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Glove box Product List and Ranking from 44 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Glove box Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 神港精機 東京支店 Tokyo//Industrial Machinery
  2. アイビック・リサーチ Ibaraki//Testing, Analysis and Measurement
  3. UNICO 　　つくばフロンティア・ラボ Ibaraki//Testing, Analysis and Measurement
  4. 4 エイエルエステクノロジー Kanagawa//Testing, Analysis and Measurement
  5. 5 UNICO 　　東京技術センター(Ｔ.Ｔ.Ｃ) Tokyo//Manufacturing and processing contract
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Glove box Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Powder Artificial Gastric Juice Artificial Intestinal Juice BioWise アイビック・リサーチ
  2. Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment" ワッティー
  3. Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device) 神港精機 東京支店
  4. SDR-type roll-to-roll sputtering device (RtoR type sputtering device) 神港精機 東京支店
  5. 5 Polyimide cure device (300mm wafer compatible clean bake device) 神港精機 東京支店

Glove box Product List

16～30 item / All 231 items

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AlN template creation device (sputtering device for oriented AlN films)

AlN template creation device (sputtering device for oriented AlN films)

AlN templates for UV-LEDs using sputtering. AlN films with high crystallinity and C-axis orientation can be created by sputtering. Latest model deposition equipment.

A AlN template on a sapphire substrate necessary for reducing the manufacturing cost of UV-LEDs is created by sputtering. An AlN film with a C-axis orientation of less than 100 arc/sec is formed by sputtering at low temperatures (below 700°C). This contributes to the cost reduction of UV-LEDs with a simple and stable process and high throughput. Sample testing is currently underway, and development for expansion into high-frequency devices is also in progress.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Multi-chamber sputtering device

Multi-chamber sputtering device

A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.

Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.

Customizing an annealing device with extensive experience in Si processes for compound semiconductor processes. Capable of high temperatures (900-1000°C) compared to hot plate types for GaAs. Proven results in the alloying of electrodes for nitride semiconductor films. Equipped with a rapid temperature rise and fall heating furnace to control the annealing of electrode films with uniform heating and optimal temperature profiles. A heat treatment device for wafer processes with a proven track record that can propose optimal equipment configurations based on production volume and processes.

  • Annealing furnace
  • Heating device

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SiC coating device (AF-IP device)

SiC coating device (AF-IP device)

A dense SiC (silicon carbide) film with excellent wear resistance and oxidation resistance is formed using PVD. A thick film (7 μm) is formed using a new ion plating method.

Achieved SiC film formation using a PVD method that was not previously available through a newly developed arc filament-type ion plating method. Adopted a new film formation technology that enables the formation of dense SiC films with excellent wear resistance and oxidation resistance at low temperatures below 400°C. The ion plating method, using solid silicon as the starting material, realizes a simple and environmentally friendly clean process with low environmental impact. The new film formation equipment offers high control over film thickness and quality, and excels in exhaust gas treatment, maintenance, installation area, and running costs compared to CVD.

  • Other machine tools
  • Other processing machines
  • Plasma surface treatment equipment

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Metal nanopaste sintering bonding compatible vacuum soldering device

Metal nanopaste sintering bonding compatible vacuum soldering device

A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.

The vacuum soldering equipment from Shinko Seiki, which supports the production of power device modules, has been upgraded. It improves the heating and cooling characteristics and expands the processing dimensions. It accommodates the sintering bonding of metal paste through the conventional atmosphere control performance and the increase in processing temperature. The realization of low oxygen concentration and the reducing power of a 100% hydrogen atmosphere significantly enhance the wettability by preventing the oxidation of wet paste. The addition of an optional heating and pressurizing mechanism also enables void-free bonding. Shinko Seiki's new vacuum soldering equipment is compatible with next-generation bonding materials.

  • Annealing furnace
  • Reflow Equipment
  • Industrial Furnace

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Plasma Lava Coating Device (STV6301 Sputtering Device)

Plasma Lava Coating Device (STV6301 Sputtering Device)

Coating Sakurajima lava with the latest plasma technology. Naturally derived functional surface treatment. Achieving new functions such as various vegetation and hydrophilicity for all types of equipment.

Coating Sakurajima lava using magnetron sputtering. Application of naturally derived lava for advanced surface treatment. Formation of thermally and chemically stable thin films utilizing the properties of lava. Realization of decorative films (transparent and interference colors) and hydrophilic films on various materials (metal, glass, fiber). Being a natural material, it does not cause allergies in humans and prevents alteration and discoloration of the material. It has been put into practical use for surface treatment of tableware, and market expansion is expected. Additionally, it excels in infrared light transmittance, and development for fiber coating is also anticipated. A lava coating with excellent energy-saving performance and environmental resistance, applied uniformly to three-dimensional shapes. A new era of surface treatment equipment.

  • Sputtering Equipment
  • Glass
  • fiber

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Conveyor-type jet far-infrared conveyor furnace

Conveyor-type jet far-infrared conveyor furnace

By combining far infrared rays and hot air jet spraying, workpieces can be heated and processed in a short time.

Examples of use include curing for printing and moisture drying, making it particularly suitable for plate-shaped and sheet-shaped workpieces.

  • Drying Equipment
  • Electric furnace

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Conveyor-type belt infrared and hot air combined conveyor furnace

Conveyor-type belt infrared and hot air combined conveyor furnace

It is a high-efficiency device that can utilize far-infrared effects while maintaining a constant ambient temperature.

Combined a far infrared heater with an emissivity of over 90% and a hot air fan heater.

  • Electric furnace
  • Drying Equipment

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Conveyor-type wicket hot air circulation conveyor furnace

Conveyor-type wicket hot air circulation conveyor furnace

We aim for complete automation of the line with the introduction of wickets.

It is possible to transport and dry printed circuit boards and sheet-like printed materials by standing them up in a dedicated jig. Complete automation of the line from the printing machine to the stocker is achievable.

  • Drying Equipment
  • Electric furnace

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Vacuum Glove Box Model VG-800

Vacuum Glove Box Model VG-800

Vacuum Glove Box Model VG-800

This is a glove box made of transparent acrylic, offering excellent visibility. The internal vacuum allows for efficient gas replacement. It comes with a pass box, making it convenient to transfer equipment samples during work.

  • Other physicochemical equipment

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Anaerobic glove box (anaerobic chamber)

Anaerobic glove box (anaerobic chamber)

Anaerobic glove box (anaerobic chamber)

This is an anaerobic glove box made of transparent acrylic, offering excellent visibility. Customization is available to accommodate changes in dimensions and the installation of other devices based on customer requests.

  • Glove box

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Gas replacement glove box

Gas replacement glove box

Gas displacement glove box

This is a gas replacement glove box with excellent visibility. The left side has a door, making it easy to place equipment inside. *Included accessories: 1 pair of latex long gloves, 4 needle valves, 1 vacuum gauge (pass box) *External dimensions (mm): 1130W × 586D × 650H *Effective internal dimensions (mm): 689W × lower edge 530D / upper edge 240D × 480H *Effective internal dimensions of the pass box (mm): 230W × 200D × 200H *Weight: approximately 40kg

  • Glove box

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Low Dew Point Glove Box

Low Dew Point Glove Box

Low Dew Point Glove Box

This is a low dew point glove box made of transparent acrylic, offering excellent visibility. It creates a low dew point environment by evacuating the interior and replacing it with inert gas. * External dimensions (mm): 983W × 675D × 655H * Effective internal dimensions (mm): 600W × 240D (top edge) / 400D (bottom edge) × 450H * Pass box internal dimensions (mm): 250W × 200D × 200H * Weight of the glove box body: approximately 80kg * Nozzle diameter of the vacuum valve: φ9mm

  • Glove box

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Desktop vacuum glove box

Desktop vacuum glove box

A must-see for those who want to handle materials that dislike moisture and oxygen and cannot be handled in the air, in a vacuum.

After vacuuming the main part of the glove box, it is possible to replace the gas, allowing for the creation of a high-purity gas atmosphere in a short time. Naturally, the pass box can also be vacuum gas replaced. It comes standard with an outlet inside, making it easy to introduce equipment such as balances. The size is compact enough to be placed on a desk, making it ideal for university laboratories. By connecting to an optional gas circulation purification device, it can be used in an environment with oxygen and moisture concentrations below 1 ppm.

  • Other laboratory equipment and containers
  • Glove box

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Vacuum glove box

Vacuum glove box

Explore new materials in a spacious environment!

After vacuuming the main body of the glove box, it is possible to replace the gas, allowing for the creation of a high-purity gas atmosphere in a short time. The pass box can also be vacuum gas replaced, enabling the transfer of items while maintaining the internal atmosphere. Additionally, it is equipped with a sliding table, making it easy to handle items. A power outlet is standardly equipped inside, allowing for the easy introduction of equipment such as balances. There is ample space without waste, making it easy to introduce equipment inside. By connecting to an optional gas circulation purification device, it can be used in an environment with oxygen and moisture concentrations below 1 ppm.

  • Other laboratory equipment and containers
  • Glove box

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