Technical Introduction: Si Special Processing
Supports processing materials such as Si wafers! We meet various polishing needs for different materials.
Nihon Exceed conducts special processing of Si using thinning processing technology and high-purity technology. We can also handle Si wafers, SOI wafers, and other single-crystal and polycrystalline silicon component materials (such as electrodes for dry etching equipment and focus rings). Our company meets various polishing needs for processing materials. 【Special Si Processing】 ■ Thinning Processing Technology ■ Small Diameter High-Precision Processing Technology ■ High-Purity Technology *For more details, please refer to the PDF document or feel free to contact us.
- Company:日本エクシード
- Price:Other