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Flexible PCB(配線) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Nov 26, 2025~Dec 23, 2025
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Flexible PCB Product List

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Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

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