Flexible substrates contributing to the miniaturization and high performance of precision medical devices.
In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments
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**Features** - High heat resistance and low outgassing due to adhesive-free structure - Stable properties even in high humidity environments due to low moisture absorption - Suitable for reducing loss of high-frequency signals due to low dielectric constant - Chemical resistance: Oil resistance against engine oil, brake oil, and ATF - Thickness adjustment possible due to material composition, allowing flexible adaptation to applications **Our Strengths** Yamashita Material is an electronic circuit board manufacturer engaged in the development, production, and sales of FPC (Flexible Printed Circuit Boards). We can also accommodate short delivery times. Please feel free to consult with us.
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Cleanroom equipment utilizing low outgassing properties, wearable medical devices - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices leveraging high heat and chemical resistance, various sensor substrates
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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![[In Development] GND Slit Structure Flexible Circuit Board](https://image.mono.ipros.com/public/product/image/f49/2001077731/IPROS79423087762742399024.jpeg?w=280&h=280)
