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substrate - メーカー・企業547社の製品一覧とランキング

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substrateのメーカー・企業ランキング

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  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
企業ランキングへ

substrateの製品ランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrateの製品一覧

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Electronics business

Electronics business

Complete total support from development to design, assembly, and completion of electronic devices!

We would like to introduce our "Electronic Equipment Business." We provide complete total support from development to assembly and completion in various fields, including home appliances, industrial equipment, and medical health devices. Utilizing our unique prototype-focused manufacturing network, we aim for efficiency and cost reduction, not only domestically but also internationally. 【Features】 ■ Consulting for electronic equipment design and development ■ Shortening of design and development periods and lead times through comprehensive full support ■ Advanced CAD design using tools like Zuken CR8000 ■ Manufacturing of printed circuit boards from single-sided to 20 layers, as well as flexible circuit boards ■ High-density surface mounting of jumpers, axial, radial, and chip, IC, BGA, etc. *For more details, please feel free to contact us.

  • Other CAD
  • Printed Circuit Board
  • Circuit board design and manufacturing

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Conversion Board "CVB Series"

Conversion Board "CVB Series"

It is also possible to create a conversion board that reflects the customer's intentions!

We offer an emergency response component mounting service using conversion boards. The "CVB Series" is an original conversion board that resolves issues such as design errors and component procurement mistakes. We address various concerns, such as: - "The components I had arranged for are unavailable, and work is stalled." - "I mistakenly purchased unnecessary components with the wrong shape, resulting in excess inventory." 【Examples of Solutions】 - Re-arranging the components that are actually needed. - The board was manufactured, but the component pads do not match, making it impossible to mount. - It was specified for discrete components. - The board was designed for surface-mount components, but it was specified for discrete components. - Unable to mount on the board due to differences in component sizes, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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High Thermal Conductivity Substrate "FGHP"

High Thermal Conductivity Substrate "FGHP"

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.

  • Board to Board Connectors

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Special Precision Machinery Co., Ltd. Nasu Factory

Special Precision Machinery Co., Ltd. Nasu Factory

A problem-solving and proposal-based company that provides high-quality, high-performance electronic circuit boards!

At the Nasu Factory of Tokushu Seiki Co., Ltd., we manufacture electronic devices, communication equipment, and precision instruments. Our company began manufacturing circuit boards in the 1970s when printed circuit boards started to become widespread in Japan. We have produced high-quality circuit boards for various fields, including communication base stations, medical devices, and automotive applications. With a quality control system centered around five inspection processes, we will continue to provide high-quality and high-performance electronic circuit boards. 【Our Strengths】 ■ High mounting technology and quality control system ■ A reliable partner for electronic circuit board prototyping ■ "Quality" is built from the upstream *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • EMS

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Supercapacitor "NX120V"

Supercapacitor "NX120V"

We will upgrade the old 2kW data center to be equivalent to the latest model.

The "NX120V" is an advanced ICT device that enables the continued operation of facilities built around the year 2000 without the need for complete updates or renting space from other centers, allowing for operation with the current equipment as is. In an old data center with a 2kW specification, it is possible to operate at the equivalent of 4-6kW without changing the facility equipment. 【Features】 ■ Improved overall performance with better peak power extraction compared to average power ■ Power consumption is less than half that of conventional Xeon servers (Ave 50w) ■ CPU options include Intel XeonD with 4/6/8/12/16 cores, and memory can be maxed out at 128GB (ECC) ■ Storage includes M.2-512GB for system use (transfer speed 2GB/S) ■ Capable of operation in high-temperature environments up to 45℃, among other features *For more details, please download the PDF or feel free to contact us.

  • Other server related
  • server

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Printed Circuit Board Manufacturing Delivery Schedule

Printed Circuit Board Manufacturing Delivery Schedule

The printed circuit boards will be shipped tomorrow. Industry-leading ultra-short delivery times! Please give it a try!!

We have been in the printed circuit board business for over 30 years. We have steadily and diligently accumulated know-how for short lead-time manufacturing with honesty and sincerity. We have absolute confidence in our express and short lead-time manufacturing. Please feel free to consult with us.

  • Printed Circuit Board

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-frequency substrate manufacturing example: Long slit TH substrate

High-frequency substrate manufacturing example: Long slit TH substrate

Forming guard patterns! Introducing examples of manufacturing and processing long slit TH substrates.

We would like to introduce an example of manufacturing and processing of the "Long Slit TH substrate." By providing a pattern on the edge of the substrate, a guard pattern is formed. Please feel free to contact us when you need assistance. 【Overview】 ■ Long Slit TH substrate ■ Similar processing technology (edge TH) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

High-Frequency Substrate Manufacturing Example: Hybrid Structure Substrate

Using high-frequency materials for specific interlayers while employing different materials for other interlayers! Here are some examples of manufacturing processes.

We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Single-sided board / Double-sided board

Single-sided board / Double-sided board

Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Impedance control compatible board

Impedance control compatible board

We propose appropriate line widths, clearances, and layer configurations during pattern design!

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Thick copper substrate

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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