We provide silicon wafers optimized for individual needs!
Our company provides silicon wafers optimized for the individual needs of our customers as a solution provider for anti-early withdrawal materials. Our main products include polished wafers of 12 inches or smaller using advanced crystal growth technology, as well as epitaxial wafers capable of single-layer, multi-layer, and ultra-thick film deposition. We also offer SOI wafers for power semiconductors and high-quality GaN epitaxial wafers applied in power supplies and optical communication units. [Features] ■ Vertically integrated advanced technological capabilities ■ A wide range of products to meet diverse needs ■ Advanced customization support focused on customer requirements *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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■Power semiconductors (MOSFET, IGBT) ■MEMS ■Image sensors ■Analog IC ■High-frequency communication devices *For more details, please download the PDF or feel free to contact us.*
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Heijyō Technology Japan Co., Ltd. is a company responsible for sales development and customer service in the Japanese market. We have accumulated the manufacturing technology and experience of semiconductor silicon wafers that our parent company has cultivated over many years, inheriting its high quality standards and technical capabilities to provide prompt and professional support in the Japanese market. In the future, we aim to deepen our collaboration with the Japanese semiconductor industry, contribute to technological innovation and industrial development, and serve as a bridge connecting the semiconductor industries of Taiwan and Japan.




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![[Analysis Case] Evaluation of Metal Impurities in the Metal Film and Interface of the Device](https://image.mono.ipros.com/public/product/image/19d/2001538620/IPROS12249256516974712398.jpg?w=280&h=280)
