We offer high-quality cylindrical targets, planar targets, and deposition materials for sputtering equipment at reasonable prices.
The following methods will be used to produce cylindrical targets.
1. Method: Integrated extrusion of melting materials
Typical materials: Ti, Al, Cu
Advantages: No risk of breaking, can rotate at low speeds
Disadvantages: No high-purity products available
2. Method: Plasma spray
Typical materials: Si, Ag, ZnAl, etc.
Advantages: Relatively low risk of breaking, inexpensive
Disadvantages: Difficult to achieve high-purity products above 5N, prone to defects, takes time to start up
Note: Initial startup time can be shortened depending on the surface finishing method
3. Method: Cold spray
Typical materials: Ag, etc.
Advantages: Relatively low risk of breaking, can be sprayed directly onto used targets.
Disadvantages: More expensive than plasma spray method. Takes time to start up.
Note: Same as above 2
4. Method: Indium bonding of cast targets
Typical materials: Special alloys, etc.
Advantages: High-purity products are possible.
Disadvantages: Risk of arcing from cuts. Can break or melt indium at low rotation speeds. Expensive. Low power input limit.
5. Method: Indium bonding of sintered targets
Typical materials: ITO, AZO, etc.
Advantages: High-purity products are possible. No restrictions on materials.
Disadvantages: Same as above 4.
