Reduce chip size by over 40%! Leverage in-house know-how and technology to achieve the creation of high value-added products.
The technology for high-speed and long-distance optical communication is advancing at a remarkable pace. By combining photodetectors (PD) and circuits into a single chip, we are not only aiming for overall space-saving but also miniaturizing the chip itself, which requires further performance improvements, multifunctionality, and the development of high-quality products.
Our company leverages the optical technology cultivated through OEIC and extensive mass production experience, along with the ability to conduct design and process development tailored to product specifications in-house, enabling us to achieve multifunctionality and superior performance compared to target products.
As a result, we have been able to develop products that excel beyond the target products, including noise reduction, expansion of the recommended operating power range, and the addition of power, temperature monitoring, and shutdown functions.
**Effects**
- Noise reduction and expansion of the recommended operating power range
- Development of superior products compared to target products, including the addition of power, temperature monitoring, and shutdown functions
- Reduction of chip size by over 40% and package size by over 50%
*For more details, please refer to the PDF document or feel free to contact us.*
![[Development Case] Optical Communication Driver IC](https://image.mono.ipros.com/public/product/image/4bb/2000660615/IPROS72864948568983844768.png?w=280&h=280)
