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substrate(red) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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substrate Product List

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[Research Material] Global Market for Aluminum Substrates

[Research Material] Global Market for Aluminum Substrates

Global Market for Aluminum Substrates: Below 1mm, 1mm to 2mm, Above 2mm, Heat Sinks, Power Electronics, LED Lighting, Others

This research report (Global Aluminum Substrates Market) investigates and analyzes the current state and outlook for the global aluminum substrates market over the next five years. It includes information on the overview of the global aluminum substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the aluminum substrates market include those under 1mm, 1mm to 2mm, and over 2mm, while the segments by application cover heat sinks, power electronics, LED lighting, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of aluminum substrates. It also includes the market share of major companies in the aluminum substrates sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Thick Film Circuit Boards

[Research Material] Global Market for Thick Film Circuit Boards

World Market for Thick Film Circuit Boards: Single-layer Thick Film Circuit Boards, Multi-layer Thick Film Circuit Boards, LEDs, Chip Resistors, Electronic Modules, Others

This research report (Global Thick Film Circuit Substrates Market) investigates and analyzes the current status and outlook for the global thick film circuit substrate market over the next five years. It includes information on the overview of the global thick film circuit substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the thick film circuit substrate market focus on single-layer thick film circuit substrates and multi-layer thick film circuit substrates, while the segments by application cover LEDs, chip resistors, electronic modules, and others. The regional segments calculate the market size of thick film circuit substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the thick film circuit substrate market, product and business overviews, and sales performance.

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Sapphire Wafer

Sapphire Wafer

We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!

In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.

  • others
  • Chip type LED
  • diode

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Power semiconductor substrate (DCB)

Power semiconductor substrate (DCB)

Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!

This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*

  • Printed Circuit Board
  • Other semiconductors

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[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

[Research Material] Global Market for Active Metal Brazing (AMB) Substrates

World Market for Active Metal Brazing (AMB) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), ...

This research report (Global Active Metal Brazed (AMB) Substrates Market) investigates and analyzes the current state and future outlook of the global active metal brazed (AMB) substrates market over the next five years. It includes information on the overview of the global active metal brazed (AMB) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the active metal brazed (AMB) substrates market by type include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and others, while the segments by application cover power electronics, automotive electronics, home appliances, aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of active metal brazed (AMB) substrates. It also includes the market share of major companies in the active metal brazed (AMB) substrates market, product and business overviews, and sales performance.

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[Research Material] World Market for Printed Circuit Boards

[Research Material] World Market for Printed Circuit Boards

World Market for Printed Circuit Boards: Rigid 1-2 Sides, Standard Multilayer, HDI/Microvia/Build-up, IC Substrates, Flexible Circuit ...

This research report (Global Printed Circuit Board Market) investigates and analyzes the current state of the global printed circuit board market and its outlook for the next five years. It includes information on the overview of the global printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the printed circuit board market include rigid 1-2 side, standard multilayer, HDI/microvia/build-up, IC substrates, flexible circuits, rigid-flex, and others. The segments by application cover home appliances, computers, communications, industrial & medical, automotive, military & aerospace, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of printed circuit boards. It also includes the market share of major companies in the printed circuit board sector, product and business overviews, and sales performance.

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DPC substrate

DPC substrate

High heat resistance and high strength! Ceramic wiring board using DPC plating method.

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Research Material] Global Market for Printed Circuit Boards for 5G Base Stations

[Research Material] Global Market for Printed Circuit Boards for 5G Base Stations

World Market for 5G Base Station Printed Circuit Boards: High Frequency & High-Speed PCBs, Backplane PCBs, Others, 5G Macro Base Stations, 5G Micro Base Stations

This research report (Global Printed Circuit Board for 5G Base Station Market) investigates and analyzes the current status and future outlook of the global market for printed circuit boards used in 5G base stations over the next five years. It includes information on the overview of the global market for printed circuit boards for 5G base stations, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the market for printed circuit boards for 5G base stations include high-frequency & high-speed PCBs, backplane PCBs, and others, while the segments by application focus on 5G macro base stations and 5G micro base stations. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size for printed circuit boards for 5G base stations. It also includes the market share of major companies in the printed circuit board market for 5G base stations, product and business overviews, and sales performance.

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Technical silicon wafer substrates and foundry services.

Technical silicon wafer substrates and foundry services.

We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.

Icemos Technology is a best-in-class supplier of MEMS and advanced engineering substrates. With over 20 years of experience, Icemos promises that all customers will receive excellent service from inquiry to product delivery, backed by exceptional manufacturing skills and the latest technological developments. Our engineering team provides technical support for innovative product development, design proposals, and special services. If existing products are not listed, we will also develop unique special products in collaboration with our customers. This is the service that sets us apart. SOI = Silicon on Insulator SiSi = Silicon Silicon bonded DSOI = Double SOI DSP = Double Sided Polished CSOI = Cavity SOI Thin SOI TSOI = Trench SOI TSV = Through-Silicon Vias Foundry services Please feel free to contact us. http://jp.icemostech.com/products.html

  • Wafer

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World's thinnest 0.6mm supercapacitor "G/H Series"

World's thinnest 0.6mm supercapacitor "G/H Series"

Achieves ultra-thin, flat, compact design with low ESR (Equivalent Series Resistance).

CAP-XX's electric double-layer capacitors (supercapacitors) are the world's thinnest at 0.6mm thick, compact yet high-capacity, and feature a high energy density, allowing for high output even under peak load due to their low ESR (equivalent series resistance). They are available in a wide range of options to suit various usage conditions and applications.

  • Capacitor

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Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO Coated Substrate

Gold / Silver / Aluminum / ITO coated substrate (slide glass / cover slip / silicon wafer / mica)

Surface plasmon resonance (SPR), microarrays, biosensors, nanotechnology, neurobiology, self-assembled monolayers (SAM), X-ray diffraction (XRD), semiconductors, and a variety of research applications can utilize atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other electron microscopy techniques. In addition to slide glass, we also offer silicon wafers and mica substrates. The main coatings are gold (Au), silver (Ag), aluminum (Al), and ITO. High-reflectivity gold-coated slides are ideal for observing backscattered electron images (BSE) (10-15 eV) and secondary electron images (SE) (5 eV) using SEM. For backscattered electron images <BSE>, a gold thickness of 10 nm is recommended, while for secondary electron images <SE>, products of 50/100 nm are suggested.

  • Glassware and containers
  • Other inspection equipment and devices
  • Other consumables

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Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."

Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."

"Hot melt molding," which is increasingly being adopted for waterproofing and insulating sealing of substrates and electronic components. We are offering a sample of an LED substrate sealed with hot melt molding for free.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

  • Other Auto Parts
  • Other polymer materials
  • Electrical equipment parts

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[Research Material] Global Market for Sapphire Composite Substrates

[Research Material] Global Market for Sapphire Composite Substrates

World Market for Sapphire Composite Substrates: C-Plane Sapphire Substrates, R/M-Plane Sapphire Substrates, Patterned Sapphire Substrates ...

This research report (Global Sapphire Compound Substrate Market) investigates and analyzes the current state and outlook for the global sapphire compound substrate market over the next five years. It includes information on the overview of the global sapphire compound substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the sapphire compound substrate market include C-Plane sapphire substrates, R/M-Plane sapphire substrates, and patterned sapphire substrates, while the segments by application include LED, RFIC, laser diodes, silicon-on-sapphire (SoS) ICs, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of sapphire compound substrates. It also includes the market share of major companies in the sapphire compound substrate market, product and business overviews, and sales performance.

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[Research Material] World Market for Double-Sided Printed Circuit Boards

[Research Material] World Market for Double-Sided Printed Circuit Boards

World Market for Double-Sided Printed Circuit Boards: Glass Fiber, Paper, Metal, Ceramic, Others, Industrial/Medical, Home Appliances, Military/Aerospace, Others

This research report (Global Double Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of double-sided printed circuit boards over the next five years. It includes information on the overview of the global double-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the double-sided printed circuit board market include fiberglass, paper, metal, ceramic, and others, while the segments by application cover industrial/medical, home appliances, military/aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of double-sided printed circuit boards. The report also includes the market share of major companies in the double-sided printed circuit board sector, product and business overviews, and sales performance.

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