Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 102 items
6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus
Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm
Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android
NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm
Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android
11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.
Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB
【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO
ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB
【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB
**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280)
NXP/i.MX6 equipped SMARC short-size module
The SMARC ("Smart Mobility ARChitecture") is a definition for a versatile small form factor computer-on-module targeting applications that require low power, cost-effectiveness, and high performance. It also caters to systems that need more compact solutions than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms and consume less power, significantly reducing the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compliant modules in low-power mobile devices. The actual power consumption of SMARC CPU modules typically ranges from 2W to 6W, allowing for passive cooling and reducing the effort and overall costs for subsequent development. By using this standard, up to 9W of continuous power can be utilized for more demanding applications.
![CPU module "SMARC" [LEC-iMX6R2]](https://image.mono.ipros.com/public/product/image/98d/2000510685/IPROS63124557240714370705.jpeg?w=280&h=280)
NXP i.MX 6 Multicore Arm Cortex-A9 equipped SMARC short-size module
SMARC (Smart Mobility ARChitecture) is a multi-purpose small form factor computer module definition aimed at applications requiring low power, low cost, and high performance. The module typically uses the same or similar ARM SoCs found in many well-known devices such as tablet computers and smartphones. Alternative low-power SoCs and CPUs, such as tablet-oriented x86 devices and other RISC CPUs, can also be used. The power envelope of the module is usually less than 6W. The module serves as a building block for portable and stationary embedded systems. Core CPU and support circuitry, including DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are concentrated within the module. The module is used with application-specific carrier boards that implement other functionalities such as audio CODECs, touch controllers, and wireless devices.
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280)
NXP i.MX 8MPlus equipped SMARC short-size module
The ADLINK LEC-IMX8MP is the first module compliant with SMARC revision 2.1, based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor equipped with an optional neural processing unit (NPU) that operates at up to 2.3 TOPS, focusing on industrial IoT with machine learning and vision, advanced multimedia, and high reliability. Additionally, it supports dual image signal processors and two camera inputs, enabling an effective vision system. The LEC-IMX8MP is suitable for applications such as smart homes, buildings, cities, and Industry 4.0.
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280)
SMARC short-size module equipped with MediaTek Genio 1200 platform.
The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates a series of IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power envelope, making it an ideal solution for robotic and drone applications across various fields such as consumer, enterprise, defense, industrial, and logistics.
7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module
The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280)
NXP i.MX95 equipped SMARC 2.1 short-size module
ADLINK's LEC-IMX95 is a state-of-the-art SMARC revision 2.1 compliant module based on the powerful NXP i.MX95 (Arm Cortex-A55 x6 + Arm Cortex-M7 x1 + Arm Cortex-M33 x1) processor, integrating an ISP and an eIQ Neutron Neural Processing Unit (NPU) that operates at up to 2 TOPS. It features high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and capabilities for fast data processing along with safety and security functions.
The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.
N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.
