Ball spline "SSP-AM type"
Ideal for the head section of chip mountings and multi-use! Achieves lightweight and smooth movement.
The ball spline is a linear motion mechanism that utilizes the rolling motion of balls. It can simultaneously bear radial loads and torque, making it suitable for a wide range of applications such as transport devices and robots. Among them, the 'SSP-AM type' features a compact outer cylinder while maintaining the same shaft diameter compared to the conventional SSP type, making it ideal for chip mount heads and multi-link uses. Additionally, we also offer a corrosion-resistant version. 【Features】 ■ High load capacity and long lifespan ■ Easy additional processing ■ Capable of high-precision torque transmission ■ Enables high-speed motion and high-speed rotation For more details, please contact us or download the catalog.
- Company:日本ベアリング
- Price:Other