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Flexible PCB(配線) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Apr 29, 2026～May 26, 2026
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Flexible PCB Product List

31～46 item / All 46 items

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High heat-resistant, low-loss flexible substrate for robotics

High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Flexible PCB

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What is SPET?

What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Flexible PCB

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for wearables

High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for home appliances

High heat-resistant, low-loss flexible substrate for home appliances

A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for IoT devices

High heat-resistant, low-loss flexible substrate for IoT devices

Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

A flexible substrate that achieves high reliability even in harsh automotive environments.

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for medical devices

High heat-resistant, low-loss flexible substrate for medical devices

Flexible substrates contributing to the miniaturization and high performance of precision medical devices.

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

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  • Flexible PCB

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[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

A highly durable flexible substrate that demonstrates stable performance even in harsh environments.

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss LCP flexible substrate for data centers

High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for displays

High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

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  • Printed Circuit Board
  • Flexible PCB

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High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed communication.

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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Aerospace-grade high heat-resistant, low-loss flexible substrate

Aerospace-grade high heat-resistant, low-loss flexible substrate

Flexible substrates for aerospace applications that achieve both lightweight and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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