Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.
In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed
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**Features** - High heat resistance and low outgassing due to adhesive-free structure - Stable properties even in high humidity environments due to low moisture absorption - Suitable for reducing loss of high-frequency signals due to low dielectric constant - Chemical resistance: Oil resistance against engine oil, brake oil, and ATF - Thickness adjustment possible due to material composition, allowing flexible response to applications **Our Strengths** Yamashita Material is an electronic circuit board manufacturer engaged in the development, production, and sales of FPC (Flexible Printed Circuit Boards). Our motto is to contribute to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times).
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Clean room equipment and wearable medical devices utilizing low outgassing properties - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices, as well as various sensor substrates leveraging high heat and chemical resistance
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Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![[In Development] GND Slit Structure Flexible Circuit Board](https://image.mono.ipros.com/public/product/image/f49/2001077731/IPROS79423087762742399024.jpeg?w=280&h=280)
