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package Product List and Ranking from 39 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

package Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. サンダイヤ 本社 Tokyo//Trading company/Wholesale
  2. パナソニック アドバンストテクノロジー Osaka//IT/Telecommunications
  3. 株式会社ハイブリッチ／ビス Tokyo//IT/Telecommunications
  4. 4 フィルネクスト 本社 Kyoto//Resin/Plastic
  5. 5 日本ケイデンス・デザイン・システムズ社 Kanagawa//software
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package Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Soundproof package for generators *Compatible with both emergency generators and regular generators. サンダイヤ 本社
  2. Autonomous Mobile Robot Software Package '@mobi' パナソニック アドバンストテクノロジー
  3. Microwave-compatible retort package "Retort Microwave Bag" フィルネクスト 本社
  4. 4 Data analysis tool KNIME Analytics Platform インフォコム サイエンスグループ
  5. 5 Keyence RFID Handheld Reader Inventory Package マイティキューブ

package Product List

601～615 item / All 650 items

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[English Market Research Report] Global Market for Learning Management Systems (LMS)

[English Market Research Report] Global Market for Learning Management Systems (LMS)

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The global market size for Learning Management Systems (LMS) is projected to grow from 22.1 billion USD in 2023 to 51.9 billion USD by 2028, with a compound annual growth rate (CAGR) of 18.6% during the forecast period. The rising demand for virtual online training and the introduction of advanced technologies for better training environments are creating opportunities in the LMS market. On the other hand, the need for technology training for teachers and instructors, as well as the lack of multilingual Learning Management Systems (LMS), are significant challenges to the growth of the LMS market. This report investigates the global Learning Management Systems (LMS) market, summarizing market overview, market impact factors and opportunities analysis, technology and patent trends, regulatory environment, case studies, market size trends and forecasts, detailed analysis by various segments and regions, competitive landscape, and profiles of key companies.

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【English Market Research Report】Learning Management System Market

【English Market Research Report】Learning Management System Market

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According to the latest research by Polaris Market Research, the global learning management system market is expected to reach USD 93.18 billion by 2032. This research report provides detailed insights into the current market dynamics and analysis of future market growth.

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[Production Example] Year-End Gift Shipping Package

[Production Example] Year-End Gift Shipping Package

When handling delicate products, packaging is especially important! Packaging that is strong against refrigeration and freezing.

We would like to introduce a case where we produced "year-end gift shipping packages." For transportation by courier, it was necessary to select materials that could withstand strength and also required waterproofing due to the need for freezing and refrigeration. The selected material can suppress water penetration from the cross-section of the paper, making the box resistant to moisture and ensuring that products can be transported safely. 【Case Overview】 ■ Shape: N-type ■ Internal dimensions: 200×280×H80mm ■ Foil stamping: One location on the top of the lid, centered, glossy gold ■ Quantity: 500 sets *For more details, please refer to the PDF document or feel free to contact us.

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Markerless Golf Analysis Package

Markerless Golf Analysis Package

A high-end performance system provided by a long-established motion capture system.

The Qualisys motion capture system has high measurement accuracy and is highly regarded in national research facilities and university research institutions. Based on the data cultivated there, we propose an automated analysis system specialized for sports performance. Unlike conventional motion analysis systems that require marker attachment, this system allows for immediate measurement while wearing everyday clothing. Additionally, even those without specialized knowledge can start automatic three-dimensional motion analysis with a single click, and it will also generate a report. As an option, it can connect to floor reaction/force plates, allowing for the analysis of center of gravity movement during swings in conjunction with body movements. This system is a high-end solution that enables anyone to easily access the same level of precision as three-dimensional motion analysis devices used in research facilities.

  • High Speed Camera

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TIP41C bipolar transistor TO-220 package

TIP41C bipolar transistor TO-220 package

Second source products for standard power transistors.

Our company, Aquas, handles various electronic components as a major domestic distributor for JSCJ. We have many alternatives for discrete items such as transistors and MOSFETs. Please feel free to contact us. Model number: TIP41C (TO-220 package) 【About JSCJ】 Jiangsu Changjing Technology Co., Ltd. (JSCJ) was established as a semiconductor manufacturing subcontractor (OSAT) for the back-end process (packaging and testing), spun off from Jiangsu Changdian Technology Co., Ltd. (JCET), which is the third largest in the world (2017) in discrete semiconductor manufacturing. *We can request the latest datasheet from the manufacturer, so please feel free to make a request.

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  • Transistor

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2SD999 Bipolar Transistor SOT-89 Package

2SD999 Bipolar Transistor SOT-89 Package

Substitute for Renesas transistor 2SD999

Our company, Aquas, handles various electronic components as a major domestic distributor for JSCJ. We have many alternatives for discrete items such as transistors and MOSFETs. Please feel free to contact us. Model number: 2SD999 (SOT-89 package) 【About JSCJ】 Jiangsu Changjing Technology Co., Ltd. (JSCJ) was established as a semiconductor manufacturing subcontractor (OSAT) for the back-end processes (packaging and testing) and was spun off from Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), which is the third largest in the world (2017) for discrete semiconductor manufacturing. *We will obtain the latest datasheets from the manufacturer, so please feel free to request them.

  • JSCJ.jpg
  • Transistor

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Heat sink soldering TO-220 package Al99.5

Heat sink soldering TO-220 package Al99.5

Aluminum heat sink for TO-220 package that can be soldered to PCB substrate.

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which possesses high processing and surface treatment technologies. The "FI 308/SN" is a TO-220 package heat sink for semiconductors made of Al99.5 material with a tin plating surface treatment. It can be soldered to a PCB board at the pin section. The semiconductor is attached to this product with screws.

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  • alutronic.png
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Fold the blister three times to package the product as a "Triple Pack."

Fold the blister three times to package the product as a "Triple Pack."

Heat sealing of blisters and backing, folding the edges of the blister to slide or insert the backing, or using a folded package is also possible.

We would like to introduce the 'Triple Pack' handled by Shinwa Packs Co., Ltd. It is a product that packages items by folding the blister into three parts. Please feel free to consult us when you need assistance. 【Products We Handle】 ■ Packaging ■ Component Trays ■ POP ■ Inner Trays ■ Other Products ■ New Method: Punched Blister At Shinwa Packs, we manufacture blister packs using vacuum forming, component transport trays, and carry out packaging such as blister heat sealing. *For more details, please contact us directly.

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Slide blister package that slides in with a backing board.

Slide blister package that slides in with a backing board.

Fold the edge back about 10mm and slide the backing into the package!

We would like to introduce the "Slide Blister" handled by Shinwa Packs Co., Ltd. This is a package where the edge of the blister is folded back about 10mm, allowing the backing to be slid in and inserted. Please feel free to consult us when you need assistance. 【Products We Handle】 ■ Packages ■ Parts Trays ■ POP ■ Inner Trays ■ Other Products ■ New Method Punched Blisters At Shinwa Packs, we manufacture blister packs through vacuum forming, as well as parts transport trays, and we also handle blister heat sealing and other packaging processes. *For more details, please contact us directly.

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Blister pack, a package that heat-seals the blister and backing.

Blister pack, a package that heat-seals the blister and backing.

It is also possible to fold the blister in half or in thirds to package the product, or to fold back the edge of the blister to slide or insert the backing.

We would like to introduce the "Blister Pack" handled by Shinwa Packs Co., Ltd. This is a package that heat-seals the blister and backing card together. Please feel free to consult us when you need our services. 【Products We Handle】 ■ Packages ■ Component Trays ■ POP Displays ■ Inner Trays ■ Other Products ■ New Method: Button-Type Blister At Shinwa Packs, we manufacture blister packs through vacuum forming, as well as component transport trays, and we also handle blister heat sealing and other packaging processes. *For more details, please contact us directly.

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Original package production example: "Gift package"

Original package production example: "Gift package"

If you convey the image of how you want it to be presented, we can suggest the appropriate shape! We also design with an awareness of how the product will be displayed.

We would like to introduce examples of the "gift packaging" that we produce. The packaging for gift umeboshi (pickled plums) is designed to consider both the contents and weight, allowing for decorative elements in the dividers. Even with the same package, the impression can change depending on the shape and design. Additionally, we have created gift packaging for individually wrapped tsukudani (preserved foods). The design focuses on showcasing the product while also aiming for space-saving and cost reduction. [Achievements] ■ Umeboshi packaging ■ Tsukudani packaging *For more details, please refer to the related links or feel free to contact us.

  • Food containers and packaging

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Original package production example: "Distinctive surface finish package"

Original package production example: "Distinctive surface finish package"

Holographic foil stamping and foil stamping with partial embossing, etc.! We offer a variety of designs.

We would like to introduce examples of the production of our "distinctive surface processing packages." We have achievements such as "automotive accessories packaging" with a matte finish and holographic foil stamping, and "cake packaging" featuring foil stamping and partial embossing on textured paper. Additionally, the "health food packaging" printed on aluminum foil paper and finished with a pseudo-embossing technique utilizes the gloss of the base paper while incorporating a gradient design to create a sense of luxury. [Achievements] ■ Automotive accessories packaging ■ Cake packaging ■ Health food packaging *For more details, please refer to the related links or feel free to contact us.

  • Food containers and packaging
  • Pharmaceutical containers and packaging

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