We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for stage.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

stage×タイショー - List of Manufacturers, Suppliers, Companies and Products

stage Product List

1～3 item / All 3 items

Displayed results
Porous adsorption stage

Porous adsorption stage

Porous adsorption stage

Reduce defect rates due to pickup errors Porous adsorption stage 【Features】 ○ Reduces pickup errors caused by chip floating and rotation ○ Capable of full surface adsorption of wafer sheets ○ Eliminates warping of wafer sheets ○ Stabilizes needle lift amount ○ Improves operational efficiency ○ Prevents foreign matter contamination due to plating peeling ○ Custom orders available for various materials and shapes ● For other functions and details, please download the catalog.

  • Other machine elements

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Stage "Porous Adsorption Stage"

Stage "Porous Adsorption Stage"

Reduce downtime and defect rates caused by chip adhesion errors and bonding mistakes!

The "Porous Adsorption Stage" is a stage that can reduce the operational rate decline due to chip adsorption errors and the defect rate caused by bonding errors. It allows for full adsorption of wafer sheets and can also eliminate warping of the wafer sheets. Furthermore, it resolves foreign matter contamination (plating debris) caused by plating peeling during wafer adsorption. Custom orders can accommodate various materials and shapes. Please feel free to consult us. 【Features】 ■ Reduces pickup errors caused by chip floating and rotation ■ Allows for full adsorption of wafer sheets ■ Capable of eliminating warping of wafer sheets ■ Stabilizes the amount of needle lift *For more details, please refer to the catalog or feel free to contact us.

  • Other Machine Parts
  • Other electronic components and modules

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Porous adsorption stage

Porous adsorption stage

Introducing products related to semiconductor manufacturing, including "vacuum chucks" and "heat comas"!

We would like to introduce our "Porous Adsorption Stage." The "Vacuum Chuck" is used to hold wafers during die bonding. Additionally, to solve issues such as neighboring chip lift-off or rotation during pickup, we recommend the "Porous Chuck." Furthermore, the "Heat Coma" allows for uniform adsorption across the entire surface without the need for adsorption holes by using porous materials in the work mounting area. 【Features】 <Vacuum Chuck> ■ Holds wafers during die bonding ■ Custom orders can accommodate various materials, shapes, and patterns <Porous Chuck> ■ Capable of uniformly holding wafer sheets (chips) across the entire surface ■ Eliminates warping of wafer sheets *For more details, please refer to the related links or feel free to contact us.

  • Other machine elements

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to stage

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.