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Flexible PCB(配線) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Nov 26, 2025~Dec 23, 2025
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Flexible PCB Product List

16~30 item / All 33 items

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4-layer blind via flexible circuit board

Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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Rigid Flexible Circuit Board (Rigid FPC)

Rigid substrates and flexible printed circuit boards are integrated.

It is an FPC that combines a rigid substrate and a flexible printed circuit board.

  • Printed Circuit Board

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[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

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  • Wiring materials

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Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

  • Board to Board Connectors
  • Printed Circuit Board

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Component Mounting Flexible Circuit Board (Component Mounting FPC)

Support for component mounting is also available.

This is an FPC with electronic components mounted.

  • Printed Circuit Board

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Shielded Flexible Printed Circuit Board (Shielded FPC)

Noise countermeasure structure

This is an FPC with a shield structure that is effective for noise countermeasures.

  • Printed Circuit Board

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Pre-punched flexible printed circuit board (pre-punched FPC)

Flying lead structure

It is an FPC that can make electrical contact from both sides.

  • Printed Circuit Board

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Multilayer flexible printed circuit board (multilayer FPC)

High through-hole connectivity

This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.

  • Printed Circuit Board

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance  ・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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Double Access Flexible Circuit Board (Double Access FPC)

The copper foil itself is the base without polyimide.

The copper foil itself is the base material of the FPC.

  • Printed Circuit Board

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Impedance control flexible substrate

Achieving high-frequency and high-speed transmission by matching the characteristic impedance.

This is an FPC that matches characteristic impedance and achieves high-frequency, high-speed transmission.

  • Printed Circuit Board

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High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)"

Rich experience in embedded products for medical and special environments. Widely adopted by universities and research institutions! Simple mock-up production available. *Case study materials are currently being distributed.

At Stay Electronics Co., Ltd., we are engaged in the design, development, manufacturing, and sales of flexible printed circuits (FPC). We are equipped with prototyping facilities such as UV-YAG laser systems and cutting plotters, as well as inspection equipment like image dimension measuring instruments, allowing us to provide consistent support from design to prototyping, manufacturing, and inspection. With extensive manufacturing experience in FPCs for medical devices, we maintain a wide range of materials in stock and can flexibly respond to and propose solutions for customer requests under special conditions. ★ We also respond to requests for mock-up production! Whether it's challenges that other companies couldn't solve, stalled projects, or if you have never used flexible circuits before and just want to grasp the concept, please feel free to contact us for inquiries and consultations. 【Examples of Flexible Circuit Board Development】 ◎ FPC for ultrasound diagnostic probes ◎ FPC for superconducting devices operating at -269°C ◎ FPC for motor field winding ◎ FPC for ATM security monitoring, among others *Some development examples can be viewed via "PDF Download." Please feel free to reach out for inquiries.

  • Printed Circuit Board

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