Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
31～45 item / All 66 items
Thick film circuit board (ceramic)
We offer products related to printing patterning on ceramics, including printed circuit boards for hybrid ICs, thick film circuit boards, and various electronic components, from CAD design of patterns to production. We deliver low-cost, high-reliability products based on years of experience.
Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.
For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.
Achieving fine pattern processing using methods such as etching and additive techniques!
FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.
One-stop execution from circuit board design to manufacturing, assembly, and component procurement! We will free your company from the hassle of adjustments.
Our company offers "High-Frequency High-Speed Digital Power Circuit Board Design and Manufacturing." We can accommodate a variety of board materials and hybrid boards, fulfilling customer requirements in terms of schedule, cost, performance, and design. Additionally, we have a track record in designing and manufacturing 60GHz band boards and DDR4×32 boards. For high-end board design and manufacturing, please leave it to us. 【Features】 ■ Diverse high-frequency circuit board materials ■ Stable operation of high-speed digital circuits ■ Thermal management for power circuits ■ Collaboration with universities and research institutions ■ Simulation technology *For more details, please refer to the PDF document or feel free to contact us.
Building a consistent high-quality line! Introducing electronic material substrates with high reliability!
The "Alumina Thick Film Circuit Board" is an electronic material substrate with high reliability, where electrode materials and resistive materials are baked onto an alumina substrate that excels in heat dissipation and heat resistance. It is suitable for applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. Our company, in collaboration with our affiliated company "Ina Ceramic Co., Ltd.," produces and sinters alumina substrates, establishing a consistent high-quality line from circuit printing, firing, resistance value adjustment, component mounting, molding, to electrical testing. 【Features】 ■ Electrode materials and resistive materials are baked onto an alumina substrate with excellent heat dissipation and heat resistance ■ High reliability ■ A consistent high-quality line is established from circuit printing to electrical testing *For more details, please refer to the PDF document or feel free to contact us.
From substrate production to component mounting! We manufacture wireless LAN routers and image processing boards!
At Nichisei Electric Manufacturing Co., Ltd., we develop, design, and manufacture electronic circuit boards, including software compatible with various microprocessors. We offer a comprehensive service from circuit design to board manufacturing and component assembly. We have extensive experience in the development of wireless LAN routers, router boards, image processing boards, terminal adapters, modems, and more. 【Features】 ■ Development of control mechanisms for various machinery ■ Comprehensive service from circuit design to manufacturing and assembly *Please feel free to contact us for more details.
The brightness is always constant.
This circuit is output stable, so even if the input voltage fluctuates (90V⇔242V), the current flowing through the LED does not change.
Compatible with LED lamp currents up to 700mA!
This product is a constant current board with dimming function suitable for LEDs with a lamp current of up to 700mA. Since this circuit is output stable, the current flowing to the LED does not change even if the input voltage fluctuates. Additionally, the brightness remains constant. It is compatible with both 50Hz and 60Hz due to its inverter design. It includes protection circuits such as a current fuse, an oscillation stop safety circuit for overheating prevention, and a no-load short-circuit protection circuit. 【Features】 ■ Brightness remains constant ■ Equipped with protection circuits ■ Insulated type *For more details, please refer to the catalog or feel free to contact us.
Compatible with Lumiredd's LED! Current adjustment is possible with the dimmer volume.
This product is a constant current board compatible with LUMILEDS LEDs. The board size is 87mm in length, 18mm in width, and 15mm in height, with an output current of approximately 0.60A to 1.5A. Current adjustment is possible using the dimming volume located on the board. In addition to this board, we offer various other constant current boards. Please feel free to contact us. 【Features】 ■ Compatible with LUMILEDS LEDs ■ Current adjustment available *For more details, please refer to the catalog or feel free to contact us.
A meticulous support system from circuit and pattern design to prototyping and mass production within Japan.
We will propose a design based on mass production manufacturing at overseas partner factories, aiming for total cost reduction. Our experienced designers, who are well-versed in electrical characteristics such as digital/analog circuits, impedance, and crosstalk, will provide optimal circuit design using simulations and other methods. Our manufacturing technicians, stationed at each overseas partner factory, will directly manage the manufacturing process and quality, and we will also achieve low-cost supply through strengthened management of production and inspection processes.
Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.
The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.
We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!
Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.
By conducting a functional analysis of the mounted devices during substrate integration, we will propose and implement the optimization of over-spec components and inefficient sequences.
Through circuit board technology, we were able to significantly reduce costs, labor, and size by reducing the number of components and then creating the circuit board. Reduction examples: wiring labor by 70%, size by 75%, and component costs by 20%. Key points when creating a circuit board: While it is possible to reduce size and labor by creating a circuit board with the same functionality, it is also possible to significantly slim down by breaking down the functions one by one and minimizing the necessary components. Of course, we consider the scalability of functions and future risks, conducting hearings with customers to make proposals. Therefore, in some cases, it may be better not to create a circuit board for areas with high scalability. While we cannot completely predict issues such as component shortages or discontinued parts, we can provide advice on inventory management based on trends. As an example of our proposals: - Optimization of power capacity components according to the current-carrying parts (using large-capacity components in small-capacity areas) - Optimization of functional components (for instance, replacing two component functions with one component) It is not uncommon for new products to be launched that did not previously exist as components on circuit boards. Please feel free to consult with Kairoski, specialists in circuit board components.
