Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities.
**Benefits of Bare Chip Mounting**
- **Increased Added Value**
→ Miniaturization and thinning expand product applications and create new markets.
→ Incorporating semiconductor backend processes enhances manufacturing added value.
- **Improved Cost Competitiveness**
→ Miniaturization and standardization improve production efficiency and reduce material costs.
→ Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth.
- **Enhanced Performance**
→ The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss.
- **Environmental Considerations**
→ Reducing the number of materials used can decrease waste.