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substrate - メーカー・企業548社の製品一覧とランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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substrateのメーカー・企業ランキング

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  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
企業ランキングへ

substrateの製品ランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrateの製品一覧

1216～1230 件を表示 ／ 全 1843 件

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Prototyping of electronics application boards and devices is fast!

Prototyping of electronics application boards and devices is fast!

We can provide services such as design and parts procurement in-house!

We offer design services (circuit development, board design, software development, mechanical and structural design, packaging design), parts procurement (procurement routes from over 200 domestic and international companies, abundant stock of general electronic components and semiconductors), and manufacturing services (in-house board assembly equipment, a consistent line from device assembly to finished products, and a flexible line for small lot prototypes to mass production). We also provide various resin coatings, fillings, and sealings for electronics boards that are essential for outdoor use and water-related applications, including moisture-proofing, vibration-proofing, dust-proofing, and rust-proofing. For more details, please contact us or refer to our catalog.

  • Circuit board design and manufacturing

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VME BUS clock generation board

VME BUS clock generation board

Provides the host computer with accurate time without any time lag.

Microsemi's Truetime TTM-635 and Spectracom's Bancomm bc635VME board are compatible with the above two discontinued products. For details, please refer to the catalog.

  • Other electronic parts

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Servo-type Powder Molding Machine Core Type

Servo-type Powder Molding Machine Core Type

High-speed, high-precision, clean molding machine

We provide high-speed, high-precision, and clean molding machines manufactured in Taiwan at a reduced cost to our customers.

  • Powder Molding Machine
  • Inductor Coil

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Introduction of the porous product lineup *Available for short delivery times!

Introduction of the porous product lineup *Available for short delivery times!

Introducing porous products such as glass film suction plates, precision floating tables, and precision porous chucks!

This is an introduction to the "porous products" handled by P.D.W. Starting with the "precision floating table," which can process and transport glass substrates and films with high precision and non-contact, we also offer products such as the "circular precision porous chuck," which maintains suction fixation without shifting the workpiece even during cutting operations. Our company challenges the limits of precision with high-quality natural stone, responding to precision requirements of 1/1000 millimeter units. 【Product Lineup】 ■ Precision Floating Table ■ Precision Chuck Table ■ Precision Porous Chuck ■ Glass Substrate Suction Plate ■ Circular Precision Porous Chuck 【Our Features】 - We always keep stock of stones in the 5000×3000 class, enabling us to respond to short delivery times through integrated production from cutting to product completion. - We guarantee flatness, parallelism, and perpendicularity precision values that meet customer needs. - We provide modifications, repairs, and maintenance for stone products. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Other processing machines
  • Other conveying machines

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Precision porous chuck *Partial adsorption (fixing) is possible

Precision porous chuck *Partial adsorption (fixing) is possible

No need to replace the chuck to fit the work size! Adopts a porous ceramic plate with uniform pores. Proven performance of 2000 × 1000 as well.

We sell precision porous chucks that achieve stable adsorption by using porous ceramics. They have high wear resistance and heat resistance, and there is no dust generation from the porous ceramics. Additionally, with a pore diameter of 2μm, they have partial adsorption capability and can uniformly adsorb thin glass and films without deformation. There is no need to replace the chuck for each workpiece size. This product can be manufactured in the required size. Please feel free to contact us. 【Features】 ■ Uses a porous ceramic plate with uniform pores ■ High wear resistance and heat resistance, with no dust generation from the porous ceramics ■ Partial adsorption capability with a pore diameter of 2μm ■ Uniform adsorption of thin glass and films without deformation ■ Partial adsorption is possible / one adsorption plate is sufficient ■ Can be manufactured in the desired size *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Contract manufacturing

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PDW Corporation General Catalog

PDW Corporation General Catalog

High-precision products created by the craftsmanship of skilled artisans. We provide a clear introduction using numerous photos.

This catalog is a comprehensive catalog of our company, which engages in the development, design, and manufacturing of system equipment, as well as the manufacturing and sales of precision stone products such as granite slabs, stone jigs, stone machine bases, and precision stone sliders, along with precision transport. It includes information on machining, lapping processing, inspection, and precision porous chucks. We challenge the limits of precision and respond to demands for accuracy at the 1/1000 millimeter level. If you are interested, please feel free to consult with us. [Contents (excerpt)] ■ Machining ■ Lapping processing and inspection ■ Assembly ■ Precision contract processing ■ Precision porous chucks *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Contract manufacturing
  • Other contract services

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Printed Circuit Boards for LEDs Achieving High Brightness and High Heat Dissipation

Printed Circuit Boards for LEDs Achieving High Brightness and High Heat Dissipation

High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. We offer a lineup that includes "high heat dissipation metal printed circuit boards," "high brightness and high heat dissipation reflector printed circuit boards," "high heat dissipation multilayer printed circuit boards," and "high heat dissipation thick copper printed circuit boards." [Required Technical Elements] - We propose high-reflective solder resist and reflector processing techniques to achieve high brightness. - We offer high reflection rate Au and Ag plating techniques unique to companies that have emerged from plating. - For heat dissipation technology, we propose heat dissipation CEM3 and heat dissipation FR4 starting from metal printed circuit boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Package printed circuit board (PCB) / Chip-on-Board (COB)

Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

  • Printed Circuit Board

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Package printed circuit board

Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

  • Printed Circuit Board

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High thermal conductivity printed circuit board

High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Frequently Asked Questions about Printed Circuit Boards

Frequently Asked Questions about Printed Circuit Boards

Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.

At Sato-sen Co., Ltd., we provide high-quality printed circuit boards that meet the increasing demands for high functionality and high precision. We offer solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Here are some frequently asked questions regarding printed circuit boards: 【Production Related】 - Design: Supports DXF, DWG, and COB++, compatible with OrCAD Capture and BSchl. - Delivery Time: Can accommodate short delivery courses and can also shorten delivery times after ordering. - Quantity: Capable of producing even a single board. - Cost: Can reduce initial costs as we can handle everything from prototypes to mass production. - UL: UL compliant as we are a UL certified factory. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Introducing circuit formation technology! A method to improve the positional accuracy of patterns on both sides.

Sato-sen Co., Ltd. offers multilayer printed circuit boards with high density, IVH, BVH, and buildup, providing design flexibility. We ensure improved hole position accuracy with ultra-high-speed micro-diameter drill machines, high-density circuit formation (L/S = 30/30) using LDI (Laser Direct Imaging), and stable quality multilayer printed circuit boards through X-ray reference hole drilling and X-ray length measurement. 【Features】 - Flat plugs (pad on via) allow for mounting on through holes. - Landless through holes enable support for narrow pitch patterns. - CCD technology enhances the precision of pressing, routing, and V-cut to match the pattern position (±75). - Ultra-fine printing is possible (1 character measuring 0.28mm vertically x 0.15mm horizontally). Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Introducing bonding silver plating technology! Electroless silver plating is possible.

Sato-sen Co., Ltd. is capable of performing silver plating that can be deposited without electrolysis. We offer optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, which can reduce discoloration due to thermal degradation during assembly and use. We provide reflector processing for high brightness and optimal surface treatment for LED wavelengths. We also propose various heat dissipation measures to lower the junction temperature of the chips. 【Features】 - Outline processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation is possible with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.

At Sato-Sen Co., Ltd., we offer integrated rigid-flex printed circuit boards that utilize flexible substrates for multilayer boards, enabling miniaturization and cost reduction, including assembly. By adopting rigid-flex technology, we can reduce the number of printed circuit boards, leading to smaller finished products, and eliminate the soldering process for flexible printed circuit boards, thereby reducing assembly space. This also helps to minimize noise caused by antenna effects in flexible sections and reflections at connection points, as seen in traditional designs. **Features of Miniaturization with Rigid-Flex Printed Circuit Boards:** - Pins are inserted into through-holes and soldered, enhancing strength. - The flexible connection between rigid boards is embedded in the inner layers, providing noise prevention benefits. - Flexible materials are incorporated into the inner layers, eliminating the need for soldering and streamlining the process. For more details, please contact us.

  • Printed Circuit Board

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