Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 47 items
Niobium (Nb) target Purity≧3N5
■ Four sides C processing ■ Controllable surface roughness ■ Internal Grain Size can be customized according to customer requirements ■ Configurable Import License ■ Experience in supplying semiconductor companies *For more details, please download the PDF or feel free to contact us.
Tin (Sn) target Purity≧4N
■ High purity Purity≧99.99% (4N) High purity requirements for materials such as semiconductors and optical films ■ Good conductivity Tin (Sn) has excellent conductivity and is suitable for the production of transparent conductive films such as ITO thin films *For more details, please download the PDF or feel free to contact us.
Tantalum (Ta) Target Purity>5N
■Tantalum target materials are often used in PVD and CVD coating processes ■High temperature resistance and strong corrosion resistance ■High density Can be used for high-intensity sputtering, with high film deposition efficiency ■Good conductivity *For more details, please download the PDF or feel free to contact us.
Chromium (Cr) target Purity>3N8
■Purity: 2N5-3N8 Manufacturing method: HIP ■ High hardness ■ Strong abrasion resistance *For more details, please download the PDF or feel free to contact us.
Hafnium (Hf) target Purity>4N5
■High-purity Hf target Application in the semiconductor industry GDMS with purity measurement values Under the regulatory environment, strictly follow the laws of each country and apply for a license to export ■ Available for civilian use *For more details, please download the PDF or feel free to contact us.
Nickel (Ni) target Purity2N~4N5
■High Purity Using in the semiconductor industry. ■Density High density and uniformity ■Nickel alloys are also available NiCr, NiTi, NiCu, NiCuTi *For more details, please download the PDF or feel free to contact us.
Titanium Ti Target, Each type purity is possible
■Purity: Each type purity is possible ■Shape: Planner target Rotary target Any abnormal form target ■Titanium alloy target Thin film characteristics such as hardness and conductivity can be adjusted *For more details, please download the PDF or feel free to contact us.
All products are sold individually as standard specifications. We offer quick delivery due to complete stock availability.
The laser detection target is an essential tool for visualizing and aligning invisible lasers. This product features superior performance not found in conventional detection targets and is a groundbreaking product designed with user safety in mind when using UV to IR lasers. By using this product, it becomes possible to improve issues that have been problematic with traditional detection targets in beam visualization, beam profiling, and alignment work. We offer three types based on sensitivity wavelength: UV type, VIS (visible light) type, and IR type. Each type is available in three styles: card type, thin plate type, and bench mount type. For the product lineup of standard specifications, their details, and sales prices, please refer to the relevant product page on the official website of Edmund Optics Japan (accessible from the product homepage linked above). *You can download the catalog featuring this product from the link below on the Edmund Optics Japan website.
Short delivery time for stock sales! All items available for sale from one piece.
Edmund Optics offers a wide range of test targets suitable for many imaging systems. The test targets are designed for easy implementation within imaging systems for quick and simple setup. The test targets can be reused across many different systems, allowing a limited number of targets to be utilized for numerous imaging systems. The test targets are available in a variety of user-friendly substrate material options, such as glass, chrome, and photo paper. ■ For more details, please visit the official Edmund Optics website via the link below.
Rugged and lightweight design intended for outdoor use! Capable of measuring a wide dynamic range.
"PFK" is a reflection target kit for LiDAR testing. It often includes a combination of three reflectance rates: 10%, 50%, and 80%, allowing for measurements across a wide dynamic range. Additionally, the reflection targets are close to an ideal diffuse reflection surface, durable, and lightweight, making them suitable for outdoor measurements. They are resistant to dirt and can be washed with water. A convenient case for storage and transport is included as standard. 【Features】 - Enables measurements across a wide dynamic range with a set of three reflectance rates: 10%, 50%, and 80% - Reflectance data for the wavelength range of 350 to 1000 nm is included - Optionally, reflectance data for the range of 250 to 2500 nm can be provided - Three sizes are available based on the measurement target size: 0.5m square, 1m square, and 1.5m square - Diffuse reflection characteristics are close to an ideal Lambertian regardless of the angle of incidence *For more details, please refer to the PDF document or feel free to contact us.
World's highest quality tungsten-molybdenum sputtering target.
Through Planze's unique powder metallurgy, we optimize the purity, crystal structure, density, and shape of tungsten and molybdenum targets, accommodating various requests up to the bonding with cooling substrates. We provide extensive support from development to mass production.
Stereo PIV, volume (Tomo) reduces human errors generated by planar and three-dimensional targets in PIV/PTV, enabling calibration in a short time.
Active Target reduces human errors that occur with traditional stereo PIV and volume (Tomo) PIV/PTV in planar or three-dimensional targets, allowing for calibration to be completed in a shorter time. The target is equipped with LEDs, which can be automatically flashed through software control, enabling quick calibration in the depth direction. By using a traverse device, extensive calibration can be performed, and by connecting multiple targets, calibration for large areas can also be accommodated.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
Sputtering: Several pieces of tile-shaped silicon are joined together and used as side sputtering.
We manufacture precious metal sputtering targets at our own factory. We can accommodate small lots.
- Direct sales from the manufacturer enable low-cost and short delivery time for products. - Capable of processing from small lots to mass-produced items, as well as special materials for experimental development. - Providing high-quality materials with high purity, uniform composition, high density, and low gas quality. - Thorough quality control and stable supply of products are ensured by ISO9001. - After-sales support including reuse of used materials, recovery and refining, and purchasing.
We offer high-quality cylindrical targets, planar targets, and deposition materials for sputtering equipment at reasonable prices.
The following methods will be used to produce cylindrical targets. 1. Method: Integrated extrusion of melting materials Typical materials: Ti, Al, Cu Advantages: No risk of breaking, can rotate at low speeds Disadvantages: No high-purity products available 2. Method: Plasma spray Typical materials: Si, Ag, ZnAl, etc. Advantages: Relatively low risk of breaking, inexpensive Disadvantages: Difficult to achieve high-purity products above 5N, prone to defects, takes time to start up Note: Initial startup time can be shortened depending on the surface finishing method 3. Method: Cold spray Typical materials: Ag, etc. Advantages: Relatively low risk of breaking, can be sprayed directly onto used targets. Disadvantages: More expensive than plasma spray method. Takes time to start up. Note: Same as above 2 4. Method: Indium bonding of cast targets Typical materials: Special alloys, etc. Advantages: High-purity products are possible. Disadvantages: Risk of arcing from cuts. Can break or melt indium at low rotation speeds. Expensive. Low power input limit. 5. Method: Indium bonding of sintered targets Typical materials: ITO, AZO, etc. Advantages: High-purity products are possible. No restrictions on materials. Disadvantages: Same as above 4.
