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  6. Pre-driver IC 'TB9061AFNG/TB9062FNG'

Pre-driver IC 'TB9061AFNG/TB9062FNG'

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last updated:Feb 22, 2021

東芝デバイス&ストレージ
東芝デバイス&ストレージ
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Vehicle-mounted 3-phase brushless sensorless driver IC

The "TB9061AFNG/TB9062FN" is an automotive motor driver IC that enables miniaturization of the ECU board by eliminating the hall sensor. Our company offers automotive solutions with high robustness and reliability through our unique technologies, such as sensorless technology without microcontrollers and functional safety technology. Please feel free to contact us if you have any inquiries. 【Features】 ■ Built-in hard logic allows for microcontroller-less operation (no software development required) and motor control ■ Built-in stall detection and automatic recovery control (improves startup performance) ■ Various abnormality detection circuits built-in (overcurrent detection, overvoltage detection, overheating detection) ■ Reliability: AEC-Q100 compliant *For more details, please download the PDF or feel free to contact us.

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Pre-driver IC 'TB9061AFNG/TB9062FNG'

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  • Related Link - https://toshiba.semicon-storage.com/jp/semiconduct…

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【Application Equipment】 ■ Various pumps and fans such as water pumps, oil pumps, and fuel pumps *For more details, please download the PDF or feel free to contact us.

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On-board 3-phase brushless sensorless driver IC 'TB9061AFNG/TB9062FNG'

On-board 3-phase brushless sensorless driver IC 'TB9061AFNG/TB9062FNG'

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東芝デバイス&ストレージ

東芝デバイス&ストレージ

Electronic Components and Semiconductors

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Toshiba Device & Storage Corporation was established as an independent company from Toshiba Corporation's internal company in July 2017. In addition to the traditional semiconductor business, storage products business, and semiconductor manufacturing equipment business handled by New Flare Technology Corporation, we also encompass a broad range of component businesses, including the parts and materials business managed by Toshiba Materials Corporation and Toshiba Hokuto Electronics Corporation starting in April. We consist of the Discrete Semiconductor Division, System Devices Division, Storage Products Division, and Device & Storage Research and Development Center, aiming to create products with higher added value.

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