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substrate(red) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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substrate Product List

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[Research Material] World Market for LED Sapphire Substrates

[Research Material] World Market for LED Sapphire Substrates

World Market for LED Sapphire Substrates: 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, others, light-emitting diodes ...

This research report (Global LED Sapphire Substrate Market) investigates and analyzes the current status and outlook for the global LED sapphire substrate market over the next five years. It includes information on the overview of the global LED sapphire substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the LED sapphire substrate market include 1-inch, 2-inch, 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, and others, while the segments by application include light-emitting diodes (LED), radio frequency integrated circuits (RFIC), laser diodes, silicon sapphire (SoS) ICs, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of LED sapphire substrates. The report also includes the market share of major companies in the LED sapphire substrate market, product and business overviews, and sales performance.

  • Other services

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Low Thermal Expansion Material

Low Thermal Expansion Material

LEX Zero Thermal Expansion Material CTE = 0 (Zero)

Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)

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  • alloy
  • Other optical parts
  • Resin mold

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GaAs Based Epi Wafer

GaAs Based Epi Wafer

We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.

We provide custom structure MOCVD epitaxial growth on GaAs substrates ranging from 2 inches to 6 inches. We offer comprehensive services for GaAs epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.

  • Wafer

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Program Creation System "Freedom"

Program Creation System "Freedom"

For selective soldering equipment! Detecting ground connection pins that require preheating time.

"Freedom" is a program creation system that generates soldering programs based on CAD data standards, automatically optimizing preheating/spray time and soldering paths. It automatically selects nozzle diameter and operation from the board layout information. It can automatically check for interference based on the clearance between the nozzle and surrounding components. 【Features】 ■ Soldering path optimization ■ Profile creation ■ Component interference check ■ Component library function *For more details, please refer to the PDF document or feel free to contact us.

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  • Soldering Equipment

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VMIVME-2210

VMIVME-2210

64-Channel Latching or Momentary Relay Board with Built-in-Test

The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.

  • Embedded Board Computers

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Development board for module [SOM-DB5830]

Development board for module [SOM-DB5830]

Development board for COMExpress R3.0 Type 6/10 module.

Development board for COMExpress R3.0 Type 6/10 modules ● Expansion: PCIe x16, PCIe x4 ● Display types: VGA, LVDS / eDP, HDMI / DP ● ATX form factor compatible with both ATX and AT power supplies ● Compatible with COM Express Basic / Compact / COM-Ultra modules ● Development board compliant with PICMG COM.0 R3.0 Type 6 pin-out

  • Industrial PCs

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LTCC substrate

LTCC substrate

LTCC substrate

LTCC stands for Low Temperature Co-fired Ceramics, which refers to low-temperature sintered ceramics. The low firing temperature allows the use of metals with low resistance as conductors, making it ideal for high-frequency applications due to its low loss. Its ease of multilayering and flattening, along with minimal shrinkage variation, enables high-precision and high-density mounting. By using DPC (Direct Plating Copper), it can also be utilized in applications that require high thermal conductivity and excellent heat dissipation. Thus, LTCC is expected to be used in various fields such as circuit boards and semiconductor packages.

  • others

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Selective Soldering Program Creation System "Freedom"

Selective Soldering Program Creation System "Freedom"

Optimize the soldering program based on CAD data! Software to control the equipment.

"Freedom" is a program creation system for selective soldering equipment. By setting the pins that connect to the ground layer, it automatically adjusts the nozzle's operation and speed considering the required heat amount. When soldering with multiple devices, it can automatically allocate tasks to ensure uniform takt time for each device. It is equipped with a check function and features aimed at reducing data creation time and processing time. Additionally, our company will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. [Benefits] ■ Error checking of nearby components before processing is possible ■ Shortening of program creation time by accumulating component information ■ Automatic setting of optimal soldering routes to reduce processing time *For more details, please refer to the PDF materials or feel free to contact us.

  • Other core systems

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DBC substrate (Direct Bonded Copper)

DBC substrate (Direct Bonded Copper)

Ion migration risk is reduced! Insulation substrate for power modules.

The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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High thermal conductivity substrate "Metal substrate"

High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board

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Zero One Rotary Encoder Expansion Board 'ADRSZRE'

Zero One Rotary Encoder Expansion Board 'ADRSZRE'

Easy measurement just by connecting to the terminal block/thru-hole! Accelerate the creation of IoT devices!

The "ADRSZRE" is a rotary encoder expansion board exclusively for the Raspberry Pi Zero. By simply connecting a rotary encoder to the terminal block/thru-hole, measurement can be easily performed, accelerating the creation of IoT devices. Additionally, by conducting measurements with a PIC microcontroller, it prevents the loss of pulses from high-pulse rotary encoders. 【Features】 ■ Compact "pHAT" size ■ High-precision measurement ■ Built-in high-performance PIC microcontroller considering real-time capabilities ■ Equipped with LEDs to visualize operating status *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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eDP Simple Signal Generation Board 'iM1427'

eDP Simple Signal Generation Board 'iM1427'

It is suitable for high-resolution, high-speed transmission modules.

The "iM1427" is a simplified signal generation board with eDP (embedded Display Port/5.4G) interface, compatible with modules for Ultra books and Tablets, and includes pattern editing software for eDP output. This board has two DisplayPort outputs, allowing for simultaneous lighting of two panels, thereby expanding the range of inspection and evaluation methods. 【Features】 ■ Includes software for editing lighting patterns and timing ■ Allows pattern creation and timing settings to match the testing environment conducted by the customer *For more details, please download the PDF (English version) or feel free to contact us.

  • Signal Generator
  • Printed Circuit Board

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers

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