Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 213 items
Hot melt for binding
This is a binding spine adhesive with excellent adhesion. ■□ Unbeatable low price! ■□ Available in cut type and sheet type. ■□ Can be easily cut with scissors, a cutter, or a cutting machine.
Excellent adhesion! We offer an easy-to-use cut type and a cost-effective sheet type.
"J Melt" is a hot melt adhesive for bookbinding that melts with heat. It has excellent adhesive strength and is convenient for self-binding. You can easily bind books using a thermal binding machine, iron, hot plate, etc. We offer a "cut type" that is pre-cut and a "sheet type" that can be easily cut with scissors, a cutter, or a cutting machine. 【Features】 ■ Melts and adheres with heat ■ Easily bind books using a thermal binding machine, iron, hot plate, etc. ■ Available in a convenient cut type and a cost-effective sheet type *For more details, please refer to the related links or feel free to contact us.
A wide range of products suitable for temporary metal bonding and adhesion of PE, PP, and more!
This product is an adhesive for application at 200°C. We offer a wide range of options suitable for bonding soft woods such as particle board and plywood, as well as cardboard, starting with "3738," which is ideal for temporary fixation of other materials. Additionally, we have "7399" and "3748V0," which are well-suited for bonding polyethylene and polypropylene, allowing you to choose according to your application. 【Product Lineup (Excerpt)】 ■3738 ■3747 ■3748 ■3762 ■3764, etc. *For more details, please refer to the PDF document or feel free to contact us.
New hot melt coating device
The new Nino series is designed based on a model that combines the advantages of the BS series and BSU series, featuring a hot melt remaining amount display, a timer that can switch between weekly and daily settings, and an operation delay function, among other convenient features for production lines. Additionally, we have focused on usability in the design and manufacturing process.
A hot melt glue gun that works with any material.
Ample tank capacity. Just open the lid and add the materials to complete the refill.
We will achieve the optimization and acceleration of subsequent operations.
The hot melt glue sticks from Jowat are used for various applications.
Eco-friendly 1-second adhesive for people and the environment.
Would you like to achieve even greater efficiency with hot melt adhesive?
A glue gun that can handle various lines without being limited by materials!
The "MS Series" can dissolve hot melt in pellet and block shapes and apply it with a nozzle suitable for the task. The tank has a large capacity, and materials can be added simply by opening the lid at the top for melting. The amount can be adjusted by the trigger pull, making it compatible with various lines. Temperature adjustment is done at the back of the gun, allowing for temperature settings between 70 and 190°C, suitable for the materials and tasks. [Features] - Large tank capacity - Easy quantity adjustment - Compatible with various lines - Temperature adjustment available *For more details, please refer to the catalog or feel free to contact us.
【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼
Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.
We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.
We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!
Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.
Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.
Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*
Choose tank capacity according to usage conditions! Introducing a low-cost hot melt melter.
The "MK-MELTER" is a hot melt melter that employs a dual gear pump, enabling stable discharge volume control while achieving an astonishingly low price. It uses pneumatic control for hydraulic pressure, allowing the hydraulic pressure to be controlled by the pressure of the air supplied externally. You can choose from five tank capacities: 3L, 5L, 10L, 15L, and 20L, according to the amount of hot melt used. Additionally, it can be used as a standalone unit, and it is designed to allow for pump rotation speed control and heater ON/OFF via external input. 【Features】 ■ Low cost ■ High versatility ■ Optimized design for hot melt molding applications ■ Tank capacity can be selected according to usage conditions *For more details, please refer to the PDF document or feel free to contact us.
