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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1516～1530 item / All 1853 items

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TTL Exhibition Participation Guide: JPCAShow 2025

TTL Exhibition Participation Guide: JPCAShow 2025

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

  • 出展案内_JPCAshow2025.png
  • Printed Circuit Board

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[Exhibition Report] We exhibited at JPCAshow 2025!

[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots

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FPC - "Technical Information" - Updated September 2025

FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

  • 6層スタックビア.png
  • パターンビアフィル.png
  • ファインピッチ厚銅.png
  • 透明FPC.png
  • Printed Circuit Board

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Thick copper double-sided printed circuit board

Thick copper double-sided printed circuit board

The copper board thickness is 200μm, and the through-hole plating thickness is 25μm! Introducing our printed circuit boards.

We would like to introduce our "Thick Copper Double-Sided Printed Circuit Board." The substrate is R-1766/1661, and the copper thickness is 200μm (using C1100-1/2H). It features high current capacity and excellent heat dissipation. Additionally, we also offer a "High-Temperature Double-Sided Printed Circuit Board" with high heat resistance and high elastic modulus. 【Features】 ■ High current capacity ■ Excellent heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials

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Multilayer Printed Circuit Board 'Beyond 5G'

Multilayer Printed Circuit Board 'Beyond 5G'

Use R-5795(N)/R-5680(N)! Introducing our printed circuit boards.

We would like to introduce our multilayer printed circuit board "Beyond 5G." It uses "H-VLP3," which has a glass transition temperature of 220°C/DMA, a dielectric constant (14GHz) of 3.1, and low roughness copper foil. It features high-speed signal transmission, reduced transmission loss, and excellent through-hole reliability. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed signal transmission ■ Reduced transmission loss ■ Excellent through-hole reliability ■ Excellent heat resistance ■ Lead-free solder compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials

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[Development Case] Light Sensor Board Using Photodiodes

[Development Case] Light Sensor Board Using Photodiodes

Developed an agricultural solar radiation sensor! Outputs light brightness via transmission output (4-20mA) or RS485 communication! Leave the circuit board development to Nippo!

This is a light sensor utilizing a photodiode developed for solar radiation sensing in the agricultural field. It outputs the brightness of light via transmission output (4-20mA) or RS485 communication. To suit measurements in agricultural settings, the sensor case features a light diffusion dome. Leave the development of the circuit board to Nippo! Case design is also possible. *For more details, please download the PDF or feel free to contact us.

  • 光センサ（農業用）.jpg
  • Sensors
  • Circuit board design and manufacturing
  • EMS

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Communication board (RS485/422 to LAN conversion)

Communication board (RS485/422 to LAN conversion)

We support the IoT and DX transformation on-site!

You can connect devices that only have a serial communication port to Ethernet. By connecting to Ethernet, long-distance communication becomes possible, allowing for remote monitoring and cloud connectivity, which can be utilized for IoT and DX transformation at the site. Since it is board-type, it is also recommended for embedding into devices. *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • Circuit board design and manufacturing
  • EMS

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[Column] How to Choose a Manufacturer for Printed Circuit Board Production and Assembly

[Column] How to Choose a Manufacturer for Printed Circuit Board Production and Assembly

Introducing how to choose a printed circuit board manufacturing and assembly company! ~What are the differences between EMS, OEM, and ODM?~ \ Leave ODM board development to Nippo! /

In recent years, the electric industry has been demanding harsh conditions from the market, such as "high quality, high functionality, and short delivery times," making it necessary to choose manufacturing and assembly manufacturers that fit the company’s needs. Therefore, it is important to find manufacturing and assembly manufacturers that meet the conditions of "high quality, high functionality, and short delivery times." The differences between the production forms of circuit board development—EMS, OEM, and ODM—are as follows: ◆ EMS The contracted company handles everything from design to logistics on behalf of the commissioning company. ◆ OEM The commissioning company conducts product design, while the contracted company only handles manufacturing. ◆ ODM The contracted company conducts product design and manufacturing in consultation with the commissioning company. Even if the concept and design are not finalized, ODM development and manufacturing is recommended because it allows for production and sales with the cooperation of the contracted manufacturer. Nippo offers ODM development (proposal-type ODM) that covers everything from product design to product development. Our sales and technical staff will listen to your requests and concerns and propose a solution plan. Please feel free to contact us!

  • Printed Circuit Board

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[Column] What is Combustion Control (Gas Combustion)? Functions and Examples of Use

[Column] What is Combustion Control (Gas Combustion)? Functions and Examples of Use

What is combustion control? An explanation of its functions, usage examples, and safety measures! Proven track record with kitchen equipment manufacturers! For inquiries regarding gas combustion control, contact Nippo!

Combustion control (gas combustion) refers to the management of gas burning safely, and it is utilized in kitchen equipment and hot water supply systems. Since gas leaks can lead to fires or explosions, gas combustion control boards are equipped with functions that prioritize safety. To conduct combustion control safely, the following functions are necessary: ◆ The ability to ignite reliably and adjust the air-to-fuel ratio ◆ Ensuring that gas does not leak into the room after combustion stops ◆ Ease of checking for gas leaks *The above are just some of the functions. The "combustion control board" that manages gas combustion is used in various combustion devices across different fields that utilize gas. For example, it is installed inside fryers used in restaurants for frying food. When frying, if the temperature is too high, the food will burn, and if it is too low, it will not cook through, so it is necessary to maintain an appropriate temperature consistently. By using a gas combustion board to control the oil temperature, anyone can produce fried food of the same quality. At Nippo, we welcome inquiries and proposals regarding gas combustion control tailored to our customers' applications. Please feel free to contact us.

  • Control Panel

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[Introduction to Assembly Manufacturing Technology] "Device Manufacturing Technology" that controls products.

[Introduction to Assembly Manufacturing Technology] "Device Manufacturing Technology" that controls products.

All implementation boards are checked by AOI (Automated Optical Inspection) to prevent the outflow of defects!

We would like to introduce the "Device Manufacturing Technology" that controls Kuroi Electric's products. Our company produces the brain of electronic blocks, such as power supply boards and control boards. With advanced chip mounters and axial & radial combination machines, we can mechanically mount mixed boards all at once. By performing moisture-proof insulation treatments and filling processes with materials like silicone, urethane, and Hayacoat, we can also achieve processing that withstands harsh environments, with a proven track record in various products, including outdoor products. 【Features】 ■ Capable of mechanically mounting mixed boards all at once ■ Processing that can withstand harsh environments is also possible ■ Proven track record in various products, including outdoor products *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing

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Substrate

Substrate

Wiring for electrical products and precision instruments! Introducing our circuit boards.

At Sun Label, we respond to our customers' needs by designing and manufacturing printed circuit boards. We offer a lineup that includes "single-sided boards," which have conductor patterns formed on one side of an insulator, and "double-sided boards," which have conductor patterns on both sides and can consist of multiple layers. Additionally, we also handle double-sided adhesive sheets that can be reused and are usable even in high-temperature environments (with a momentary peak temperature of about 260°C). 【Products Offered】 ■ Single-sided boards ■ Double-sided boards ■ High heat-resistant double-sided adhesive sheets *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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LED signal light circuit board unit 'MR1105-80ABG' 110φ teal

LED signal light circuit board unit 'MR1105-80ABG' 110φ teal

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-80ABG'. It is a best-selling product from our company, which specializes in LED signal light circuit board units for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V, also available in DC24V specification ■ Dimensions: 135mm square ■ Inner diameter: 110φ ■ Number of LEDs: 80 ■ Emission color: blue-green *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module

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LED signal light circuit board unit 'MR1105-80AY' 110φ yellow

LED signal light circuit board unit 'MR1105-80AY' 110φ yellow

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-80AY'. It is a best-selling product from our company, a specialized manufacturer of LED signal light circuit board units, with over 10 years of experience. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V (DC24V version is also available) ■ Dimensions: 135mm square ■ Inner diameter: 110φ ■ Number of LEDs: 80 ■ Emission color: Yellow *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights

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LED signal light circuit board unit 'MR1505-24CBG' 150φ blue-green

LED signal light circuit board unit 'MR1505-24CBG' 150φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-24CBG,' which we handle. This product has been a best-seller for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Cyan *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights

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LED signal light circuit board unit 'MR1505-24CR' 150φ red

LED signal light circuit board unit 'MR1505-24CR' 150φ red

Wide beam angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1505-24CR' that we handle. It is a best-selling product from a specialized manufacturer of LED signal light circuit board units for over 10 years. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Red *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights

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