cu frame type "Package with Beer Hall"

Package using patented technology! Formation of solder fillet through special processing.

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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