Significantly reduce slurry adhesion! Reduce maintenance labor for CMP equipment.
"Easy cleaning with just water washing" - Excellent non-stick properties thoroughly prevent slurry adhesion. Significantly reduces cleaning time and maximizes equipment operating rate!
A major bottleneck hindering the stable operation of semiconductor manufacturing lines is the "cleaning and maintenance work of slurry that has adhered to equipment parts." ■ The problem of slurry adhesion troubling the site The polishing slurry that splashes during processes such as CMP (Chemical Mechanical Polishing) in semiconductor manufacturing strongly adheres to the surface of parts over time, consuming a significant amount of time and labor for cleaning in clean rooms. Regular line stoppages (downtime) associated with maintenance become a cause of reduced productivity for the entire factory. ■ Fluoropolymer PFA coating that drastically reduces maintenance labor and downtime By applying a PFA coating with extremely low surface energy (high non-stick properties), we can prevent the strong adhesion of slurry. This achieves excellent cleanability, allowing for easy removal even if it adheres. As scraping off the adhered material becomes unnecessary, it can be quickly removed by simply rinsing, dramatically shortening maintenance time. This increases the average time between failures (MTBF) of the equipment and contributes to improved continuous operation rates and reduced burden on operators.
- Company：日建塗装工業
- Price：Other
