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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1501～1515 item / All 1853 items

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board

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We won't lose! Leave it to us for quick turnaround on build-up substrates.

We won't lose! Leave it to us for quick turnaround on build-up substrates.

High quality and quick delivery are possible! If you have any concerns, please feel free to consult with us!

K2 has all the necessary equipment for circuit board manufacturing in-house. Since we can complete all processes without relying on outsourcing, we are able to respond to short delivery times. Additionally, our factory operates on Saturdays, allowing us to count Saturdays as manufacturing days. "We can't accommodate ultra-short delivery times," "We were turned down for consultations on special circuit board manufacturing," "We have concerns about the quality of the circuit boards." We will solve these issues using K2's unique know-how. 【What K2 can do】 ◆ Number of Layers We have many manufacturing achievements from 1 to 4 layers. ◆ Capable of manufacturing with various materials and specifications We also handle complex specifications such as high-frequency build-up boards and build-up rigid-flex boards. *Depending on the specifications, we can manufacture in as little as one week. For more details, please download our catalog or feel free to contact us.

  • Circuit board design and manufacturing

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Implementation Technology"

Technical Introduction: "Implementation Technology"

Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.

At Sato-Sen Co., Ltd., we are implementing pattern designs that are easy to assemble at the design stage as a measure to improve yield in general printed circuit board assembly. Additionally, to enhance yield in flip chip assembly, we are forming dams using film solder resist, which is effective in preventing solder shorts at C4 and ensuring package parallelism. [Factors Contributing to Poor Solder Wetting] - The increase in alloy layers with lead-free solder, and the presence of black pads due to the nickel layer in flash gold plating are considered potential causes. ⇒ In lead-free solder, managing the composition and temperature of the solder bath is crucial. ⇒ For flash gold plating, proper management of the pre-treatment and nickel bath solution is essential. For more details, please contact us.

  • Printed Circuit Board

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CAN/CANFD communication is possible with the sequencer! CANNEX

CAN/CANFD communication is possible with the sequencer! CANNEX

Leave CAN communication to us with the sequencer.

This is an interface board for performing CAN communication using the KEYENCE PLC Ethernet communication unit KV-XLE02. It can be used with Ethernet instead of USB, so a computer is not required during operation. It can be installed inside a control panel. We provide demo units, sample ladder programs, and free monitoring software for computers. The user manual can be found on our company website. https://sunprosys.co.jp/ftp/cannex/CANNEX.html Our company has extensive experience in the production of assembly and inspection equipment related to work requiring CAN/LIN communication. - Performing electrical inspections and visual inspections using image processing while moving the object via CAN communication - Controlling AMR's CAN communication with a sequencer - Automatically saving the CAN communication logs from the inspection equipment to an SD card mounted on the sequencer - Writing software to the microcontroller within the workpiece and performing assembly and electrical inspections semi-automatically.

  • PLC

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Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

The silicon/aluminum composite material SA001, created by our unique composite technology, is lighter than aluminum and has the Young's modulus of cast iron, while also accommodating hollow structures through bonding technology.

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

  • Other metal materials
  • aluminum
  • Composite Materials

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials

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Sulfurization prevention coating agent protects the substrate from corrosive gases!

Sulfurization prevention coating agent protects the substrate from corrosive gases!

The ideal coating agent for preventing sulfide! It prevents substrate corrosion with a fluororesin film that has gas barrier properties.

The "PCH Series" is a sulfurization prevention coating agent that protects metals like Ag and Cu from corrosive gases. It not only prevents sulfurization but also protects against moisture, making it ideal for LED mounting substrates. Since this product forms a colorless and transparent film, the total light transmittance does not decrease even after application. To evaluate gas corrosion resistance, we conducted gas corrosion tests to confirm the maintenance rate of gloss before and after testing. The results are detailed with comparative images of the silver plate used as the substrate in its pre-test, uncoated state, and after applying this product. 【Features】 ■ Sulfurization resistance ■ Corrosive gas resistance ■ Moisture and drip protection ■ Adhesion ■ Rust prevention ■ Transparency ■ Room temperature drying

  • Coating Agent
  • LED Module

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[Quality Policy] Trust in the Inspection Process

[Quality Policy] Trust in the Inspection Process

The entire history from material input to completed shipment is on this one sheet.

Each customer's order will be assigned a production item number, and a process communication document will be issued to record the steps until shipment. After shipment, inquiries and product issues can be addressed at any time using the production item number. ★Assembly Completion Inspection★ All items after assembly will be inspected using an inspection sheet. The standardized work at each stage confirms the quality that has already been integrated into the process. The first lot will be recorded on standard format paper, and from the second lot onward, all records will be handwritten in a modified format of the standard template. This is stored within the factory for a certain period as work history, allowing for immediate reference at any time. ★Storage of Various Records★ Manufacturing records are kept from the history of parts and materials to inspection records. They can be searched and referenced immediately in response to customer inquiries. Records related to printed circuit board assembly, inspection logs, and inspection records of assembly site work are managed internally with unique identifiers, organized by model.

  • Circuit board design and manufacturing

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Quality Policy: Soldering Skill Certification System

Quality Policy: Soldering Skill Certification System

Only those who pass will perform soldering work under the 'Skill Certification System.'

[PWB Implementation One Skill Quality Certificate] At Shinjitsu, we have established an internal soldering skill certification system since 2007 to improve the manual soldering techniques that are the foundation of implementation technology. An internal soldering skill certification committee has been formed, and those who have obtained the Advanced Operator Technical Certificate through the Japan Welding Engineering Society's soldering skill certification exam are appointed to train newcomers according to established procedures. ■ Pre-training Course To obtain certification, participants undergo several days of training conducted by qualified instructors from the Japan Welding Engineering Society. After systematically learning about the history of soldering, basic terminology, fundamental knowledge of printed circuit boards and electronic circuit components, and soldering evaluation criteria using textbooks, they receive practical training and take the exam. ■ Practical Exam In the practical exam, five items are comprehensively evaluated, including the degree of tilt of each component, lead forming, cleanliness, and required time. Upon passing, a certificate is awarded, granting the qualification to perform soldering work on customer circuit boards for the first time. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Quality Policy: Information Security Regulations

Quality Policy: Information Security Regulations

Information security measures to protect customer information.

At Sōshin, we aim to develop innovative services that meet market demands, contribute to the benefits of our business partners regarding supply, strive to improve their quality, and enhance customer satisfaction. To achieve this goal, we establish information security regulations to protect the confidentiality of important information of our business partners, ensuring that secure business transactions can continue indefinitely. Additionally, management and employees work together to maintain and improve this system. ◆◆ "SECURITY ACTION" ★★ Two Stars Declaration ◆◆ At Sōshin, we have declared "★★ Two Stars" in the "SECURITY ACTION" program established by the Information-technology Promotion Agency (IPA) to engage in more secure information security measures. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Flexible substrate short delivery service (FPC - flexible)

Flexible substrate short delivery service (FPC - flexible)

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

  • スクリーンショット 2024-08-23 172533.png
  • Printed Circuit Board

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[Exhibition Report] We exhibited at NEPCON Japan 2025!

[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots

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